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    EMP8 PACKAGE DIMENSION Search Results

    EMP8 PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    EMP8 PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    emp8 Package

    Abstract: emp8 Package dimension EMP8
    Text: PACKAGE DIMENSIONS EMP8 0 ~ 10º 5.0±0.3 0.8±0.2 3.9±0.2 6.0±0.4 5 8 4 1 1.27 +0.1 0.20 -0.05 0.15±0.1 1.5±0.15 0.74MAX 0.1 0.4±0.1 0.12 M UNIT : mm


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    PDF 74MAX emp8 Package emp8 Package dimension EMP8

    4558D

    Abstract: 4556 op-amp IC 4558 surround sound circuit REGULATOR IC l7812cv TDA2822M SMD TYPE circuit inter CV 203 NE555N IC AUDIO FILTER NJM2060 "cross reference" IC L7912CV MC34063P1
    Text: NJR CORPORATION Product Reference Overview SEMICONDUCTORS LINEAR RF & WIRELESS PACKAGING 27 PART NUMBER SYSTEMS 33 CROSS REFERENCE 35 AUDIO ICs 8 COMMUNICATION ICs 9 VIDEO ICs 10 CMOS SWITCH 11 MCU & PERIPHERAL 13 LCD DRIVER 15 LSI/OTHER 16 SPECIAL FUNCTIONS


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    PDF O-220F O-220 O-252 4558D 4556 op-amp IC 4558 surround sound circuit REGULATOR IC l7812cv TDA2822M SMD TYPE circuit inter CV 203 NE555N IC AUDIO FILTER NJM2060 "cross reference" IC L7912CV MC34063P1

    AUDIO DELAY CIRCUIT DIAGRAM

    Abstract: 21ms audio delay AUDIO interface CIRCUIT DIAGRAM
    Text: NJU26901 Digital Audio Delay Package General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 NJU26901M FEATURES • 2-Channel Audio Delay 24 bits data width .


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    PDF NJU26901 NJU26901 NJU26901E2 NJU26901M 85msec 48kHz 128msec 32kHz 43msec AUDIO DELAY CIRCUIT DIAGRAM 21ms audio delay AUDIO interface CIRCUIT DIAGRAM

    AUDIO DELAY CIRCUIT DIAGRAM

    Abstract: No abstract text available
    Text: NJU26901 Digital Audio Delay n Package n General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 n FEATURES • 2-Channel Audio Delay 24 bits data width . Delay Time 85msec at fs = 48kHz ( 128msec at fs = 32kHz , 43msec at fs = 96kHz)


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    PDF NJU26901 NJU26901 NJU26901E2 85msec 48kHz 128msec 32kHz 43msec 96kHz) AUDIO DELAY CIRCUIT DIAGRAM

    AUDIO DELAY CIRCUIT DIAGRAM

    Abstract: analog audio delay delaytime 69mS NJU26901 NJU26901E2 audio delay AUDIO interface CIRCUIT DIAGRAM
    Text: NJU26901 Digital Audio Delay ! Package ! General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 ! FEATURES • 2-Channel Audio Delay 24 bits data width . Delay Time 85msec at fs = 48kHz ( 128msec at fs = 32kHz , 43msec at fs = 96kHz)


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    PDF NJU26901 NJU26901 NJU26901E2 85msec 48kHz 128msec 32kHz 43msec 96kHz) AUDIO DELAY CIRCUIT DIAGRAM analog audio delay delaytime 69mS NJU26901E2 audio delay AUDIO interface CIRCUIT DIAGRAM

    AUDIO DELAY CIRCUIT DIAGRAM

    Abstract: No abstract text available
    Text: NJU26901 Digital Audio Delay Package General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 NJU26901M FEATURES • 2-Channel Audio Delay 24 bits data width .


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    PDF NJU26901 NJU26901 NJU26901E2 NJU26901M 85msec 48kHz 128msec 32kHz 43msec AUDIO DELAY CIRCUIT DIAGRAM

    AUDIO DELAY CIRCUIT DIAGRAM

    Abstract: No abstract text available
    Text: NJU26901 Digital Audio Delay ! Package ! General Description The NJU26901 is a digital audio delay. The NJU26901 provides delay-time adjustment function and digital audio interface. NJU26901E2 ! FEATURES • 2-Channel Audio Delay 24 bits data width . Delay Time 85msec at fs = 48kHz ( 128msec at fs = 32kHz , 43msec at fs = 96kHz)


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    PDF NJU26901 NJU26901 NJU26901E2 85msec 48kHz 128msec 32kHz 43msec 96kHz) AUDIO DELAY CIRCUIT DIAGRAM

    QFP80

    Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32

    DIP18 package

    Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20


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    PDF DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP40 DIP18 package SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225

    SOP18 EIAJ

    Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 SOP18 EIAJ QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ

    QFP80

    Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013

    DIP18

    Abstract: DIP20 DIP40
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP18 DIP20 DIP40

    emp8 Package dimension

    Abstract: TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16
    Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by


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    PDF OT23-5 OT23-6 SC88A SC82AB emp8 Package dimension TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16

    SSOP14 pcb

    Abstract: dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


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    PDF BCC32 SSOP14 pcb dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3

    EMP24-E3

    Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


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    PDF O-252 EMP24-E3 EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


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    PDF BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2

    DMP8 pcb pattern

    Abstract: BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


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    PDF BCC32 BCC36 PCSP20-CC DMP8 pcb pattern BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2

    SS0P24

    Abstract: SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1
    Text: csa RECOMMENDED MOUNTING METHOD A • RECONENDED MOUNTING METHOD 1.Solderins Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92


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    PDF T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24 SS0P24 SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1

    DIP24B

    Abstract: No abstract text available
    Text: •c > " m 'v ° !W 'ndB6 í*N c h o i co c > c c c > 0.51MIN c f i s PACKAGE DIMENSIONS DIP16 B 0 .7 6 M A X 7.62 t t A A A A A A Í 0 -1 5 “ U n itrm m DIP18 18 10 2 .4 9 M A X 5 2-4 Ñ W = ¿ s Nw^apa*RadioCoJM. Il­ ioI Oí s PACKAGE DIMENSIONS DIP24


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    PDF 51MIN DIP16 DIP18 DIP24 NJU9702. DIP40 SDIP22 SDIP24 QFP80-CKD QFP80-CK2) DIP24B

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE CODE • PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24


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    PDF DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP40 SDIP22 SDIP24 SDIP28

    DIP20

    Abstract: No abstract text available
    Text: PACKAGE CODE TABLE • PACKAGE COPE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18


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    PDF DIP008-P-0300 OP008-P-0225 DIP14 DIP014-P-0300 OP018-P-0300 6-P-0300 OP020-P-0300 8-P-0300 OP022-P-0300 DIP20 DIP20

    1P040

    Abstract: 0FP100
    Text: PACKAGE CODE • PACKAGE GODE TABLE NJRC vs. EIAJ GODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24


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    PDF DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP40 SDIP22 SDIP24 SDIP28 1P040 0FP100

    DIP18

    Abstract: EIAJ SC67 EIAJ
    Text: PACKAGE CODE TABLE » PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE NJRC CODE EIAJ CODE <DIP> <S0P> DIP8


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    PDF P008-P-0300 S0P008-P-0225 DIP14 DIP014-Pâ S0P18 S0P018-P-0300 DIP16 DIP016-Pâ OP020-P-0300 DIP18 DIP18 EIAJ SC67 EIAJ

    Untitled

    Abstract: No abstract text available
    Text: RECOMMENDED MOUNTING METHOD • RECONENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG REFLOW


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    PDF T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24