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    FBGA PACKAGE TRAY 12 X 19 Search Results

    FBGA PACKAGE TRAY 12 X 19 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    FBGA PACKAGE TRAY 12 X 19 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    FBGA16

    Abstract: 393 NEC
    Text: TRAY CONTAINER UNIT : mm 6x16=96 135°C MAX. 19.20 16.30 7 NEC 107.0 21.40 FBGA16×16ESP A' 14.45 16.30 13.50 288.0 315.0 322.6 Section A – A' 16.30 (5.62) (6.09) 16.00 7.62 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA16×16ESP 224-pin Plastic FBGA (16×16)


    Original     		PDF FBGA16 16ESP 224-pin 240-pin 241-pin 303-pin 393-pin 697-pin 393 NEC

    K9F2G08U0C

    Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
    Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


    Original     		PDF BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0

    K5W1G

    Abstract: KMCME0000M-B998 k9hbg08u1m K9MCG08U5M K5E1257ACM MC4GE04G5APP-0XA b998 KMCME0000M hd161hj K5D1G
    Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage August 2007 MEMORY AND STORAGE DRAM DDR3 SDRAM DDR2 SDRAM DDR SDRAM SDRAM MOBILE SDRAM RDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND FLASH NAND FLASH ORDERING INFORMATION


    Original     		PDF BR-07-ALL-001 K5W1G KMCME0000M-B998 k9hbg08u1m K9MCG08U5M K5E1257ACM MC4GE04G5APP-0XA b998 KMCME0000M hd161hj K5D1G

    K8D3216UBC-pi07

    Abstract: K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm
    Text: Product Selection Guide Memory and Storage April 2005 MEMORY AND STORAGE SECTION A DRAM DDR2 SDRAM DDR SDRAM SDRAM RDRAM NETWORK DRAM MOBILE SDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND, OneNAND, NOR FLASH NAND FLASH ORDERING INFORMATION SRAM


    Original     		PDF BR-05-ALL-002 K8D3216UBC-pi07 K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    FBGA 152

    Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)


    Original     		PDF FBGA13 13ESP 144-pin 160-pin 161-pin 180-pin 197-pin 212-pin 225-pin 249-pin FBGA 152 JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA

    JEDEC FBGA

    Abstract: 196-PIN 181-pin
    Text: TRAY CONTAINER UNIT : mm 11x29=319 NEC 7 8.20 296.8 315.0 322.6 8.20 Section A – A' 8.00 (5.62) 7.62 11.65 135°C MAX. 8.20 10.60 9.10 (6.04) 116.5 A' FBGA8×8ESP 9.70 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA8×8ESP Material Carbon PPE 121-pin PLASTIC FBGA (8×8)


    Original     		PDF 121-pin 165-pin 73-pin 169-pin 180-pin 181-pin 196-pin SSD-A-H7193-2 200ONTAINER JEDEC FBGA

    K9HDG08U1A

    Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
    Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original     		PDF BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe

    RISC-Processor s3c2410

    Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
    Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH


    Original     		PDF BR-04-ALL-005 BR-04-ALL-004 RISC-Processor s3c2410 MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    SPANSION date code format

    Abstract: spansion solder profile FBGA tray fBGA package tray 12 x 19 TRACE CODE ON BOX PACKING LABEL
    Text: ‹ Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Product Carrier Options Package Codes Product Date Codes Packages and Packing Methodologies Handbook 17 Oct 2008 1-1 ‹ Chapter 1 Codes and Carrier Options PRODUCT CARRIER OPTIONS Several packing systems, including product carrier and packing container options, are available for Spansion memory products. The following table lists those systems that are used as a standard, as well as other


    Original     		PDF

    s29al004d55

    Abstract: S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032
    Text: ORDERING PART NUMBER MAPPING GUIDE March, 2005 Release AMD PRODUCTS FUJITSU PRODUCTS SPANSION PRODUCTS Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG TSOP MBM29DL32xE • MBM29DL32F • MBM29DL34F (TSOP)


    Original     		PDF Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG s29al004d55 S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032

    samsung ddr3 ram MTBF

    Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
    Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original     		PDF BR-12-ALL-001 samsung ddr3 ram MTBF KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd

    K4X2G323PD8GD8

    Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
    Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from


    Original     		PDF BR-12-ALL-001 K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03

    movinand

    Abstract: movinand DECODER 1g nand mcp movi nand S3C49VCX03 16G nand flash S3C49v 8G nand 16G nand MCP NAND
    Text: MOVI NAND Code Information 1/3 Last Updated : November 2008 KMXXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 1. Memory (K) 9 10 11 12 13 14 15 16 17 18 4. MoviNAND Density & Vcc & Org. & BB Co de 2. MOVI NAND/MCP : M moviNAN D Den NAND Den Ce ll 3. Small Classification


    Original     		PDF

    samsung K9 flash

    Abstract: Samsung EOL 168FBGA samsung nor flash samsung s6 K4X1G163PC-FGC3 k4 MARKING CODE samsung K4 samsung cdram
    Text: SAMSUNG's Digital World go contents DRAM ● ● ● ● Computing ❍ DDR3 Products ❍ DDR2 Products ❍ DDR Products ❍ SDRAM Products ❍ System Compatibility ❍ EOL Products Consumer ❍ Products Mobile ❍ Products ❍ EOL Products Graphic & Gaming


    Original     		PDF 800MHz-40ns i850E K4X1G163PC 07-Sep-2010 D18ns TRP18ns TRCD18ns samsung K9 flash Samsung EOL 168FBGA samsung nor flash samsung s6 K4X1G163PC-FGC3 k4 MARKING CODE samsung K4 samsung cdram

    CSP JEDEC tray

    Abstract: JEDEC TRAY DIMENSIONS FBGA 60
    Text: HEAT PROOF 7 A' 11.95 8.20 11x16=176 135°C MAX PPE 119.5 A NEC CSP 7.8×14.8×0.8 135.9 UNIT : mm 7.98 14.91 19.40 291.0 12.00 315.0 322.6 SECTION A-A' 6.57 (6.35) 7.62 14.91 Applied Package Quantity (pcs) 60-pin • Plastic FBGA (7.83×14.76) MAX. 176


    Original     		PDF 60-pin CSP JEDEC tray JEDEC TRAY DIMENSIONS FBGA 60

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    LMV240

    Abstract: national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A
    Text: Surface Mount - Tape & Reel General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of


    Original     		PDF EIA-481-1-A EIA-481-2-A CSP-9-111S2) CSP-9-111S2. LMV240 national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A

    fBGA package tray 12 x 19

    Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
    Text: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)


    Original     		PDF 16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit fBGA package tray 12 x 19 FCCSP a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF