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76745-1CF-10LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
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76745-1CF-24LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
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76745-1CF-24
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
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LM4040EEM3-2.5/NOPB
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Texas Instruments
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100-ppm/°C precision micropower shunt voltage reference 3-SOT-23 |
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CD74HCT240EE4
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Texas Instruments
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High Speed CMOS Logic Inverting Octal Buffer/Line Drivers with 3-State Outputs 20-PDIP -55 to 125 |
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