ET-7200B
Abstract: No abstract text available
Text: Chip Attenuators type RCN02 Features 1) Compare with single type 2) Guarantee the attenuation (0.3db, 0.5db) 3) Mounting area 50% less 4) Big reduction for mounting cost (3 times Once) ISO9001- / ISO/TS 16949-approved Rating Item Rated power
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RCN02
ISO9001-
16949-approved
300kHz
R1120A
ET-7200B
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d400 e
Abstract: power Diode 800V 5A
Text: ERC20 5A ( 200V to 800V / 5A ) FAST RECOVERY DIODE Outline drawings, mm 4.5±0.2 Ø3.6+0.2 -0.1 1.32 1 15.0±0.2 6.4 2.7 10.0+0.5 -0 3.7 2 14.0+0-0.5 1.2 0.8±0.2 5.08 0.4+0.2 -0 2.7 Features High voltage by mesa design High reliability JEDEC TO-220AB EIAJ
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ERC20
O-220AB
SC-46
te-04
ERC20
d400 e
power Diode 800V 5A
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Untitled
Abstract: No abstract text available
Text: Compact Chip Resistor Networks MNR04 1005 4 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 3216 (MNR14), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than four 1005 chips (MCR01), and mounting costs are lower.
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MNR04
MNR14)
MCR01)
ISO9001-
R1120A
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Untitled
Abstract: No abstract text available
Text: Compact Chip Resistor Networks MNR02 1005 2 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 1616 (MNR12), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than two 1005 chips (MCR01). Also, the cost of mounting has been reduced.
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MNR02
MNR12)
MCR01)
ISO9001-
R1120A
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JIS B 0401 tolerance
Abstract: JIS B 0401 mnr14
Text: Compact Chip Resistor Networks MNR04 1005 4 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 3216 (MNR14), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than four 1005 chips (MCR01), and mounting costs are lower.
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MNR04
MNR14)
MCR01)
ISO9001-
R1120A
JIS B 0401 tolerance
JIS B 0401
mnr14
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MAX-50M
Abstract: No abstract text available
Text: Compact Chip Resistor Networks MNR02 1005 2 size Features 1) Extremely small and light Area ratio is 60% smaller than that of chip 1616 (MNR12), while weight ratio has been cut 75%. 2) High-density mounting Can be mounted even more densely than two 1005 chips (MCR01). Also, the cost of mounting has been reduced.
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MNR02
MNR12)
MCR01)
ISO9001-
R1120A
MAX-50M
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mnr14
Abstract: Rohm MNR14
Text: Compact Chip Resistor Networks MNR14 06034 size Features 1) Convex electrodes Easy to check the fillet after soldering is finished. 2) Small, light, rectangular 4-chip network Area ratio is 65% smaller than that of MNR34, while weight ratio has been cut 75%.
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MNR14
MNR34,
MCR03)
ISO9001-
R1120A
mnr14
Rohm MNR14
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Untitled
Abstract: No abstract text available
Text: Compact 8-element Chip Resistor Networks MNR15 06035 size Features 1) Suitable for pull-up and pull-down resistors. 2) No direction to be mounted by placing common electrode with symmetry. 3) Convex electrodes Easy to check the fillet after soldering is finished.
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MNR15
0402chips
MCR01)
ISO9001-
R1120A
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Untitled
Abstract: No abstract text available
Text: Compact 8-element Chip Resistor Networks MNR15 06035 size Features 1) Suitable for pull-up and pull-down resistors. 2) No direction to be mounted by placing common electrode with symmetry. 3) Convex electrodes Easy to check the fillet after soldering is finished.
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MNR15
0402chips
MCR01)
ISO9001-
R1120A
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181T2
Abstract: 103 chip resistor Rohm chip network resistor
Text: Compact Chip Resistor Networks MNR12 06032 size Features 1) Convex electrodes Easy to check the fillet after soldering is finished. 2) Small, light, rectangular 2-chip network Area ratio is 65% smaller than that of MNR32, while weight ratio has been cut 75%.
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MNR12
MNR32,
MCR03)
ISO9001-
R1120A
181T2
103 chip resistor Rohm
chip network resistor
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Untitled
Abstract: No abstract text available
Text: Compact Chip Resistor Networks MNR12 06032 size Features 1) Convex electrodes Easy to check the fillet after soldering is finished. 2) Small, light, rectangular 2-chip network Area ratio is 65% smaller than that of MNR32, while weight ratio has been cut 75%.
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MNR12
MNR32,
MCR03)
ISO9001-
R1120A
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ROHM resistor 03015
Abstract: mnr14
Text: MNR32J0ABJ Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.
