JESD84-B451
Abstract: Specification eMMC 4.0
Text: N6465A eMMC Compliance Test Application for Infiniium 9000 Series Oscilloscopes Data Sheet Introduction The Agilent Technologies N6465A eMMC compliance test application provides a fast and easy way to test, debug and characterize your eMMC designs. The tests performed
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N6465A
JESD84-B451
5991-1397EN
Specification eMMC 4.0
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emmc 4.4 standard jedec
Abstract: emmc boot eMMC eMMC 5.0 emmc "boot mode" emmc sector size emmc controller emmc cmd18 emmc pin emmc operation
Text: AN2539 Application note How to boot an embedded system from an eMMC equipped with a Microsoft FAT file system Overview This application note describes a set of solutions used to boot an embedded device from an Embedded MultiMediaCard eMMC™ equipped with a Microsoft File Allocation Table (FAT)
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AN2539
emmc 4.4 standard jedec
emmc boot
eMMC
eMMC 5.0
emmc "boot mode"
emmc sector size
emmc controller
emmc cmd18
emmc pin
emmc operation
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KLM8G2FEJA-A001
Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
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8/16/32GB
KLMXGXFEJA-X001
KLM8G2FEJA-A001
KLMAG4FEJA-A001
KLM8G2FEJA
KLMBG8FEJA-A001
KLMAG4FEJA-B001
klm8g
samsung eMMC 4.5
Samsung eMMC 4.41
KLMCGAFEJA-B001
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TN-29-18
Abstract: TN2918 micron emmc emmc EXT_CSD micron emmc 4.3 eMMC emmc Extended CSD MultiMediaCard System Specification Version MMCA emmc csd emmc boot
Text: TN-29-18: Booting from Embedded MMC Introduction Technical Note Booting from Embedded MMC Introduction MultiMediaCard MMC technology provides low-cost data storage media for many mobile applications. MMC benefits include: • Royalty-free design • Industry-standard interface
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TN-29-18:
09005aef822f5f67
09005aef822f5fbb
tn2918
TN-29-18
micron emmc
emmc EXT_CSD
micron emmc 4.3
eMMC
emmc Extended CSD
MultiMediaCard System Specification Version MMCA
emmc csd
emmc boot
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emmc pcb layout
Abstract: eMMC intel EMMC software eMMC emmc operation emmc Card connector 8051s eMMC memory verilog code image processing filtering MicroTCA Carrier hub
Text: Application Note AC287 MicroTCA Introduction of MicroTCA and Actel Solution Telecommunications computing architecture TCA standards are defined by the PCI Industrial Computer Manufacturers Group (PICMG ). AdvancedTCA (ATCA) is a 2002 PICMG standard that defines an
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AC287
emmc pcb layout
eMMC intel
EMMC software
eMMC
emmc operation
emmc Card connector
8051s
eMMC memory
verilog code image processing filtering
MicroTCA Carrier hub
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eMMC
Abstract: emmc spec samsung eMMC 4.5 emmc 4.5 spec emmc operation emmc Initialization KMCME0000M emmc 5.0 emmc 4.5 emmc spec samsung
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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S19904EJ1V0AN00
CMD42
CMD43
CMD54
CMD55
CMD56
CMD59
eMMC
emmc spec
samsung eMMC 4.5
emmc 4.5 spec
emmc operation
emmc Initialization
KMCME0000M
emmc 5.0
emmc 4.5
emmc spec samsung
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"Manufacturer ID" eMMC
Abstract: emmc EXT_CSD emmc "boot mode" eMMC emmc pin EXT_CSD samsung emmc boot efuse emmc boot Samsung oneNand Mux
Text: Freescale Semiconductor Application Note Document Number: AN3996 Rev. 0, 04/2010 i.MX35 Boot Options by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the different booting options available for the i.MX35 processor. The i.MX35 offers
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AN3996
"Manufacturer ID" eMMC
emmc EXT_CSD
emmc "boot mode"
eMMC
emmc pin
EXT_CSD
samsung emmc boot
efuse
emmc boot
Samsung oneNand Mux
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Toshiba NAND BGA 224
Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.
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P-TFBGA169-1216-0
Toshiba NAND BGA 224
Toshiba emmc
Toshiba BGA 224
toshiba emmc 4.41
4GB eMMC toshiba
THGBM
THGBM3G
emmc jedec
THGBM3G5
THGB
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Toshiba emmc
Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.
