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    EXTERNAL LEAD FINISH Search Results

    EXTERNAL LEAD FINISH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    EXTERNAL LEAD FINISH Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES National Semiconductor External Lead Finish for Hermetic Packages Original PDF
    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES National Semiconductor External Lead Finish for Plastic Packages Original PDF

    EXTERNAL LEAD FINISH Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

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    Abstract: No abstract text available
    Text: External Lead Finish for Plastic Packages For plastic packages, National Semiconductor offers two primary lead finishes: solder plate and solder dip. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish


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    PDF

    ceramic pin grid array package lead finish gold

    Abstract: 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip
    Text: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The


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    Mil-M-38510. ceramic pin grid array package lead finish gold 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip PDF

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    Abstract: No abstract text available
    Text: MN101C29D Type MN101C29D ROM x× 8-bit 64 K RAM (×× 8-bit) 1.5 K Package Minimum Instruction Execution Time LQFP080-P-1414A *Lead-free 0.10 µs (at 4.5 V to 5.5 V, 20 MHz) Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • External 5


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    MN101C29D MN101C29D LQFP080-P-1414A MAD00031EEM PDF

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    Abstract: No abstract text available
    Text: MN101C38A , MN101C38C Type MN101C38A MN101C38C 32 K 48 K 1.5 K 2K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free Minimum Instruction Execution Time


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    MN101C38A MN101C38C QFP100-P-1818B LQFP100-P-1414 PDF

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    Abstract: No abstract text available
    Text: MN101C485 , MN101C487 Type MN101C485 MN101C487 8K 16 K 0.5 K 0.5 K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package LQFP064-P-1414 *Lead-free, TQFP064-P-1010B *Lead-free Minimum Instruction Execution Time


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    MN101C485 MN101C487 MN101C485 MN101C487 LQFP064-P-1414 TQFP064-P-1010B PX-ICE101C PX-PRB101C48-TQFP064-P-1010B PX-PRB101C48-LQFP064-P-1414 PDF

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    Abstract: No abstract text available
    Text: MN101C38A , MN101C38C Type MN101C38A MN101C38C 32 K 48 K 1.5 K 2K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free Minimum Instruction Execution Time


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    MN101C38A MN101C38C MN101C38A MN101C38C QFP100-P-1818B LQFP100-P-1414 PX-ICE101C PX-PRB101C38-QFP100-P-1818B PDF

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    Abstract: No abstract text available
    Text: MN101C38A , MN101C38C Type MN101C38A MN101C38C 32 K 48 K 1.5 K 2K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free Minimum Instruction Execution Time


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    MN101C38A MN101C38C QFP100-P-1818B LQFP100-P-1414 PDF

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    Abstract: No abstract text available
    Text: MN101C485 , MN101C487 Type MN101C485 MN101C487 8K 16 K 0.5 K 0.5 K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package LQFP064-P-1414 *Lead-free, TQFP064-P-1010B *Lead-free Minimum Instruction Execution Time


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    MN101C485 MN101C487 LQFP064-P-1414 TQFP064-P-1010B SEG15 SEG14 SEG13 SEG12 PDF

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    Abstract: No abstract text available
    Text: MN101C309 , MN101C30A Type ROM x× 8-bit MN101C309 MN101C30A 24 K 32 K 1K 1.5 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package (Conventional Package) LQFP064-P-1414 *Lead-free, SDIP064-P-0750C *Lead-free (under planning)


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    MN101C309 MN101C30A MN101C309 MN101C30A LQFP064-P-1414 SDIP064-P-0750C SDIP064-P-0750) PDF

    LQFP064-P-1414

    Abstract: MN101C309 MN101C30A MN101CP30ABL
    Text: MN101C309 , MN101C30A Type ROM x× 8-bit MN101C309 MN101C30A 24 K 32 K 1K 1.5 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package (Conventional Package) LQFP064-P-1414 *Lead-free, SDIP064-P-0750C *Lead-free (under planning)


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    MN101C309 MN101C30A LQFP064-P-1414 SDIP064-P-0750C SDIP064-P-0750) LQFP064-P-1414 MN101C309 MN101C30A MN101CP30ABL PDF

    mn101c487

    Abstract: LQFP064-P-1414 MN101C485
    Text: MN101C485 , MN101C487 Type MN101C485 MN101C487 8K 16 K 0.5 K 0.5 K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package LQFP064-P-1414 *Lead-free, TQFP064-P-1010B *Lead-free Minimum Instruction Execution Time


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    MN101C485 MN101C487 LQFP064-P-1414 TQFP064-P-1010B mn101c487 LQFP064-P-1414 MN101C485 PDF

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    Abstract: No abstract text available
    Text: MN101C38A , MN101C38C Type MN101C38A MN101C38C 32 K 48 K 1.5 K 2K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free Minimum Instruction Execution Time


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    MN101C38A MN101C38C MN101C38A MN101C38C QFP100-P-1818B LQFP100-P-1414 PX-ICE101C PX-PRB101C38-QFP100-P-1818B PDF

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    Abstract: No abstract text available
    Text: MN101C485 , MN101C487 Type MN101C485 MN101C487 8K 16 K 0.5 K 0.5 K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package LQFP064-P-1414 *Lead-free, TQFP064-P-1010B *Lead-free Minimum Instruction Execution Time


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    MN101C485 MN101C487 MN101C485 MN101C487 LQFP064-P-1414 TQFP064-P-1010B PX-ICE101C PX-PRB101C48-TQFP064-P-1010B PX-PRB101C48-LQFP064-P-1414 PDF

