Iontophoresis
Abstract: ASME-14 HF RFID loop antenna design injection molding military switch automobile drawings Calculator Keypad cheetah wedc reballing membrane key
Text: Electronic Keypads and System Integration About White Electronic Designs Corporation WEDC White Electronic Designs Corporation (NASDAQ: WEDC) provides advanced technology solutions that help our customers leverage the evolution of technology. Each product and service within our diverse
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IED001
Iontophoresis
ASME-14
HF RFID loop antenna design
injection molding
military switch
automobile drawings
Calculator Keypad
cheetah wedc
reballing
membrane key
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Indium tin oxide
Abstract: Indium tin oxide transmission Indium tin oxide index resistivity C-675A EMI gaskets lter
Text: White Electronic Designs Display Systems Division MATERIAL SPECIFICATION INDIUM TIN OXIDE ITO EMI/RFI SHIELDS for PLASTIC DISPLAY FILTERS and WINDOWS White Electronic Designs Indium Tin Oxide (ITO) transparent conductive coating is specifically designed
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"Vacuum Fluorescent Displays"
Abstract: Vacuum Fluorescent Displays n017 Vacuum Fluorescent Display VFD aqua G015 ACRYLIC display vfd lter S005
Text: White Electronic Designs Display Systems Division APPLICATION NOTE VACUUM FLUORESCENT DISPLAYS White Electronic Designs has developed a selection of circular-polarized and non-polarized acrylic lenses in colors that are directly applicable to the light spectrum
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B003/B007)
G004/G015)
G002/G010)
"Vacuum Fluorescent Displays"
Vacuum Fluorescent Displays
n017
Vacuum Fluorescent Display VFD
aqua G015 ACRYLIC
display vfd
lter
S005
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29f040b
Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
Text: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3
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DMD2006F
29f040b
teradyne catalyst
Stacked 4MB Flash and 1MB SRAM
WED3C755E8MC
FLF14
kyocera 128 cqfp
CERAMIC QUAD FLATPACK CQFP
95613
hac 132
BAG PACKAGE TOP MARK tms320c6
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LQ6FW315
Abstract: MIL-STD-810E method 507.3 MIL-STD-810E method 503 850C D99-6F5E2P1B3M0 LC056 RS170 amlcd technology TTL sync video to vga
Text: White Electronic Designs Display Systems Division D99-6F5E2P1B3M0 AMLCD PRODUCT - MODEL LC056 RUGGEDIZED 5.6" DISPLAY HEAD ASSEMBLY w/ BACKLIGHT 320 x 234 OVERVEIW White Electronic Designs' 5.6" sunlight readable display head assembly with backlight is ruggedized for harsh
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D99-6F5E2P1B3M0
LC056
-400C
2000Hz,
91grms
15-30Hz,
30-35Hz,
35-2000Hz,
16grms
LQ6FW315
MIL-STD-810E method 507.3
MIL-STD-810E method 503
850C
D99-6F5E2P1B3M0
LC056
RS170
amlcd technology
TTL sync video to vga
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LQ6FW315
Abstract: amlcd technology pal NTSC tft display RS170 650C 850C D99-516E2P2B2M1 LC050 MIL-STD-81OE right angle 14 pin pcb connector 2mm pitch
Text: D99-516E2P2B2M1 White Electronic Designs Display Systems Division AMLCD PRODUCT - MODEL LC050 Ruggedized 5.0" Display Head Assembly with Backlight 320 x 234 OVERVIEW White Electronic Designs' 5.0" sunlight readable display head assembly with backlight is ruggedized for harsh
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D99-516E2P2B2M1
LC050
-400C
2000Hz,
91grms.
15-30Hz,
30-35Hz
35-2000Hz,
16grms.
LQ6FW315
amlcd technology
pal NTSC tft display
RS170
650C
850C
D99-516E2P2B2M1
LC050
MIL-STD-81OE
right angle 14 pin pcb connector 2mm pitch
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10 awg twh
Abstract: diagram 3 phase heater LCD TV backlight power inverter 650C LC050 RS170
Text: White Electronic Designs Display Systems Division 199-0009-00 AMLCD PRODUCT - MODEL LC050 Ruggedized 5.0" Display Head Assembly 320 x 234 OVERVIEW White Electronic Designs’ 5.0” sunlight readable display head assembly with backlight is ruggedized for harsh
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LC050
-400C
2000Hz,
91grms.
15-30Hz,
30-35Hz
35-2000Hz,
16grms.
