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    FIN HEAT SINK IGBT Search Results

    FIN HEAT SINK IGBT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GT30J110SRA Toshiba Electronic Devices & Storage Corporation IGBT, 1100 V, 60 A, Built-in Diodes, TO-3P(N) Visit Toshiba Electronic Devices & Storage Corporation
    TLP5702H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-Topr / IGBT driver, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    TLP5705H Toshiba Electronic Devices & Storage Corporation Photocoupler (Gate Driver Coupler), High-Topr / IGBT driver, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation

    FIN HEAT SINK IGBT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    fin heat sink igbt

    Abstract: 027440 416201U 62625 aluminum part polar cap aavid 8911A 62465 Aavid Thermalloy 6063
    Text: HEAT SINK COOLING FOR IGBT MODULES T H E R M A L P R O D U C T S, I N C. Aavid offers several methods for cooling IGBT modules – cold plates, extruded aluminum heat sinks, bonded fin heat sinks, and fan cooled modules. 6-PASS COLD PLATE 6-pass liquid-cooled cold plates offer optimum thermal management for high power IGBT modules.They


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    denso mass air flow

    Abstract: No abstract text available
    Text: Presented by invitation at International Conference on Integrated Power Electronics Systems CIPS 2012, March 6-8, Nuremberg, Germany Advanced Cooling for Power Electronics Sukhvinder S. Kang, Aavid Thermalloy LLC, Concord NH, USA Email: kang@aavid.com Abstract


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    IHTC14-22929, denso mass air flow PDF

    heat sink design guide, IGBT

    Abstract: loop heat pipes Aavid Thermalloy Aavid Thermalloy cold plate Aavid cold plate heat exchanger heat pipes igbt clip rail air fin fan exchangers Heat exchanger air to air
    Text: Thermal Management Solutions for Cooling Electronics WWW.AAVIDTHERMALLOY.COM Our Mission Aavid Thermalloy will lead the electronics thermal management industry worldwide. We will be the company our customers partner with to solve their most demanding thermal challenges. Our business processes are designed for


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    14F-4, heat sink design guide, IGBT loop heat pipes Aavid Thermalloy Aavid Thermalloy cold plate Aavid cold plate heat exchanger heat pipes igbt clip rail air fin fan exchangers Heat exchanger air to air PDF

    electronic passive components catalog

    Abstract: heat sink design guide, IGBT polar cap Aavid Thermalloy cold plate loop heat pipes laptop fan Aavid Thermalloy TUBE MTBF IGBT
    Text: Thermal Management Solutions for Cooling Electronics WWW.AAVIDTHERMALLOY.COM Our Mission Aavid Thermalloy will lead the electronics thermal management industry worldwide. We will be the company our customers partner with to solve their most demanding thermal challenges. Our business processes are designed for


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    14F-4, electronic passive components catalog heat sink design guide, IGBT polar cap Aavid Thermalloy cold plate loop heat pipes laptop fan Aavid Thermalloy TUBE MTBF IGBT PDF

    DRYD001590E768U

    Abstract: 09HVD4B-EMGF-SR AN2009-11 ISO4762 AN2005-06 IEC60721-3-1 530MPa ASSEMBLY CODE FOR BARCODE READER barcode scanner connection schematic M6 SMD MARKING CODE
    Text: Application Note, V1.0, November 2009 HybridPACK 2 General Information and Mounting Instruction for HybridPACK™ 2 Module Automotive Hybrid Edition 2009-11-05 Published by Infineon Technologies AG 85579 Munich, Germany Infineon Technologies AG 2009.


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    09HVD6B-EMGF-NR

    Abstract: DRYD001590E768U TRELLEBORG Trelleborg DRYD001590E768U 09HVD4B-EMGF-sr ISO4762 ejot torque IEC60721-3-1 09HVD6BEMGF-NR din 6912
    Text: Application Note AN 2010-08 V2.0, August 2010 HybridPACK 2 General Information and Mounting Instruction IFAG ATV OPEV N 2010-03 r 2009 Application Note AN 2010-08 V2.0, August 2010 Edition 2010-08-10 Published by Infineon Technologies AG 59568 Warstein, Germany


