Untitled
Abstract: No abstract text available
Text: AT-BUS Prototyping Board Stock No. RE 429 EP - Epoxy fibre-glass reinforced laminated FR4 1.50 mm double-sided 35 |jm CU - Plated through-holes HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido
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OCR Scan
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PDF
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Untitled
Abstract: No abstract text available
Text: Epoxy glass cloth base laminated FR4 5.10 RATING ,5 .9 0 ^ °10 DATE CODE EPOXY SEAL « mm CO a d a d co MM MM TT TT 0.76+.o.oo 0.76+gi1 - 0.00 5.08 10.16 14.35 P.C. MOUNTING 6 .0 5 _ ▲ ID csi SWITCH FUNCTION + 3 POS. 1 T2 Model No. 1 01.09 & POS. 2 4
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OCR Scan
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20mOhm
UL94V-0)
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PDF
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433.92 Mhz oscillator 12v
Abstract: mipot 433.92 43402 tip1220
Text: 433.92 MHZ - AM TRANSMUTER 12V VERSION Description: Highlights: Applications: p. n. 3-2000267 AM Transmitter Module, manufactured in SMT technology on glass-epoxy laminate developed for fixed systems applications. Stand-by supply current lower than 0.1 joA.
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OCR Scan
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prETS300
12Vdc
433.92 Mhz oscillator 12v
mipot 433.92
43402
tip1220
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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Original
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518-77-NNNMXX-XXX106
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: High Power Chipled EOC20IRH 100 AG Preliminary Data Chip-LED Features - Circuit substrate-glass laminated epoxy - Directive characteristic 110° - Dimension: 3.2 L x 2.8 (W) x 1,6 (H) mm3 - Soldering pads: gold plated, all soldering methods applicable - Infrared GaAlAs (870nm)
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EOC20IRH
870nm)
EN60825)
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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Original
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558-10-NNNMXX-XXX104
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: NEW Dialight Surface Mount LED Right Angle Type Package 597-2xx1-4xx SUBSTRATE GLASS FIBER LAMINATE CLEAR EPOXY LENS LED DIE ANODE LUMINOUS DIRECTION 3.0 [.118] .88 [.035] 2.0 [.079] 2X .30 [.012] 1.00 [.039] MECHANICAL SOLDERING REINFORCEMENT PAD COLOR
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Original
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597-2xx1-4xx
597-2111-4xx
597-2201-4xx
597-2311-4xx
597-2401-4xx
MIL-STD-202E,
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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Original
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558-10-NNNMXX-XXX101
CuZn36Pb3
C36000)
26x26
CH-2800
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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Original
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550-10-NNNMXX-XXX152
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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PDF
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CAT 7114
Abstract: SE12XC09
Text: TERMINAL & COMPONENT BOARDS COMPONENT CARRIERS Designed for mounting discrete components such as resistors, capacitors, diodes and other electronic components. Carriers plug directly into panel boards or sockets. FEATURES •VARIETY • FLAME RETARDANT EPOXY GLASS BASE
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OCR Scan
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MS27249-1E1
MS27249-1E2
MS27249-1E3
MS27249-1E4
MS27249-1E5
MS27249-2E1
MS27249-2E2
MS27249-2E3
MS27249-2E4
MS27249-2E5
CAT 7114
SE12XC09
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PDF
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Untitled
Abstract: No abstract text available
Text: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-180 Series Size 0805 Low Profile SMT LEDs DESCRIPTION AND FEATURES Features •Circuit substrate-glass laminated epoxy
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OLS-180
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PDF
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Epoxy, glass laminate
Abstract: No abstract text available
Text: Multiadapter RE1070 - Glass reinforced epoxy laminate FR4 0.80 mm one-sided 35 µm CU<br><br>- 12 self-adhesive strips in pitch 0.50 mm<br>- scribed predetermined breaking point<br>- Surface area made from Au<br><br> - Size 90 x 100 mm
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RE1070
Epoxy, glass laminate
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PDF
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Untitled
Abstract: No abstract text available
Text: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-130 Series Size 1206 Duplex SMT LEDs DESCRIPTION AND FEATURES Features •Circuit substrate-glass laminated epoxy
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OLS-130
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PDF
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"Vibration Sensor"
Abstract: VIBRATION SENSOR Micro Sensor mvs-0608 VIBRATION SWITCH "Vibration switch" corrosion sensor VIBRATION SENSOR, vibrations sensor D-76133
Text: Data Sheet Micro Vibration Sensor MVS 0608.02 omnidirectional Version: V 2.0 The ball bridges two contacts reducing the resistance between the two external connection pads from several mega ohms (>30MOhm) to below 100 ohms. Material Package PCB laminate material (FR4, epoxy glass