Mil-STD-81OE,
10 awg twh
diagram 3 phase heater
LCD TV backlight power inverter
650C
LC050
RS170
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Untitled
Abstract: No abstract text available
Text: ^EDI ELECTRONIC DESIGNS INC. HIGHDiNSITY MEMORY ynw
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80C86
Abstract: Intel 80c86 680C86 82C88 EDH681C86 EDH683C86 EDH686C86 EDH687C86 multibus ARCHITECTURE
Text: 3230114 ELECTRONIC DESIGNS INC 7 IC 00045 0, S ii • & r \ ì ELECTRONIC DESIGNS INC 7 1 D ë | 3S3D114 D0DDQ4S 0 _ T-w-n-\b • ELECTRONIC DESIGNS INC. P a r t N u m b er In c lu d e d EDH681C86 16K bytes SR A M EDH683C86 16K bytes SRAM 8K xl6
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3S3D114
EDH681C86
EDH683C86
EDH686C86
EDH687C86
353D114
680C86
16-bit
80C86
Intel 80c86
82C88
EDH681C86
EDH683C86
EDH686C86
EDH687C86
multibus ARCHITECTURE
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16KX8
Abstract: No abstract text available
Text: Electronic Designs In EDH88H16N-45/55 16K x 8 SRAM NMOS The EDH88H16N 16K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H16N uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH88H16N-45/55
EDH88H16N
EDH88H16N
16KX8
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Untitled
Abstract: No abstract text available
Text: ^EDI ELECTRONIC DESIGNS INC. HIGHDENSITY MEMORY C E R T I F I E D Electronic Designs makes no warranty for the use of the products described in this volume. These specifications are subject to change and are based on design goals and are not guaranteed. The
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OG5/94
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Untitled
Abstract: No abstract text available
Text: Electronic Designs lm EDH88H04N-45/55 4K x 8 SRAM NMOS The EDH88H04N 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04N uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH88H04N-45/55
EDH88H04N
EDH88H04N
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Untitled
Abstract: No abstract text available
Text: Electronic Designs In EDH8808HC-55/70 MILITARY 8K x 8 SRAM CMOS The EDH8808HC 8K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH8808HC uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH8808HC-55/70
EDH8808HC
EDH8808HC
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Untitled
Abstract: No abstract text available
Text: 91d Electronic Designs Inc. EDH81H64C-45/55 64K x 1 SRAM CMOS The EDH81H64C 64K x 1 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH81H64C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH81H64C-45/55
EDH81H64C
EDH81H64C
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6AL7
Abstract: No abstract text available
Text: Electronic Designs Inc. EDH88H04C-45/55 4K x 8 SRAM CMOS The EDH88H04C 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH88H04C-45/55
EDH88H04C
EDH88H04C
A0-A11
UT777Ã
6AL7
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Untitled
Abstract: No abstract text available
Text: Electronic Designs Inc. EDH81H64C-45/55 64K x 1 SRAM CMOS IMMgrUTM The EDH81H64C 64K x 1 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH81H64C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH81H64C-45/55
EDH81H64C
EDH81H64C
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Untitled
Abstract: No abstract text available
Text: Electronic Designs Inc. EDH84H16C-45/55 16K x 4 SRAM CMOS The EDH84H16C 16K x 4 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH84H16C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH84H16C-45/55
EDH84H16C
EDH84H16C
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Untitled
Abstract: No abstract text available
Text: Electronic Designs Inc. EDH84H64C-55/70 64K x 4 SRAM CMOS The EDH84H64C 64K x 4 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH84H64C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH84H64C-55/70
EDH84H64C
EDH84H64C
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Untitled
Abstract: No abstract text available
Text: Electronic Designs Inc. EDH8816C-12/15/20 16K x 8 SRAM CMOS The EDH8816C 16K x 8 uses the advanced Electronic Designs Inc. MEMORY-PACK packaging concept which mounts several LCC memory devices on a single multilayer ceramic substrate. The EDH8816C is part of the EBM-pack
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EDH8816C-12/15/20
EDH8816C
EDH8816C
EDH8816Cis
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Untitled
Abstract: No abstract text available
Text: Electronic Designs In EDH88H16N-45/55 16K x 8 SRAM NMOS The EDH88H16N 16K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H16N uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH88H16N-45/55
EDH88H16N
EDH88H16N
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Untitled
Abstract: No abstract text available
Text: Electronic Designs li EDH88H04C-55/70/1C MILITARY 4K x 8 SRAM CMOS The EDH88H04C 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH88H04C-55/70/1C
EDH88H04C
EDH88H04C
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electronic design package
Abstract: No abstract text available
Text: ELECTRONIC DESIGNS INC. Dear Valued Customer: Electronic Designs, Inc. is an industry leader in the design, manufacture and support of high perform ance M ilitary and Industrial memories. W e are an expert in the integration o f sophisticated packaging and advanced microelectronics technologies for your system ’s
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BS0001
Abstract: BS-0001 INCOMING RAW MATERIAL INSPECTION method centrifuge
Text: m o \ Reliability Program ELECTRONIC DESIGNS IN C . Quality Control Tests and Procedures Electronic Designs, Inc.'s continuing effort to be a leader in providing top quality products has lead us to com plete our m ission to become IS 09001 certified. The certification is the most comprehensive quality
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Hours/80
C/150
EP-00008
TP-00002
QP-00062
TP-00006
EP-00004,
EP-00005
QP-00062
BS0001
BS-0001
INCOMING RAW MATERIAL INSPECTION method
centrifuge
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Untitled
Abstract: No abstract text available
Text: Electronic Designs li EDH88H04C-55/70/1C MILITARY 4K x 8 SRAM CMOS The EDH88H04C 4K x 8 is part of a new family of High Speed Static RAM devices developed by Electronic Designs Inc. The EDH88H04C uses the advanced EDI MEMORYPACK packaging concept which mounts several LCC
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EDH88H04C-55/70/1C
EDH88H04C
EDH88H04C
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