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    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES Search Results

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES National Semiconductor External Lead Finish for Plastic Packages Original PDF

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: External Lead Finish for Plastic Packages For plastic packages, National Semiconductor offers two primary lead finishes: solder plate and solder dip. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish


    Original     		PDF

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding
    Text: Package Lineup/ Forms/ Structures 1. Package Lineup 2. Package Forms 3. Package Structures DB81-10002-2E 1 Package Lineup/ Forms/ Structures 1. Package Lineup PACKAGE 1. Package Lineup The packages are classified as follows, according to form, material, and the mounting methods


    Original     		DB81-10002-2E CERAMIC PIN GRID ARRAY wire lead frame BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding PDF

    Untitled

    Abstract: No abstract text available
    Text: LT1431 Programmable Reference FEATURES n n n n n n DESCRIPTION Guaranteed 0.4% Initial Voltage Tolerance 0.1Ω Typical Dynamic Output Impedance Fast Turn-On Sink Current Capability, 1mA to 100mA Low Reference Pin Current Available in J8, N8, S8 or 3-Lead TO-92 Z Packages


    Original     		LT1431 100mA 100mA DFN-10 LT1952/LT1952-1 LTC3723-1/LTC3723-2 LTC3721-1/LTC3721-2 LTC3722/LTC3722-2 1431fe PDF

    LH28F640BFHE-PBTLDY

    Abstract: lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10
    Text: Product Change Notice PCN : Lead (Pb)–free Packages October 15, 2004 This document updates PCN: ST-03-Z-06E issued January 23, 2004. Objective: Existing Memory ICs are changing from a lead (Pb) process to a lead-free process. Process Change Key Points 1) SHARP is changing the lead plating process from lead (Pb) to lead-free to meet the demands


    Original     		ST-03-Z-06E connectiH5116D-10F LH5116H-10F LH5116NA-10F LH5164A-10LF LH5164AD-10LF LH5164AHN-10LF LH516AN0 LH28F640BFHE-PBTLDY lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10 PDF

    real time application of ASTABLE mode

    Abstract: CD4047BE user guide cd4047be
    Text: Data sheet acquired from Harris Semiconductor SCHS044C – Revised September 2003 The CD4047B-Series types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and


    Original     		SCHS044C CD4047B-Series 14-lead 26-Sep-2005 8102001CA CD4047BD3 CD4047BE real time application of ASTABLE mode CD4047BE user guide PDF

    cl2n

    Abstract: 15BSC constant current 2 terminal source cl2k4 constant current source 160-B1 CL2K
    Text: CL2 Initial Release Simple 90V 20mA Temperature Compensated Constant Current LED Driver IC Features General Description 5.0V to 90V operating range VA-B 20mA ±10% at 5-90V 0.01% / °C Typical Temperature Coefficient TO-243AA (SOT-89), TO-252 (D-PAK), & TO-92 packages


    Original     		O-243AA OT-89) O-252 NR062905 118BSC 059BSC 00BSC 15BSC cl2n 15BSC constant current 2 terminal source cl2k4 constant current source 160-B1 CL2K PDF

    tanaka wire

    Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL


    Original     		G9911-05 KMC184 KMC184VA EME-6730 EME-9730 Mil-Std-883, tanaka wire MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 tanaka wire 10 mils PDF

    JEP140

    Abstract: AN-400 JESD22-A102 JESD22-A103 JESD22-A108 JESD22-A110 JESD22-A113 JESD22-B100 JESD22-B102 JESD22-B105
    Text: AN-400 April 2008 Surface Mount Plastic Packages for High Reliability Applications Applications Note Introduction Holt Integrated Circuits specializes in the design and manufacture of components for military and aerospace applications. Traditionally the aerospace industry has specified the


    Original     		AN-400 JEP140 AN-400 JESD22-A102 JESD22-A103 JESD22-A108 JESD22-A110 JESD22-A113 JESD22-B100 JESD22-B102 JESD22-B105 PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    CD4098BE

    Abstract: cd4098b
    Text: Data sheet acquired from Harris Semiconductor SCHS065C − Revised November 2004 These types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and


    Original     		SCHS065C 16-lead CD4098B MC14528. 17-Oct-2005 CD409) scdd003a CD4098BE PDF

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS079C − Revised October 2003 The CD4522B-series types are supplied in 16-lead dual-in-line plastic packages E suffix , 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink


    Original     		SCHS079C CD4522B-series 16-lead 9-Aug-2005 CD4522BE CD4522BM CD4522BM96 CD4522BM96E4 PDF

    cmos divide-by-n

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS079A – Revised March 2002 The CD4522B types are supplied in 16-lead dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), and in chip form (H suffix).


