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    EXTREME THIN QUAD FLAT PACKAGE Search Results

    EXTREME THIN QUAD FLAT PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    EXTREME THIN QUAD FLAT PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    transistor smd xb

    Abstract: transistor smd xc TEPQFN smd transistor xb CERAMIC FLATPACK IEC-61249-2-21
    Text: Nomenclature Guide Intersil Nomenclatures ISL Types ISL X XXXX X I XX X XXX PREFIX FAMILY DESIGNATOR 1: DSL, RTC, Clocks, ATE, Energy LED Lighting 2: Reference, DCPs, Buffers, Sensors, Precision Op Amp, Precision ADC & DAC 3: Interface, Data Communication


    Original     		-40QFN) O-257) 1-888-INTERSIL transistor smd xb transistor smd xc TEPQFN smd transistor xb CERAMIC FLATPACK IEC-61249-2-21 PDF

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide Intersil Nomenclatures ISL Types ISL X XXXX X I XX X XXX PREFIX FAMILY DESIGNATOR 1: DSL, RTC, Clocks, ATE, Energy LED Lighting 2: Reference, DCPs, Buffers, Sensors, Precision Op Amp, Precision ADC & DAC 3: Interface, Data Communication


    Original     		1-888-INTERSIL PDF

    JESD22-A104-A

    Abstract: JESD22-A110-A JESD22-A-104-A JESD22-A102-B JESD22A104-A JESD22-A101-B J-STD-020A T100
    Text: Plastic Package Reliability & Testing June 1999, ver. 1 Introduction Application Note 113 Designers expect Altera® devices to perform in a variety of environments and conditions. Reliable devices decrease design and maintenance costs and increase product life cycles. Altera submits its devices to a series of


    Original     		PDF

    73M2901CE

    Abstract: block diagram satellite modem 73M2901CE-IGV 73M2901 pioneer corporation Satellite modem chip 73M1903 73M2901CL
    Text: 73M2901CE Product Brief V.22 bis Single Chip Modem for embedded applications Description The 73M2901CE is a single chip low speed modem that supports basic modem functionality. The integrated data pump supporting modulations up to ITU-T V.22 bis , controller, and analog front end (AFE) are designed specifically for cost sensitive embedded applications. The modem reduces external component count and cost by


    Original     		73M2901CE block diagram satellite modem 73M2901CE-IGV 73M2901 pioneer corporation Satellite modem chip 73M1903 73M2901CL PDF

    FtBGA

    Abstract: 256-FTBGA 132csBGA ispMACH 4A5 132-ucBGA 1048E 484-fpBGA TQFP 132 PACKAGE ispMACH 4A3 POWR607
    Text: LEAD-FREE AND HALOGEN-FREE PACKAGING FROM LATTICE RoHS Compliant Packaging Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment.


    Original     		PDF

    Satellite modem

    Abstract: 73M2901 pioneer corporation pioneer pll PSTN DAA hybrid Satellite modem chip 73M1903 73M1903C 73M2901CE block diagram satellite modem
    Text: 73M1903 & 73M1903C Product Brief Analog Front End for embedded Soft Modem applications Description The 73M1903 and 73M1903C are single-chip analog front end AFE devices used in embedded soft modem and voice applications including high speed data modems, satellite set-top-box, POS terminals, MFP and Fax terminals and IP phones. These devices offer multiple features designed to reduce the external


    Original     		73M1903 73M1903C 73M1903 73M1903, Satellite modem 73M2901 pioneer corporation pioneer pll PSTN DAA hybrid Satellite modem chip 73M2901CE block diagram satellite modem PDF

    transistor smd marking za sot-23

    Abstract: MOSFET TRANSISTOR SMD MARKING CODE ZA TRANSISTOR SMD MARKING CODE KE sot-23 MARKING CODE ZA TRANSISTOR SMD MARKING CODE TK SMD MARKING CODE sdp intersil MARKING CODE ZA RF TRANSISTOR SMD MARKING CODE TK TW6817-LA1-GR smd transistor marking code XC
    Text: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


