16G nand flash
Abstract: emmc csd emmc mmc EXT_CSD emmc Extended CSD NAND16GAH0D EXT_CSD NUMONYX emmc 3R14 CRC16
Text: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,
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NAND08GAH0A
NAND16GAH0D
16G nand flash
emmc csd
emmc
mmc EXT_CSD
emmc Extended CSD
NAND16GAH0D
EXT_CSD
NUMONYX emmc
3R14
CRC16
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CMD24
Abstract: emmc ball
Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification,
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NAND08GAH0B
CMD24
emmc ball
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NAND08GAH0B
Abstract: emmc csd emmc Initialization CMD24 emmc ball emmc 4.4 standard jedec MultiMediaCard System Specification MultiMediaCard System Specification Version MMCA emmc jedec mechanical standard emmc spi
Text: NAND08GAH0B 1-Gbyte, 1.8 V/3 V supply, NAND flash memories with MultiMediaCard interface Features • Packaged NAND flash memory with MultiMediaCard interface ■ 1 Gbyte of formatted data storage ■ eMMC/MultiMediaCard system specification, compliant with V4.2
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NAND08GAH0B
NAND08GAH0B
emmc csd
emmc Initialization
CMD24
emmc ball
emmc 4.4 standard jedec
MultiMediaCard System Specification
MultiMediaCard System Specification Version MMCA
emmc jedec mechanical standard
emmc spi
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EXT_CSD
Abstract: eMMC emmc 4.5 MultiMediaCard System Specification Version MMCA 16G nand flash CMD60-CMD63 mmc EXT_CSD NAND08GAH0A eMMC 4.4 rca a 8321
Text: NAND08GAH0A NAND16GAH0D 1 Gbyte, 2 Gbyte, 1.8 V/3 V supply, NAND Flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND Flash memory with MultiMediaCard interface ■ 1, 2 Gbytes of formatted data storage ■ eMMC™/MultiMediaCard system
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NAND08GAH0A
NAND16GAH0D
EXT_CSD
eMMC
emmc 4.5
MultiMediaCard System Specification Version MMCA
16G nand flash
CMD60-CMD63
mmc EXT_CSD
NAND08GAH0A
eMMC 4.4
rca a 8321
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KLM8G2FEJA-A001
Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
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8/16/32GB
KLMXGXFEJA-X001
KLM8G2FEJA-A001
KLMAG4FEJA-A001
KLM8G2FEJA
KLMBG8FEJA-A001
KLMAG4FEJA-B001
klm8g
samsung eMMC 4.5
Samsung eMMC 4.41
KLMCGAFEJA-B001
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emmc 5.0
Abstract: numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc
Text: NAND225AQA5P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM
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NAND225AQA5P
LFBGA199
emmc 5.0
numonyx oneNand flash
NUMONYX emmc
samsung eMMC 5.0
eMMC driver
eMMC powerdown
emmc samsung
eMMC
samsung emmc boot
samsung mcp emmc
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eMMC data retention
Abstract: emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0
Text: NAND225AQA9P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM
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NAND225AQA9P
LFBGA199
eMMC data retention
emmc jedec mechanical standard data retention
samsung emmc boot
emmc 5.0
numonyx oneNand flash
Samsung EMMC "boot mode"
samsung eMMC
emmc Initialization
eMMC
samsung eMMC 5.0
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emmc pin
Abstract: 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp
Text: NAND114APA5M 1-Gbit, mux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • ■ ■ MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM
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NAND114APA5M
LFBGA199
emmc pin
221 ball eMMC memory
numonyx oneNand flash
samsung emmc boot
eMMC slc mode
emmc 5.0
samsung eMMC 5.0
emmc boot operation
emmc jedec
Flash Memory SAMSUNG OneNAND mcp
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emmc pin
Abstract: emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH
Text: NAND114AQA5M 1-Gbit, demux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM
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NAND114AQA5M
LFBGA199
emmc pin
emmc 5.0
samsung eMMC 5.0
221 ball eMMC memory
emmc controller
emmc jedec mechanical standard data retention
samsung eMMC