    MN101C38A

    Abstract: MN101C38C QFP100-P-1818B
    Text: MN101C38A , MN101C38C Type MN101C38A MN101C38C 32 K 48 K 1.5 K 2K ROM x× 8-bit External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free Minimum Instruction Execution Time


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    MN101C38A MN101C38C QFP100-P-1818B LQFP100-P-1414 MN101C38A MN101C38C QFP100-P-1818B PDF

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    Abstract: No abstract text available
    Text: MN101C49G , MN101C49H , MN101C49K Type ROM x× 8-bit MN101C49G MN101C49H MN101C49K 128 K 160 K 224 K 4K 6K 10 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free


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    MN101C49G MN101C49H MN101C49K MN101C49G MN101C49H MN101C49K QFP100-P-1818B LQFP100-P-1414 PX-ICE101C PX-PRB101C49-QFP100-P-1818B PDF

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    Abstract: No abstract text available
    Text: MN101C49G , MN101C49H , MN101C49K Type ROM x× 8-bit MN101C49G MN101C49H MN101C49K 128 K 160 K 224 K 4K 6K 10 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free


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    MN101C49G MN101C49H MN101C49K MN101C49G MN101C49H MN101C49K QFP100-P-1818B LQFP100-P-1414 PX-ICE101C PX-PRB101C49-QFP100-P-1818B PDF

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    Abstract: No abstract text available
    Text: MN101C86G Type MN101C86G under development ROM (x× 8-bit) 128 K RAM (×× 8-bit) 6K Package QFP100-P-1818B *Lead-free 0.1 µs (at 2.7 V to 3.6 V, 10 MHz) 62.5 µs (at 2.2 V to 3.6 V, 32 kHz) * Minimum Instruction Execution Time Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • External 5


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    MN101C86G QFP100-P-1818B 16-bit MAD00039CEM PDF

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    Abstract: No abstract text available
    Text: MN101CF91D Type MN101CF91D ROM x× 8-bit 64K (flash memory) RAM (×× 8-bit) 4K Package Minimum Instruction Execution Time TQFP048-P-0707B *Lead-free 0.1 µs (at 2.7 V to 3.6 V, 10 MHz) 62.5 µs (at 2.7 V to 3.6 V, 32 kHz) Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • External 5


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    MN101CF91D MN101CF91D TQFP048-P-0707B PDF

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    Abstract: No abstract text available
    Text: MN101C07A Type MN101C07A ROM x× 8-bit 32 K RAM (×× 8-bit) 1K Package LQFP064-P-1414 *Lead-free 0.25 µs (at 2.7 V to 5.5 V, 8 MHz) 125 µs (at 2.7 V to 5.5 V, 32 kHz) Minimum Instruction Execution Time Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • Timer 2


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    MN101C07A MN101C07A LQFP064-P-1414 DGT16) DGT17) PX-ICE101C PX-PRB101C07-LQFP064-P-1414 MN101CP07D PDF

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    Abstract: No abstract text available
    Text: MN101C07A Type MN101C07A ROM x× 8-bit 32 K RAM (×× 8-bit) 1K Package LQFP064-P-1414 *Lead-free 0.25 µs (at 2.7 V to 5.5 V, 8 MHz) 125 µs (at 2.7 V to 5.5 V, 32 kHz) Minimum Instruction Execution Time Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • Timer 2


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    MN101C07A LQFP064-P-1414 DGT10) DGT11) DGT12) DGT13) DGT14) DGT15) PDF

    MN101C07A

    Abstract: LQFP064-P-1414 DGT12
    Text: MN101C07A Type MN101C07A ROM x× 8-bit 32 K RAM (×× 8-bit) 1K Package LQFP064-P-1414 *Lead-free 0.25 µs (at 2.7 V to 5.5 V, 8 MHz) 125 µs (at 2.7 V to 5.5 V, 32 kHz) Minimum Instruction Execution Time Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • Timer 2


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    MN101C07A LQFP064-P-1414 MN101C07A LQFP064-P-1414 DGT12 PDF

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    Abstract: No abstract text available
    Text: MN101E16K, MN101E16L, MN101E16M Type ROM x× 8-bit MN101E16K MN101E16L (under planning) MN101E16M (under development) 256 K 320 K 384 K 12 K 14 K 20 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free (under development)


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    MN101E16K, MN101E16L, MN101E16M MN101E16K MN101E16L QFP100-P-1818B LQFP100-P-1414 Tim00 SBI0A/RXD0A/P01 PDF

    mn101e16k

    Abstract: No abstract text available
    Text: MN101E16K, MN101E16L, MN101E16M Type ROM x× 8-bit MN101E16K MN101E16L (under planning) MN101E16M (under development) 256 K 320 K 384 K 12 K 14 K 20 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free (under development)


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    MN101E16K, MN101E16L, MN101E16M MN101E16K MN101E16L QFP100-P-1818B LQFP100-P-1414 TimBO0A/TXD0A/P00 SBI0A/RXD0A/P01 PDF

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    Abstract: No abstract text available
    Text: MN101E01J, MN101E01K, MN101E01L, MN101E01M Type ROM x× 8-bit MN101E01J MN101E01K MN101E01L MN101E01M 192 K 256 K 320 K 384 K 10 K 10 K 14 K 20 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package QFP100-P-1818B *Lead-free, LQFP100-P-1414 *Lead-free


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    MN101E01J, MN101E01K, MN101E01L, MN101E01M MN101E01J MN101E01K MN101E01L MN101E01M QFP100-P-1818B LQFP100-P-1414 PDF