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30MOhm)
300Hz,
500Hz;
500Hz,
D-76133
"Vibration Sensor"
VIBRATION SENSOR
Micro Sensor
mvs-0608
VIBRATION SWITCH
"Vibration switch"
corrosion sensor
VIBRATION SENSOR,
vibrations sensor
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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Original
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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Preci-Dip
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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Original
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
20x20
CH-2800
Preci-Dip
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PDF
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O
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Original
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518-77-NNNMXX-XXX105
CuZn36Pb3
C36000)
C17200)
CH-2800
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PDF
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FR4 epoxy dielectric constant 4.2
Abstract: panasonic r1551 FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.6 prepreg 1037 r1566 FR4 dielectric constant 4.4 thickness 1.6 R1551 epoxy prepreg panasonic FR4 dielectric constant 4.3
Text: Data Sheet Halogen-free Glass Epoxy Multi-layer Materials Laminate R-1566 W Prepreg R-1551(W) UL/ANSI FR-4 Primary:/127 IPC-4101 Slash Sheet Secondary:/92 /93 /94(*) /95(*) /122 /125(*) /128(*) (*)；Tg measurement is limited to DMA method for Slash Sheet
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Original
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R-1566
R-1551
IPC-4101
TM-650
FR4 epoxy dielectric constant 4.2
panasonic r1551
FR4 epoxy dielectric constant 4.4
FR4 dielectric constant 4.6
prepreg 1037
r1566
FR4 dielectric constant 4.4 thickness 1.6
R1551
epoxy prepreg panasonic
FR4 dielectric constant 4.3
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PDF
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Untitled
Abstract: No abstract text available
Text: AG Luitpoldstr. 6 D-85276 Pfaffenhofen EOM32 - White Series Standard LED – white - Size 1206 - Features 3 Size 1206 - 3,2 L x 1,6(W) x 1,2(H) mm Directive characteristic 150° Circuit substrate-glass laminated epoxy Soldering pads: gold plated, all soldering methods applicable
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Original
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D-85276
EOM32
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PDF
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Untitled
Abstract: No abstract text available
Text: FEATURES • Circuit substrate-glass laminated epoxy • Size 1206:3.2 L x 1.6 (W) x 1.2(H) mm • Soldering pads: gold plated, all soldering methods applicable • HY, HD (AllnGaP) high luminous intensity types • Taped in 8 mm-blister tape, cathode marking to
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OCR Scan
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OLS-156R
OLS-156SD
OLS-156SR
OLS-156UH
OLS-156G
OLS-156Y
OLS-156D
OLS-156HY
OLS-156HD
OLS-156HR
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PDF
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fr4 94v0
Abstract: 12X12 nema 23 NEMA FR-4
Text: Vectorbord: 12X12WE Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12WE 12.0" W x 12.0 " L .No Holes.FR-4 Epoxy Glass .UNCLAD PCB SHEET MATERIAL Dimension 12" X 12" Square Sheets of FR-4 PCB laminate with NO COPPER
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Original
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12X12WE
P13949
com/Product/Vectorbord/12X12WE
fr4 94v0
12X12
nema 23
NEMA FR-4
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PDF
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150HY
Abstract: No abstract text available
Text: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-150 Series Size 1206 Standard SMT LEDs DESCRIPTION AND FEATURES 1.20 1.60 0.40 2.00 3.20 Features •Circuit substrate-glass laminated epoxy
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Original
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OLS-150
150HY
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PDF
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Untitled
Abstract: No abstract text available
Text: Surface Mount LED Right Angle Type Package SUBSTRATE GLASS FIBER LAMINATE 597-2xx1-4xx PART NO.* 597-2002-4xx 597-2111-4xx 597-2201-4xx 597-2212-4xx 597-2222-4xx 597-2311-4xx 597-2401-4xx ANODE CLEAR EPOXY LENS MECHANICAL SOLDERING REINFORCEMENT PAD .88
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Original
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597-2xx1-4xx
597-2002-4xx
597-2111-4xx
597-2201-4xx
597-2212-4xx
597-2222-4xx
597-2311-4xx
597-2401-4xx
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PDF
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cem-1 94v-0
Abstract: CEM-1 pcb
Text: Vectorbord: 12X12C1 Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12C1 12.0" W x 12.0 " L .No Holes.CEM-1 Epoxy Glass COMPOSITE. .COPPER-CLAD 1 SID PCB Sheet Material Dimension 12" X 12" Square Sheets of CEM-1 PCB laminate
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Original
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12X12C1
com/Product/Vectorbord/12X12C1
cem-1 94v-0
CEM-1 pcb
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PDF
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