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    MM486

    Abstract: Wakefield Engineering eX 433 Wakefield 537-95ab 435AAAA wakefield 1244 Heatsinks 302M 303M 435aA
    Text: Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621/623 SERIES Footprint Dimensions in. mm Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 3.000 (76.2) 4.750 (120.6) x 3.000 (76.2)


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    O-220 O-218 MM486 Wakefield Engineering eX 433 Wakefield 537-95ab 435AAAA wakefield 1244 Heatsinks 302M 303M 435aA PDF

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p26-49 6/14/07 10:56 AM Page 45 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621/623 SERIES Footprint Dimensions in. mm Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 3.000 (76.2)


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    WTS001 p26-49 392-120AB 392-120AG 392-180AB 392-180AG 392-300AB 392-300AG PDF

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Intelligent <Intelligent Power Power Module> Module> PS51259-A PS51259-A TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS51259-A INTEGRATED POWER FUNCTIONS • Single phase AC input, DC output IGBT/FWD converter bridge


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    PS51259-A 20Arms AC100 EG01Y PDF

    PS51259-A

    Abstract: AC100 EG01Y inverter single phase Airconditioner
    Text: MITSUBISHI MITSUBISHI SEMICONDUCTOR SEMICONDUCTOR <Intelligent <Intelligent Power Power Module> Module> PS51259-A PS51259-A TRANSFER-MOLD TRANSFER-MOLD TYPE TYPE INSULATED INSULATED TYPE TYPE PS51259-A INTEGRATED POWER FUNCTIONS • Single phase AC input, DC output IGBT/FWD converter bridge


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    PS51259-A 20Arms AC100 EG01Y PS51259-A inverter single phase Airconditioner PDF

    220v DC to AC PWM INVERTER

    Abstract: 60142 ac induction motor of single phase of 1/4 hp ac Inverter 10 kw IRPT1066A 220v AC induction MOTOR pwm parameters of 5 hp DC motor induction heat circuit 220v DC MOTOR pwm PWM 220v ac MOTOR CONTROL
    Text: PD 60142 IRPT1066A PROVISIONAL Power Module for 0.5 hp Motor Drives • 0.5 hp 0.37 kW power output Industrial rating at 150% overload for 1 minute · · · · · · · · · 180-240V AC single-phase input, 50/60 Hz Single-phase rectifier bridge 3-phase, short circuit rated, ultrafast IGBT inverter


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    IRPT1066A 80-240V -25oC 125oC IRPT1066A 80-240V 220v DC to AC PWM INVERTER 60142 ac induction motor of single phase of 1/4 hp ac Inverter 10 kw 220v AC induction MOTOR pwm parameters of 5 hp DC motor induction heat circuit 220v DC MOTOR pwm PWM 220v ac MOTOR CONTROL PDF

    IGBT inverter for 1hp motor

    Abstract: IRPT2061A pwm 3phase igbt driver ic ac Inverter 10 kw full bridge inverter YNE503J01TR 3 phase ac Induction motor h bridge igbt full h bridge igbt induction generator pwm 3 phase ac motor
    Text: PD 60120 IRPT2061A PRELIMINARY Power Module for 1.5 hp Motor Drives • 1.5 hp 1.1 kW power output Industrial rating at 150% overload for 1 minute · · · · · · · · · · 380-480V AC input, 50/60 Hz 3-phase rectifier bridge 3-phase, short circuit rated, ultrafast IGBT inverter


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    IRPT2061A 80-480V -25oC 125oC IRPT2061A 80-480V IGBT inverter for 1hp motor pwm 3phase igbt driver ic ac Inverter 10 kw full bridge inverter YNE503J01TR 3 phase ac Induction motor h bridge igbt full h bridge igbt induction generator pwm 3 phase ac motor PDF

    IC 0001 SPMS

    Abstract: curve tracer equipment heat sink design guide, IGBT calculation of IGBT snubber Power PCB Relays FPAL20SM60-IGBT INVERTER 10kW mosfet 5kw high power rf spms 12 volt 1N4937
    Text: Application Note 9018 May, 2002 Smart Power Module User’s Guide 8.Bootstrap Circuit 8.1 Operation of a Bootstrap Circuit The VBS voltage, which is the voltage difference between VB SPM pins 20, 25 and 29 and VS (SPM pins 21, 26 and 30), provides the supply to the HVICs within the SPM. This supply must