    Original     		JM38510/ 1-888-INTERSIL transistor smd marking za sot-23 MOSFET TRANSISTOR SMD MARKING CODE ZA TRANSISTOR SMD MARKING CODE KE sot-23 MARKING CODE ZA TRANSISTOR SMD MARKING CODE TK SMD MARKING CODE sdp intersil MARKING CODE ZA RF TRANSISTOR SMD MARKING CODE TK TW6817-LA1-GR smd transistor marking code XC PDF

    Intersil

    Abstract: MOSFET TRANSISTOR SMD MARKING CODE ZA TSMC 0.13um process specification transistor smd marking za sot-23
    Text: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


    Original     		JM38510/ 1-888-INTERSIL Intersil MOSFET TRANSISTOR SMD MARKING CODE ZA TSMC 0.13um process specification transistor smd marking za sot-23 PDF

    alpha solder paste PROFILE

    Abstract: SN63 qfn stencil MO-220* pattern qfn Package solder stop mask stencil MO-220 jedec package MO-220 QFN 20 jedec MO-220 LP3
    Text: v00.0902 APPLICATION NOTES PCB DESIGN AND ASSEMBLY FOR QFN PACKAGES Introduction The need for low-cost surface mount plastic packages that operate to high frequency with low package thermal resistance has led to the development of Quad Flatpack No-Lead QFN packages. The industry standard description


    Original     		MO-220 CPF-16. CPF-24. alpha solder paste PROFILE SN63 qfn stencil MO-220* pattern qfn Package solder stop mask stencil jedec package MO-220 QFN 20 jedec MO-220 LP3 PDF

    Untitled

    Abstract: No abstract text available
    Text: Packaging technology PSGA – an innovative IC package for single and multichip designs More and more applications with multipin ICs or multichip systems require even smaller, flatter and more economical packages. The innovative PSGATM polymer stud grid array package for


    Original     		232-pin, B-3001 B-8020 PDF

    IPC-SM-780

    Abstract: No abstract text available
    Text: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		ANSI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    AT17F16

    Abstract: AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC3000 XC4000 XC5200 AT17F16 AT24CXXX PDF

    3039B

    Abstract: AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead 44-contained 3039B AT17F040 AT17F080 AT24CXXX ATDH2200E XC3000 XC4000 XC5200 PDF

    AT17F040

    Abstract: AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead XC3000TM XC4000TM AT17F040 AT17F080 AT24CXXX ATDH2200E XC3000 XC4000 XC5200 PDF

    Untitled

    Abstract: No abstract text available
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead 44-contained PDF

    diode 3039c

    Abstract: AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store • • • • • • • • • • • • Configuration Programs for Field Programmable Gate Arrays FPGAs 3.3V Output Capability 5V Tolerant I/O Pins In-System Programmable (ISP) via 2-wire Bus


    Original     		AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 20-lead 44-lead 44-tained XC3000 diode 3039c AT17F040 AT17F080 AT24CXXX ATDH2200E XC4000 XC5200 PDF

    3039G

    Abstract: AT17F040 AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC4000 XC5200 3039G AT17F040 AT17F080 AT24CXXX XC3000 PDF

    AT17F16

    Abstract: AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000, XC4000, XC5200, MPA1000 3392C AT17F16 AT24CXXX XC3000 XC4000 XC5200 PDF

    AT17F040

    Abstract: AT17F080 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC4000 XC5200 AT17F040 AT17F080 AT24CXXX XC3000 PDF

    footprint jedec MS-026 TQFP

    Abstract: AT17F16 AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000TM, XC4000TM, XC5200TM, MPA1000 XC3000 XC4000 XC5200 footprint jedec MS-026 TQFP AT17F16 AT24CXXX PDF

    Untitled

    Abstract: No abstract text available
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000, XC4000, XC5200, MPA1000 3392D PDF

    AT17F16

    Abstract: AT24CXXX AT40K AT94K ATDH2200E XC3000 XC4000 XC5200
    Text: Features • Programmable 16,777,216 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays FPGAs • 3.3V Output Capability • 5V Tolerant I/O Pins • Program Support using the Atmel ATDH2200E System or Industry Third Party


    Original     		ATDH2200E AT40K AT94K XC3000, XC4000, XC5200, MPA1000 3392E AT17F16 AT24CXXX XC3000 XC4000 XC5200 PDF

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		PDF