Untitled
Abstract: No abstract text available
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical
|
Original
|
PDF
|
|
4069UB
Abstract: No abstract text available
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical
|
Original
|
PDF
|
74HCU04
4069UB
|
D2080
Abstract: No abstract text available
Text: セラミック発振子（チップ形） チップ形セラミック発振子 （汎用タイプ） Ｐタイプ Ｄタイプ Ｕタイプ Ｌタイプ 2 ~ 13MHz (13.1∼20MHz) (20.1∼30MHz) (30.1∼50MHz) • 特 長 ■ 主な用途 ● セラミックパッケージ構造採用による優れた，はんだ耐
|
Original
|
PDF
|
13MHz)
120MHz)
130MHz)
150MHz)
EFOP3584B5
EFOP4004B5
EFOP8004B5
EFOP1005B5
EFOP1205B5
EFOD1605B5
D2080
|
EFOP3584E5
Abstract: EFOD1605B5 EFOD1695B5 EFOD2005B5 EFOP1005B5 EFOP1205B5 EFOP4004B5 EFOP8004B5
Text: Ceramic Resonators Chip Type &HUDPLF 5HVRQDWRUV &KLS 7\SH )RU *HQHUDO 3XUSRVH 7\SH 7\SH 7\SH 7\SH 3 WR 0+] ' WR 0+] 8 WR 0+] / WR 0+] • Recommended Applications ■ Features ● (QFDVHG LQ FHUDPLF SDFNDJH ● +LJK UHOLDELOLW\ DJDLQVW VROGHULQJ KHDW DQG PHFKDQLFDO
|
Original
|
PDF
|
|
EFOD1605B5
Abstract: EFOD1695B5 EFOD2005B5 EFOP1005B5 EFOP1205B5 EFOP4004B5 EFOP8004B5
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) U (20.1 to 30 MHz) L (30.1 to 50 MHz) • Features ■ Recommended Applications ● Encased in ceramic package ● High reliability against soldering heat and mechanical
|
Original
|
PDF
|
|
EFOJ3385B5
Abstract: EFOJ3385E5 EFOJ4005B5 EFOJ4005E5 EFOL3385B5 EFOL3385E5 EFOL4005B5 EFOL4005E5
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type Ceramic Resonators, Chip Type J&L Type: L (For General Purpose, 30 to 45 MHz Type: J (Built-In Capacitors Type, 30 to 45 MHz • Features • Encased in ceramic package ■ Recommended Applications
|
Original
|
PDF
|
|
OL338
Abstract: No abstract text available
Text: Specify Chip Ceramic Resonators General Purpose 3.2 5.5 5.0 2.7 4.0 3.9 5.5 7.8 1.3 4.4 3.2 4.5 1.2 3.6 1.2 Type P 2.5 3.1 1.6 5.0 1.6 2.7 M 1.6 7.3 M 1.6 Ceramic Resonators M M Type D 1.9 2.5 Type U 1.9 1.9 Type L 3.2 1.9 APPLICATIONS FEATURES Ceramic Encapsulation
|
Original
|
PDF
|
OP3584B5
OP4004B5
OP8004B5
OP1005B5
OP1205B5
605B5
695B5
OD2005B5
OU2405B5
OU2545B5
OL338
|
Untitled
Abstract: No abstract text available
Text: C E R A M I C R E S O N AT O R S EFO SERIES • CERAMIC RESONATORS WHICH REQUIRE EXTERNAL CAPACITORS TO FORM AN OSCILLATOR • 0.5% FREQUENCY TOLERANCE IS IDEAL FOR MICROPROCESSOR CLOCK GENERATION AND TELECOMMUNICATION CARRIER FREQUENCIES • CERAMIC PACKAGE FOR HIGH RELIABILITY AND PROTECTION AGAINST MECHANICAL STRESS
|
Original
|
PDF
|
EFOP3584E5
EFOP4004E5
EFOP8004E5
EFOP1005E5
EFOP1205E5
EFOD1605E5
EFOD1695E5
EFOD2005E5
EFOU2405E5
EFOU2545E5
|
Untitled
Abstract: No abstract text available
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) U (20.1 to 30 MHz) L (30.1 to 50 MHz) • Recommended Applications ■ Features ● Encased in ceramic package ● High reliability against soldering heat and mechanical
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical
|
Original
|
PDF
|
74HCU04
|
EF43
Abstract: Ultrasonic welding generator
Text: Ceramic Resonators Chip Type Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) U (20.1 to 30 MHz) L (30.1 to 50 MHz) • Recommended Applications ■ Features ● Encased in ceramic package ● High reliability against soldering heat and mechanical
|
Original
|
PDF
|
|
