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    EMMC PCB LAYOUT NC BALLS Search Results

    EMMC PCB LAYOUT NC BALLS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    EMMC PCB LAYOUT NC BALLS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    XAM3359AZCZ100

    Abstract: No abstract text available
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual


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    lpddr4

    Abstract: emmc pcb layout
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual


    Original     		PDF

    d2516ec

    Abstract: KE4CN2H5A kingston memory schematic
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley gerald@beagleboard.org Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System


    Original     		PDF

    SDIN7DP2-4G

    Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
    Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the


    Original     		PDF OMAP5432 DOC-21163 750-2628-2XX-SCH) EVM5432 750-2628-213-EBOM) SDIN7DP2-4G TWL6037 Sandisk eMMC OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412

    MIPI csi-2 spec

    Abstract: OMAP5432 toshiba emmc 4.4 spec toshiba eMMC DS toshiba 16GB Nand flash emmc 4GB eMMC toshiba ABE 814 toshiba emmc 4.4 emmc pcb layout mipi DSI LCD controller
    Text: Version E EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5432 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.


    Original     		PDF OMAP5432 SWPS051E MIPI csi-2 spec OMAP5432 toshiba emmc 4.4 spec toshiba eMMC DS toshiba 16GB Nand flash emmc 4GB eMMC toshiba ABE 814 toshiba emmc 4.4 emmc pcb layout mipi DSI LCD controller

    lpddr2 spec

    Abstract: tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 5, 12/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD lpddr2 spec tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX

    SCIMX538DZK1C

    Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI

    MCIMX535

    Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV1C MCIMX535DVV mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout

    MCIMX535

    Abstract: emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 6, 03/2013 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX

    SCIMX

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX

    pin vga CRT pinout

    Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


    Original     		PDF IMX53CEC MCIMX53xD MX53xD pin vga CRT pinout samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2

    eMMC "thermal impedance"

    Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


    Original     		PDF IMX53CEC MCIMX53xD MX53xD DDR2/LVDDR2-800, eMMC "thermal impedance" PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16

    SEM32G

    Abstract: sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash
    Text: e.MMC 4.41 I/F Preliminary Data Sheet 80-36-03433 February 2010 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet


    Original     		PDF 25-Feb-10 SEM32G sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash

    imx6sl

    Abstract: JTAG-SM AN439
    Text: Hardware Development Guide for i.MX 6SoloLite Applications Processors IMX6SLHDG Rev 1 06/2013 Contents Paragraph Number Title Page Number Contents Chapter 1 Design Checklist 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Design checklist overview . 1-1


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    sony cmos sensor imx 179

    Abstract: sony cmos sensor imx 174 sony cmos sensor imx 117 sony cmos sensor imx 175 IMX* Sony sony IMX 117 sony IMX 136 sony IMX 179 emmc 4.41 spec sony IMX cmos
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.1, 05/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information


    Original     		PDF MCIMX6LxDVN10xx MCIMX6LxEVN10xx sony cmos sensor imx 179 sony cmos sensor imx 174 sony cmos sensor imx 117 sony cmos sensor imx 175 IMX* Sony sony IMX 117 sony IMX 136 sony IMX 179 emmc 4.41 spec sony IMX cmos

    sony cmos sensor imx 174

    Abstract: sony cmos sensor imx 179
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.2, 08/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information


    Original     		PDF MCIMX6LxDVN10xx MCIMX6LxEVN10xx sony cmos sensor imx 174 sony cmos sensor imx 179

    sony cmos sensor imx 174

    Abstract: Sony imx 174 Sony IMX 145 CMOS
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 3, 04/2014 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information


    Original     		PDF MCIMX6LxDVN10xx MCIMX6LxEVN10xx sony cmos sensor imx 174 Sony imx 174 Sony IMX 145 CMOS