    Original     		SCHS079A CD4522B 16-lead CD4522BNSR CD4522BPW CD4522BPWR CD4522B, cmos divide-by-n PDF

    100 mA constant current LED driver ic

    Abstract: B102204 120v led driver circuit
    Text: CL1 Initial Release Simple 90V 20mA Temperature Compensated Constant Current LED Driver IC Features General Description 5.0V to 90V operating range Va-b 20mA ±5% at 45V Va-b -8.5µA / °C Typical Temperature Coefficient SOT-89, D-PAK & TO-92 packages No external components (two terminal


    Original     		OT-89, DSPD-3TO252K4 A052404 100 mA constant current LED driver ic B102204 120v led driver circuit PDF

    D4069

    Abstract: CD4045 CD4045BE
    Text: Data sheet acquired from Harris Semiconductor SCHS042C – Revised July 2003 The CD4045B types are supplied in 16-lead dual-in-line plastic packages E suffix , 16-lead small-outline package (NSR suffix), and 16-lead thin shrink small-outline packages (PW and


    Original     		SCHS042C CD4045B 16-lead 9-Aug-2005 CD4045BE CD4045BEE4 CD4045BNSR CD4045BNSRE4 D4069 CD4045 PDF

    Ultrasonic Cleaning Transducer

    Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
    Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family


    Original     		PDF

    Alumina ceramic AI203

    Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
    Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    gold metal detectors

    Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    solid solubility

    Abstract: chemical control process block diagram
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    JESD22-B116

    Abstract: JESD22-B102-C JESD22-B100 JESD22-A110 JESD22-B105 IDT82V3001APV IDT74FCT162244ATPV IDT74FCT162245CTPV JESD22-B105C JESD22-A102C
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0405-06 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 5/25/2004 PV (SSOP) packages (see attachment for affected part #s)


    Original     		Manufact952ETPV IDT74FCT166245ATPV IDT74LVCH16276APV IDTQS3VH16244PV IDT74FCT162245CTPV IDT74FCT162H244ATPV IDT74FCT166245TPV IDT74LVCH16373APV IDTQS3VH16245PV IDT74FCT162260ATPV JESD22-B116 JESD22-B102-C JESD22-B100 JESD22-A110 JESD22-B105 IDT82V3001APV IDT74FCT162244ATPV IDT74FCT162245CTPV JESD22-B105C JESD22-A102C PDF

    CD4069 crystal

    Abstract: 21 stage counter
    Text: Data sheet acquired from Harris Semiconductor SCHS042B – Revised July 2002 The CD4045B types are supplied in 16-lead dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), 16-lead thin shrink small-outline


    Original     		SCHS042B CD4045B 16-lead placing045BNSR CD4045BPW CD4045BPWR CD4045B, CD4069 crystal 21 stage counter PDF

    cd4536b

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS083B – Revised March 2003 The CD4536B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (DW, DWR, and NSR suffixes), and


    Original     		SCHS083B CD4536B 16-lead MCER002C CD4536BNSR CD4536BPW CD4536BPWR PDF

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B PDF

    Untitled

    Abstract: No abstract text available
    Text: MicroNote 020 Plated and Solder Dipped Finishes for Semiconductor Components Plated or hot-solder-dipped coatings have been used for semiconductor component external solder terminations for many years in both commercial and military applications. In most cases this has required


    Original     		PDF

    MC14528

    Abstract: cd4098b
    Text: Data sheet acquired from Harris Semiconductor SCHS065A – Revised March 2003 These types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M and M96


    Original     		SCHS065A 16-lead CD4098B MC14528. MCER002C CD4098BPWR JM38510/17504BEA MC14528 PDF