FFG676C Search Results
FFG676C Price and Stock
AMD XC7K160T-1FFG676CIC FPGA 400 I/O 676FCBGA |
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XC7K160T-1FFG676C | Tray | 105 | 1 |
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XC7K160T-1FFG676C | Tray | 19 Weeks | 1 |
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XC7K160T-1FFG676C | 3 |
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XC7K160T-1FFG676C | Bulk | 20 | 1 |
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XC7K160T-1FFG676C | 19 Weeks | 1 |
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AMD XC7Z030-1FFG676CIC SOC CORTEX-A9 667MHZ 676FCBGA |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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XC7Z030-1FFG676C | Tray | 56 | 1 |
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XC7Z030-1FFG676C | 4 |
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XC7Z030-1FFG676C | Bulk | 26 | 1 |
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XC7Z030-1FFG676C | 2,200 |
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AMD XC7Z045-1FFG676CIC SOC CORTEX-A9 667MHZ 676FCBGA |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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XC7Z045-1FFG676C | Tray | 47 | 1 |
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XC7Z045-1FFG676C | 9 |
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XC7Z045-1FFG676C | Bulk | 1 |
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AMD XC7K325T-1FFG676CIC FPGA 400 I/O 676FCBGA |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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XC7K325T-1FFG676C | Tray | 44 | 1 |
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XC7K325T-1FFG676C | Tray | 19 Weeks | 1 |
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XC7K325T-1FFG676C | 3 |
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XC7K325T-1FFG676C | Bulk | 1 |
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XC7K325T-1FFG676C | 19 Weeks | 1 |
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AMD XC7K160T-2FFG676CIC FPGA 400 I/O 676FCBGA |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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XC7K160T-2FFG676C | Tray | 24 | 1 |
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XC7K160T-2FFG676C | Tray | 19 Weeks | 1 |
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XC7K160T-2FFG676C | 9 |
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XC7K160T-2FFG676C | Bulk | 75 | 1 |
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XC7K160T-2FFG676C | 19 Weeks | 1 |
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FFG676C Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
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Original |
UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga | |
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
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Original |
UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G | |
xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
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Original |
UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance | |
XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
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Original |
UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 | |
BFG95
Abstract: No abstract text available
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Original |
UG112 UG072, UG075, XAPP427, BFG95 |