enamelled copper wire swg table
Abstract: swg copper wire 25 32 BS4520 27 swg enamelled copper wire sWG 24 copper wire swg copper wire 32 21 swg enamelled copper wire 49 swg enamelled copper wire 10 swg enamelled copper wire swg table copper wire swg table
Text: Copper Enamelled Wire Specifications: Coating Primary Insulation Material Primary Insulation Colour Maximum Operating Temperature Melting Temperature Approval Bodies : Polyurethane. : Polyurethane. : Transparent. : 120°C. : 480°C. : BS4520. Specification Table
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BS4520.
enamelled copper wire swg table
swg copper wire 25 32
BS4520
27 swg enamelled copper wire
sWG 24 copper wire
swg copper wire 32
21 swg enamelled copper wire
49 swg enamelled copper wire
10 swg enamelled copper wire swg table
copper wire swg table
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PDF
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Untitled
Abstract: No abstract text available
Text: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide
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HM79-103R3LF
HM79-20220LF
HM79-60331LF
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PDF
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bu 25200
Abstract: bn 033 AA0307 AA0512 axial inductor AA051 R22MS bu+25200
Text: Untitled Document AXIAL INDUCTOR AA0307 SERIES Configuration & Dimension: m/m Series AA0307 A 3.0 B +0 7.5 +0 C(ref.) W•• 61.0 0.05 Schematic Diagram: Materials: a. Core : Ferrite DR core b. Wire : Enamelled copper wire c. Lead : Tinned copper wire d. Coating : Epoxy resin
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AA0307
AA0307
/abc-7/aa0307/Untitled
20Document
files/ALA0307-b
AA0410
/AA0512
bu 25200
bn 033
AA0512
axial inductor
AA051
R22MS
bu+25200
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PDF
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Untitled
Abstract: No abstract text available
Text: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-208R0VLF
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PDF
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Untitled
Abstract: No abstract text available
Text: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-001R6VLF
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PDF
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enamelled copper wire
Abstract: 0.75mm2 ferrite winding copper wire datasheet for temperature ring ferrite core F1755 Copper wire to inductors F1753 curve
Text: F1753 - F1755 General Data Vishay Roederstein Suppression Inductors, Ring Core Inductors REFERENCE STANDARDS: VDE 0565 part 2 EN 60068-1 CORE MATERIAL: Ferrite WINDING: Enamelled copper wire CuL insulated against core COATING: Plastic can, epoxy resin sealed
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F1753
F1755
75mm2
500V/2
30-Jul-02
enamelled copper wire
0.75mm2
ferrite winding
copper wire datasheet for temperature
ring ferrite core
Copper wire to inductors
curve
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PDF
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Untitled
Abstract: No abstract text available
Text: HM53-101R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-101R6VLF
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PDF
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Untitled
Abstract: No abstract text available
Text: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition
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HM79S-63470LF
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PDF
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM13560S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] 1 Core Iron Core 2.86 Materials Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire
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PM13560S
05-December-2006
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PDF
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Untitled
Abstract: No abstract text available
Text: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-30150HLF
0200hane
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PDF
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Untitled
Abstract: No abstract text available
Text: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g
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HM78-10150LF
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PDF
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MATERIAL DECLARATION inductor
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM12639S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.05 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire
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PM12639S
05-December-2006
MATERIAL DECLARATION inductor
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PDF
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MATERIAL DECLARATION SHEET inductor
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM7232S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 0.365 Iron Other 2 3 4 Solder Wire Adhesive Bar Solder Enamelled Copper Wire
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PM7232S
05-December-2006
DECLA07
MATERIAL DECLARATION SHEET inductor
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PDF
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Untitled
Abstract: No abstract text available
Text: HM53-60130HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-60130HLF
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PDF
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM13656S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 3.05 Iron Other 2 3 4 Solder Wire Bar Solder 0.02 Enamelled Copper Wire
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PM13656S
05-December-2006
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PDF
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM12651S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.45 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire
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PM12651S
05-December-2006
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PDF
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"Material Declaration Sheet"
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM13666S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 3.25 Iron Other 2 3 4 Solder Wire Bar Solder 0.02 Enamelled Copper Wire
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Original
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PM13666S
05-December-2006
"Material Declaration Sheet"
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PDF
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material PM12645S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.15 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire
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Original
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PM12645S
05-December-2006
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PDF
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Untitled
Abstract: No abstract text available
Text: HM53-50370HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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Original
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HM53-50370HLF
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PDF
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Untitled
Abstract: No abstract text available
Text: HM56-10100R15LF summary material content, BI Technologies Corporation Index Item Material Name FS2 1 CORE M25 2 3 4 5 ADHESIVE Epoxy Resin COIL Enamelled Copper Magnet Wire SOLDER TAPE Lead Free Solder Tape # 1H860 Element Composition Iron Oxide Nickel Oxide
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HM56-10100R15LF
1H860
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PDF
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Untitled
Abstract: No abstract text available
Text: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others
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HM100-251R0LF
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PDF
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Untitled
Abstract: No abstract text available
Text: F1750_ VISHAY Vishay Roederstein Suppression Inductors, VHF Inductors REFERENCE STANDARDS: VDE 0565 part 2 EN 60068-1 - 1- - 25+1 : - © u . | j 4*- 25+10 - CORE MATERIAL: Ferrite f © WINDING: Enamelled copper wire CuL or copper wire tinned
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OCR Scan
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F1750_
F1750-017-110*
F1750-017-111*
F1750-003-013
F1750-003-015
F1750-007-112
F1750-007-118
F1750-026-112
F1750-026-118
F1750-012-112
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PDF
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Untitled
Abstract: No abstract text available
Text: F1753 - F1755 General Data VISHAY Vishay Roederstein Suppression Inductors, Ring Core Inductors REFERENCE STANDARDS: VDE 0565 part 2 EN 60068-1 CORE MATERIAL: Ferrite WINDING: Enamelled copper wire CuL insulated against core COATING: Plastic can, epoxy resin sealed
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OCR Scan
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F1753
F1755
75mm2
02-0ct-00
F1753
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PDF
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Untitled
Abstract: No abstract text available
Text: _ IDC- VISHAY ▼ Vishay Dale High Current, Surface Mount Inductor FEATURES • High energy storage. • Low resistance. • Tape and reel packaging for automatic handling. M A T E R IA L S Core: Ferrite. Wire: Enamelled copper wire.
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OCR Scan
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1000pH,
IDC-7328
28-Aug-02
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PDF
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