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    EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Search Results

    EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES National Semiconductor External Lead Finish for Hermetic Packages Original PDF

    EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ceramic pin grid array package lead finish gold

    Abstract: 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip
    Text: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The


    Original     		PDF Mil-M-38510. ceramic pin grid array package lead finish gold 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip

    CERAMIC QUAD FLATPACK CQFP

    Abstract: No abstract text available
    Text: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997


    Original     		PDF 160-pins 160-pin 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP

    CERAMIC QUAD FLATPACK CQFP

    Abstract: 8361H CY7C37512P208B-UM
    Text: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069


    Original     		PDF 160/208-pin 160/208-lead 160-lead 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP 8361H CY7C37512P208B-UM

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
    Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality


    Original     		PDF

    HP 450 optocoupler

    Abstract: HP 3700 optocoupler coil gold detector optocoupler with schmitt trigger input SMD MARKING CODE sg Optocoupler HP 3700 smd diode marking sG RX-2 -G s smd optocoupler marking 1 HCPL-3700
    Text: HERMETIC/HI-REL OPTOCOUPLERS H AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962 8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DESC Standard Military Drawing


    Original     		PDF HCPL-576X* MIL-STD-1772 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. HP 450 optocoupler HP 3700 optocoupler coil gold detector optocoupler with schmitt trigger input SMD MARKING CODE sg Optocoupler HP 3700 smd diode marking sG RX-2 -G s smd optocoupler marking 1

    5962-8867001LA cypress

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure PALC22V10-25PI 5962-8867001LA Mil-Std-883 Wire Bond Pull Method 2011 cypress part marking CY7C122 PALC22V10 visual inspection of raw materials MIL-STD-883 Method 2010
    Text: Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality and reliability. If you, the user, are not satisfied with every


    Original     		PDF

    MIL-STD-883-5005

    Abstract: phil QMI2419 CY27H010-WMB EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES CY7C199-DMB Cypress Semiconductor Qualification Report
    Text: Cypress Semiconductor Qualification Report QTP# 98366 VERSION 1.0 September, 1999 16 Lead to 40 Lead Cerdip - Commercial and Military Amertron Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7068 Cypress Semiconductor


    Original     		PDF 16-40ld Y7C199-DMB CY27H010-WMB CY7C199-DMB MIL-STD-883-5005 phil QMI2419 CY27H010-WMB EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES CY7C199-DMB Cypress Semiconductor Qualification Report

    Alumina ceramic AI203

    Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
    Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    gold metal detectors

    Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Cypress Semiconductor Package Qualification Report QTP# 001601 VERSION 1.0 October, 2000 32-pin Windowed Rectangular Leadless Chip Carrier LCC Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069


    Original     		PDF 32-pin CY7C277 Q32RCA CY7C277-QMB

    Ultrasonic Cleaning Transducer

    Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
    Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family


    Original     		PDF

    solid solubility

    Abstract: chemical control process block diagram
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    DIODE SMD MARKING CODE 736

    Abstract: opto HP 2630 datasheet smd transistor marking HP HP 2601 OPTO DATASHEET HP 2630 SMD MARKING CODE 813 6N134 HP 2601 optocoupler opto HP 2630 HP 2630 optocoupler
    Text: H Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers 6N134* 81028 HCPL-563X HCPL-663X Technical Data HCPL-665X 5962-90855 HCPL-560X *See matrix for available extensions. Features • Dual Marked with Device Part Number and DESC Drawing Number


    Original     		PDF 6N134* HCPL-563X HCPL-663X HCPL-665X HCPL-560X MIL-PRF-38534 QML-38534, 6N137, HCPL-2601, HCPL2630/-31 DIODE SMD MARKING CODE 736 opto HP 2630 datasheet smd transistor marking HP HP 2601 OPTO DATASHEET HP 2630 SMD MARKING CODE 813 6N134 HP 2601 optocoupler opto HP 2630 HP 2630 optocoupler

    CD4536BE

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS083A – Revised March 2002 The CD4536B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), and in chip form (H


    Original     		PDF SCHS083A CD4536B 16-lead SDYV001, CD4536BE CD4536BF3A CD4536BPWR

    MO-78

    Abstract: No abstract text available
    Text: OMR9601 1 M Rad Si , ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR +3.3Vin to +2.5V Output at 3.0A In Hermetic Packages FEATURES • Total dose and low dose capability to 1M Rad (Si) allows use in space applications • Ultra low dropout voltage of 0.4V @ 3A out significantly reduces power consumption


    Original     		PDF OMR9601 MO-078AA O-258) OMR9601 MIL-STD-883, MIL-PRF-38534 MIL-PRF-38534 MIL-STD-883 MO-78

    KC700

    Abstract: KC-700 Cypress CROSS
    Text: Cypress Semiconductor Package Qualification Report QTP# 98369 VERSION 1.1 October, 2000 Ceramic Window Lid 68-lead, 84-lead and 100-lead Pin Grid Arrays Alphatec, Thailand Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF 68-lead, 84-lead 100-lead 68/84/100-lead 68-lead CY7C346-RMB KC700 KC-700 Cypress CROSS