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P-TFBGA153-1113-0
Toshiba emmc
THGBM
eMMC data retention
Toshiba NAND BGA 224
THGBM3G4D1FBAIG
BGA 221 eMMC
toshiba
Toshiba emmc performance
THGBM3G
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toshiba emmc
Abstract: 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC
Text: THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB THGBM1GxDxEBAIx Series INTRODUCTION THGBM1GxDxEBAIx series are 1-GB , 2-GB , 4-GB , 8-GB , 16-GB and 32-GB densities of e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip
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16-GB
32-GB
toshiba emmc
153 ball eMMC memory
toshiba 16GB Nand flash emmc
THGBM
MMC04G
toshiba 8GB Nand flash bga
4GB eMMC toshiba
THGBM1G5D2EBAI7
toshiba 8GB Nand flash emmc
"Manufacturer ID" eMMC
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XAM3359AZCZ100
Abstract: No abstract text available
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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d2516ec
Abstract: KE4CN2H5A kingston memory schematic
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley gerald@beagleboard.org Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System
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lpddr4
Abstract: emmc pcb layout
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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rk3188
Abstract: RK3188-T ARGB888 emmc boot sequence
Text: RK3188Technical Reference ManualRev 1.2 Chapter 1 Introduction RK3188 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates quad-core Cortex-A9 with separately NEONand FPU coprocessor.
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RK3188
1080p
60fps,
264/MVC/VP8
30fps,
RK3188-T
ARGB888
emmc boot sequence
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sandisk emmc 4.5
Abstract: sandisk eMMC 4.41 emmc controller sandisk emmc emmc 4.41 spec emmc spec circuit diagram sandisk 64 mb hitachi eMMC eMMC 4.51 sandisk micro sdhc
Text: TMS320C5535/34/33/32 Ultra-Low Power DSP Technical Reference Manual Literature Number: SPRUH87 August 2011 2 Copyright 2011, Texas Instruments Incorporated SPRUH87 – August 2011 Submit Documentation Feedback Contents . 33
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SPRUH87
sandisk emmc 4.5
sandisk eMMC 4.41
emmc controller
sandisk emmc
emmc 4.41 spec
emmc spec
circuit diagram sandisk 64 mb
hitachi eMMC
eMMC 4.51
sandisk micro sdhc
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SDIN7DP2-4G
Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the
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DOC-21163
750-2628-2XX-SCH)
EVM5432
750-2628-213-EBOM)
SDIN7DP2-4G
TWL6037
Sandisk eMMC
OMAP5430
SDIN7DP2
IN248
IN255
SN75LVCP412
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Manufacturer ID list eMMC
Abstract: emmc 4.41 spec finder type 81.11
Text: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Z2760
Z2760
Manufacturer ID list eMMC
emmc 4.41 spec
finder type 81.11
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OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
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SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
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Untitled
Abstract: No abstract text available
Text: Product Brief Intel Edison Intel® Edison Development Platform Introduction The Intel® Edison development platform is designed to lower the barriers to entry for a range of inventors, entrepreneurs, and consumer product designers to rapidly prototype and produce
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STV0900
Abstract: ST40-300 hdmi splitter ic STV6417 STV6440 STV0297 sti7108 st40 Application CPU STV6440 I2C emmc socket
Text: STi7108 Advanced HD AVC decoder with 3D graphics acceleration Data brief Features Description • Open GL ES 2.0/Open VG 1.1 compatible 3D graphics GPU for enhanced EPGs/UIs ■ Dual HD 1080i/720p video decode for PIP or mosaic support STi7108 is the next generation of HD, AVC set-top
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STi7108
STV0900
ST40-300
hdmi splitter ic
STV6417
STV6440
STV0297
st40 Application CPU
STV6440 I2C
emmc socket
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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Samsung eMMC 4.51
Abstract: samsung eMMC 4.5
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
Samsung eMMC 4.51
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samsung eMMC 4.5
Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
Samsung eMMC 4.41
lpddr2 emmc
emmc 4.41 spec
emmc 4.5 spec
153 ball eMMC memory
Samsung eMMC 4.51
samsung* lpddr2* pop package
emmc Pin assignment
eMMC 4.4
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samsung eMMC 4.5
Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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MCIMX50
samsung eMMC 4.5
eMMC 4.51
Samsung eMMC 4.41
emmc 4.5 spec
Samsung eMMC 4.51
emmc 4.41 spec
eMMC PoP
samsung lpddr2
153 ball eMMC memory 0.8
emmc spec samsung
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