NUMONYX emmc
eMMC slc mode
NAND08GAH
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sandisk emmc 4.5
Abstract: sandisk eMMC 4.41 emmc controller sandisk emmc emmc 4.41 spec emmc spec circuit diagram sandisk 64 mb hitachi eMMC eMMC 4.51 sandisk micro sdhc
Text: TMS320C5535/34/33/32 Ultra-Low Power DSP Technical Reference Manual Literature Number: SPRUH87 August 2011 2 Copyright 2011, Texas Instruments Incorporated SPRUH87 – August 2011 Submit Documentation Feedback Contents . 33
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TMS320C5535/34/33/32
SPRUH87
sandisk emmc 4.5
sandisk eMMC 4.41
emmc controller
sandisk emmc
emmc 4.41 spec
emmc spec
circuit diagram sandisk 64 mb
hitachi eMMC
eMMC 4.51
sandisk micro sdhc
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Manufacturer ID list eMMC
Abstract: emmc 4.41 spec finder type 81.11
Text: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Z2760
Z2760
Manufacturer ID list eMMC
emmc 4.41 spec
finder type 81.11
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Untitled
Abstract: No abstract text available
Text: CONFIDENTIAL ADVANCE INFORMATION Phoenix 3 CD SoC Product Brief Analog Reinvented The Phoenix III CD is an SoC targeted for CD home-theater receivers and mini-components applications. It integrates all required CD AFE/servo, audio and microcontroller MCU functions in a 176-pin Low Profile Quad Flat Pack (LQFP)
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176-pin
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OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
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OMAP5430
SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
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rk3188
Abstract: RK3188-T ARGB888 emmc boot sequence
Text: RK3188Technical Reference ManualRev 1.2 Chapter 1 Introduction RK3188 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates quad-core Cortex-A9 with separately NEONand FPU coprocessor.
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RK3188Technical
RK3188
1080p
60fps,
264/MVC/VP8
30fps,
RK3188-T
ARGB888
emmc boot sequence
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SVID protocol
Abstract: No abstract text available
Text: Agilent Infiniium 9000 H-Series High-Definition Oscilloscopes Data Sheet See Your Signals in HD See Your Signals in HD The high-deinition 9000 H-Series oscilloscope offers up to 12 bits of resolution, which represents 4096 quantization levels, for precision signal viewing. The 9000 H-Series’
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BP-10-29-13)
5991-1520EN
SVID protocol
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beaglebone black
Abstract: KE4CN2H5A-A58 D2516EC4BXGGB NC107 MTFC4GLDEA
Text: A B C D C B A6A A6 1. Changed R46, R47,R48 to 0 ohms. 2. Changed R45 to 22 Ohms. Change was made due to production failures on some boards due to differences in impedances. A5C 5 4 THERE IS NO WARRANTY FOR THIS DESIGN , TO THE EXTENT PERMITTED BY APPLICABLE LAW. EXCEPT WHEN OTHERWISE STATED
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Samsung eMMC 4.51
Abstract: samsung eMMC 4.5
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
Samsung eMMC 4.51
samsung eMMC 4.5
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samsung eMMC 4.5
Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
Samsung eMMC 4.41
lpddr2 emmc
emmc 4.41 spec
emmc 4.5 spec
153 ball eMMC memory
Samsung eMMC 4.51
samsung* lpddr2* pop package
emmc Pin assignment
eMMC 4.4
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samsung eMMC 4.5
Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
eMMC 4.51
Samsung eMMC 4.41
emmc 4.5 spec
Samsung eMMC 4.51
emmc 4.41 spec
eMMC PoP
samsung lpddr2
153 ball eMMC memory 0.8
emmc spec samsung
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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samsung eMMC 4.5
Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
emmc 4.4 standard jedec
Samsung eMMC 4.41
153 ball eMMC memory
emmc 4.5 spec
emmc spec
emmc 4.41 spec
50 50 mfd CAPACITOR
USB_OTG
Samsung eMMC 4.51
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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