    1N5907 JANTX

    Abstract: 1N5908 diode DO-202AA 1N5907 1N5907 JANTXV 1N5908 IEC61000-4-4 JANTXV1N5907
    Text: 1N5907 and 1N5908 1500 WATT LOW VOLTAGE TRANSIENT VOLTAGE SUPPRESSOR SCOTTSDALE DIVISION APPEARANCE This pair of unidirectional low voltage Transient Voltage Suppressor TVS devices for the 1N5907 and 1N5908 JEDEC registrations with different packages have the same high Peak Pulse Power rating of 1500 W with


    Original     		PDF 1N5907 1N5908 1N5908 IEC61000-4-5 DO-13 DO-202AA) 1N5907 JANTX 1N5908 diode DO-202AA 1N5907 JANTXV IEC61000-4-4 JANTXV1N5907

    HP 450 optocoupler

    Abstract: HP 3700 optocoupler 5962-8947701 coil gold detector HCPL-3700 HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X coil gold detector circuit
    Text: H AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962 8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DESC Standard Military Drawing • Manufactured and Tested


    Original     		PDF HCPL-576X* MIL-STD-1772 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. HP 450 optocoupler HP 3700 optocoupler 5962-8947701 coil gold detector HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X coil gold detector circuit

    MO-078AA

    Abstract: OMR9601 OMR9601SCH OMR9601SCK OMR9601SCP OMR9601SFH OMR9601SFK OMR9601SFP
    Text: OMR9601 1 M Rad Si , ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR +3.3Vin to +2.5V Output at 3.0A In Hermetic Packages FEATURES • Total dose and low dose capability to 1M Rad (Si) allows use in space applications • Ultra low dropout voltage of 0.4V @ 3A out significantly reduces power consumption


    Original     		PDF OMR9601 MO-078AA O-258) OMR9601 MIL-STD-883, MIL-PRF-38534 MIL-STD-883 MO-078AA OMR9601SCH OMR9601SCK OMR9601SCP OMR9601SFH OMR9601SFK OMR9601SFP

    Zener diode smd marking 18

    Abstract: Zener diode smd marking code .18 coil gold detector Zener diode smd marking 36 diode Marking code v3 Zener diode smd marking 27 SMD CODE list smd diode marking sG SMD MARKING CODE sg smd optocoupler marking
    Text: HCPL-5760, HCPL-5761, HCPL-576K 5962-89477 AC/DC to Logic Interface Hermetically Sealed Optocouplers Data Sheet Description These devices are single channel, hermetically sealed, voltage/current threshold detection optocouplers. The products are capable of operation and storage


    Original     		PDF HCPL-5760, HCPL-5761, HCPL-576K MIL-PRF-38534 QML-38534 MIL-PRF-38534. HCPL-5760/1/K 5968-9404E Zener diode smd marking 18 Zener diode smd marking code .18 coil gold detector Zener diode smd marking 36 diode Marking code v3 Zener diode smd marking 27 SMD CODE list smd diode marking sG SMD MARKING CODE sg smd optocoupler marking

    CD4521BE

    Abstract: CD4521B
    Text: Data sheet acquired from Harris Semiconductor SCHS078A - Revised March 2002 The CD4521B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), and in chip form (H suffix).


    Original     		PDF SCHS078A CD4521B 16-lead CD4521BNSR CD4521BPW CD4521BPWR CD4521BE

    HCPL-3700

    Abstract: HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X
    Text: AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962-8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing • Manufactured and Tested


    Original     		PDF HCPL-576X* MIL-PRF-38534 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. HCPL-5760/1/K 5968-0406E 5968-9404E HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X

    IC 2025

    Abstract: No abstract text available
    Text: Hermetic Optocouplers Choose from Hewlett-Packard's broad line of high performance hermetic optocouplers to meet your military, aerospace, and high reliability applications. There are three ceramic package styles to choose from: 8 and 16 pin dual in-line packages, and a 20 terminal


    OCR Scan     		PDF 20-terminal MIL-H-38534 MIL-M-38510 IC 2025

    gold detector IC

    Abstract: SMD 8PIN IC MARKING CODE 251 VU4R Optocoupler HP 3700 marking IRH pj 229 SMD diode DIODE PJ 257
    Text: AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962 8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DESC Standard Military Drawing • Manufactured and Tested


    OCR Scan     		PDF HCPL-576X* MIL-STD-1772 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. gold detector IC SMD 8PIN IC MARKING CODE 251 VU4R Optocoupler HP 3700 marking IRH pj 229 SMD diode DIODE PJ 257