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MNR32J0ABJ
ISO9001
TS16949
AEC-Q200
R1120A
ROHM resistor 03015
mnr14
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mnr14
Abstract: No abstract text available
Text: MNR35J5RJ Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.
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MNR35J5RJ
ISO9001
TS16949
AEC-Q200
AEC-Q200
R1120A
mnr14
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ROHM resistor 03015
Abstract: ROHM 03015 mnr14
Text: MNR34J5ABJ Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.
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MNR34J5ABJ
ISO9001
TS16949
AEC-Q200
R1120A
ROHM resistor 03015
ROHM 03015
mnr14
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Untitled
Abstract: No abstract text available
Text: Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering. 4) ROHM resistors have obtained ISO9001 / ISO / TS16949 certification.
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ISO9001
TS16949
AEC-Q200
MNR04
MNR12
MNR14
MNR15
MNR18
R1120A
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MNR34
Abstract: mnr14
Text: Chip Resistor Networks MNR Series Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering. 4) ROHM resistors have obtained ISO9001 / ISO / TS16949 certification.
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ISO9001
TS16949
AEC-Q200
R1120A
MNR34
mnr14
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Untitled
Abstract: No abstract text available
Text: MNR14ERAPJ Chip Resistor Networks MNR Series < General Purpose > Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.
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MNR14ERAPJ
ISO9001
TS16949
AEC-Q200
R1120A
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mnr14
Abstract: No abstract text available
Text: MNR12E0APJ Chip Resistor Networks MNR Series < Automotive > Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.
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MNR12E0APJ
ISO9001
TS16949
AEC-Q200
R1120A
mnr14
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MNR18ERAPJ
Abstract: mnr14
Text: MNR18ERAPJ Chip Resistor Networks MNR Series < General Purpose > Features 1 Can be mounted even more densely than chip resistors. 2) Mounting cost can be reduced by less frequency of mounting times. 3) Convex electrodes secures visual inspection of fillets after soldering.
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MNR18ERAPJ
ISO9001
TS16949
AEC-Q200
R1120A
MNR18ERAPJ
mnr14
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sc802
Abstract: No abstract text available
Text: I' SC802-06 i < ' 7 Ÿ 4 *-\r • W i» : Outline Drawings S C H O T T K Y B A R R IE R D IO D E * iS a Ü 135la* Z HW. => (as J~Ï35* 135’ m J 12" 5.1-OJ : Features JEDEC Surface mount device EIAJ • <ftVF Low V F : Marking Super high speed switching.
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SC802-06
135la*
sc802
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Untitled
Abstract: No abstract text available
Text: ESAC93-02 12 a : O u tlin e D ra w in g s LO W LOSS SUPER H IG H SPEED RECTIFIER A : Features JEDEC Low VF SC-65 EIAJ m m m m Super high speed sw itch in g . • T V— Ht t C o n n e c tio n D ia g ra m High reliability.by planer design. i - W - lH 4 - n
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ESAC93-02
SC-65
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ESAC82-004
Abstract: T151 T930 P8-10
Text: ESAC82-004< ioa *>3 ' y h+— K SCHOTTKY BARRIER E • : Outline Drawings *3 6 • o-i Features • 1£Vf JEDEC TO-22QAB EIAJ SC-46 Low V f Super high speed sw itch in g . • TV— iWC ttftrC iS Jiif !Si£ Connection Diagram High reliability by planer design.
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ESAC82-004
O-22QAB
SC-46
500ns
EaTS5S35^
l95t/R89
T151
T930
P8-10
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tlp508
Abstract: JIS-C-5020 JIS C7021 B10 TLP645 JIS-C-5003 JISC5700 TLP573 TLP546G SCR 7704
Text: 9. Reliability 9.1 General In recent years, as the application fields for photo couplers expand, more discussions are being made on reliability. For reliability improvement, it is insufficient to perform strinct process management and to have reliability tests such as life test and environmental tests. It is necessary to
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MIL-STD-883B
L-STD-883B
MIL-STD-883B
tlp508
JIS-C-5020
JIS C7021 B10
TLP645
JIS-C-5003
JISC5700
TLP573
TLP546G
SCR 7704
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BAV23S l31
Abstract: diode 1407
Text: DISCRETE SEMICONDUCTORS BAV23S General purpose double diode Product specification Supersedes data of 1998 Jan 08 Philips Semiconductors 1999 May 05 PHILIPS PHILIPS Philips Semiconductors Product specification General purpose double diode BAV23S FEATURES DESCRIPTION
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BAV23S
BAV23S
SCA64
5002/00/04/pp8
BAV23S l31
diode 1407
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