    DIN 74 - Bm5

    Abstract: sandisk eMMC SLIMbus sandisk emmc 4.5 dk 2482 h transistor sandisk eMMC 4.41 OMAP4470 lpddr2 pcb design MIPI CSI design guideline OMAP 4470
    Text: OMAP OMAP4470 Multimedia Device Engineering Sample ES1.0 Version A Data Manual Public Version PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


    Original     		PDF OMAP4470 SWPS048A DIN 74 - Bm5 sandisk eMMC SLIMbus sandisk emmc 4.5 dk 2482 h transistor sandisk eMMC 4.41 OMAP4470 lpddr2 pcb design MIPI CSI design guideline OMAP 4470

    sandisk emmc 4.5

    Abstract: SLIMbus OMAP4 OMAP4460 Sandisk emmc sandisk eMMC 4.41 MIPI csi2 omap4 csi2 toshiba emmc 4.4.1 spec digital microphone slimbus
    Text: OMAP OMAP4460 Multimedia Device Engineering Sample ES1.0 ES1.1 Version A Data Manual Public Version PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


    Original     		PDF OMAP4460 SWPS046A sandisk emmc 4.5 SLIMbus OMAP4 OMAP4460 Sandisk emmc sandisk eMMC 4.41 MIPI csi2 omap4 csi2 toshiba emmc 4.4.1 spec digital microphone slimbus

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MC34709 Rev. 2.0, 10/2012 Power Management Integrated Circuit PMIC for i.MX50/53 Families 34709 The 34709 is the Power Management Integrated Circuit (PMIC) designed primarily for use with the Freescale i.MX50 and i.MX53


    Original     		PDF MC34709 MX50/53 130-pin

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MC34709 Rev. 3.0, 2/2013 Power Management Integrated Circuit PMIC for i.MX50/53 Families 34709 The 34709 is the Power Management Integrated Circuit (PMIC) designed primarily for use with the Freescale i.MX50 and i.MX53


    Original     		PDF MC34709 MX50/53 130-pin

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MC34709 Rev. 4.0, 11/2013 Power Management Integrated Circuit PMIC for i.MX50/53 Families 34709 The 34709 is the Power Management Integrated Circuit (PMIC) designed primarily for use with the Freescale i.MX50 and i.MX53


    Original     		PDF MC34709 MX50/53 130-pin

    7536-1 voltage regulator

    Abstract: diode l6 metal case REGULATOR IC 7812 pin diagram schematic diagram OF IR TOUCH screen PLATE lpddr2 pcb layout h528 7812 voltage regulator PIN diagram REGULATOR IC 7812 functional block diagram CodeTEST REGULATOR IC 7812 pin diagram
    Text: Freescale Semiconductor Advance Information Document Number: MC34709 Rev. 2.0, 10/2012 Power Management Integrated Circuit PMIC for i.MX50/53 Families 34709 The 34709 is the Power Management Integrated Circuit (PMIC) designed primarily for use with the Freescale i.MX50 and i.MX53


    Original     		PDF MC34709 MX50/53 130-pin 7536-1 voltage regulator diode l6 metal case REGULATOR IC 7812 pin diagram schematic diagram OF IR TOUCH screen PLATE lpddr2 pcb layout h528 7812 voltage regulator PIN diagram REGULATOR IC 7812 functional block diagram CodeTEST REGULATOR IC 7812 pin diagram

    schematic diagram OF IR TOUCH screen PLATE

    Abstract: 7536-1 voltage regulator 34709E MC34709 diode l6 sw348 7812 switching regulator Coin based mobile battery charger circuit diagram ambulance
    Text: Freescale Semiconductor Product Preview Document Number: MC34709 Rev. 1.0, 8/2012 Power Management Integrated Circuit PMIC for i.MX50/53 Families 34709 The 34709 is the Power Management Integrated Circuit (PMIC) designed primarily for use with the Freescale i.MX50 and i.MX53


    Original     		PDF MC34709 MX50/53 MC34708, 130-pin schematic diagram OF IR TOUCH screen PLATE 7536-1 voltage regulator 34709E diode l6 sw348 7812 switching regulator Coin based mobile battery charger circuit diagram ambulance