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    fin heat sink igbt

    Abstract: diode chopper MBL1200E17D
    Text: Spec.No.IGBT-SP-03013 R2 IGBT MODULE MBL1200E17D PRELIMINARY SPEC. Silicon N-channel IGBT OUTLINE DRAWING FEATURES ∗ High thermal fatigue durability. delta Tc=70℃,N>30,000cycles ∗ High speed, low loss IGBT module. ∗ Low noise due to built-in free-wheeling diode


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    IGBT-SP-03013 MBL1200E17D 000cycles) 120mA, 100kHz, 120nF 125oC fin heat sink igbt diode chopper MBL1200E17D PDF

    6mbp20rta060

    Abstract: TLP521-1GR 6MBP15RA120 7MBP50RA120 application note P621 TOSHIBa 6mbp50rt REH984 6MBP150TEA060 P621 6mbp100ra120
    Text: Quality is our message FUJI IGBT–IPM APPLICATION MANUAL Sep. 2004 REH983a CONTENTS Chapter 1 Features 1. GBT-IPMs Characteristics .1-2 2. IPM Characteristics by Series .1-4


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    REH983a 6mbp20rta060 TLP521-1GR 6MBP15RA120 7MBP50RA120 application note P621 TOSHIBa 6mbp50rt REH984 6MBP150TEA060 P621 6mbp100ra120 PDF

    VIE125-12S4

    Abstract: IC100
    Text: ISOSMART IGBT Module VIE125-12S4 IC = 125 A = 1200 V VCES Intelligent Power Module IPM with integrated galvanic isolation interface High Short Circuit SOA Capability 3 3 4 5 6 7 8 9 10 Preliminary data 2 Driver 1 1 Protection Isolation 2 Symbol Test Conditions


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    VIE125-12S4 IC100 VIE125-12S4 IC100 PDF

    VIE150-12S4

    Abstract: VIE150-12S fin heat sink igbt IC100
    Text: ISOSMART IGBT Module VIE150-12S4 IC = 150 A = 1200 V VCES Intelligent Power Module IPM with integrated galvanic isolation interface High Short Circuit SOA Capability 3 3 4 5 6 7 8 9 10 Preliminary data 2 Driver 1 1 Protection Isolation 2 Symbol Test Conditions


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    VIE150-12S4 IC100 VIE150-12S4 VIE150-12S fin heat sink igbt IC100 PDF

    VIE100-12S4

    Abstract: VIE100-12S IC100 reset ic
    Text: ISOSMART IGBT Module VIE100-12S4 IC = 100 A = 1200 V VCES Intelligent Power Module IPM with integrated galvanic isolation interface High Short Circuit SOA Capability 3 3 4 5 6 7 8 9 10 Preliminary data 2 Driver 1 1 Protection Isolation 2 Symbol Test Conditions


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    VIE100-12S4 IC100 VIE100-12S4 VIE100-12S IC100 reset ic PDF

    VIE200-12S4

    Abstract: IC100
    Text: ISOSMART IGBT Module VIE200-12S4 IC = 200 A = 1200 V VCES Intelligent Power Module IPM with integrated galvanic isolation interface High Short Circuit SOA Capability 3 3 4 5 6 7 8 9 10 Preliminary data 2 Driver 1 1 Protection Isolation 2 Symbol Test Conditions


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    VIE200-12S4 IC100 VIE200-12S4 IC100 PDF

    wakefield 1371

    Abstract: wakefield extrusion 1371 MM486 106 35K 528 rectifier 6u s4 302M 303M 392-180AG wakefield 1244 Wakefield 641A
    Text: Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621 AND 623 SERIES Standard P/N 621A 621K 623A 623K Low-Profile Heat Sinks for All Metal-Case Power Semiconductors Footprint Dimensions in. mm Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1)


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    IGBT 100V 100A

    Abstract: IGBT inverter calculation IGBT inverter calculation FOR A UPS 600v 100a CM10MD1-24H calculation of IGBT snubber cm15md-24h CM25MD1-24H CM600HU-12H IGBT h-series application note
    Text: IGBT MODULE U-SERIES Product and Applications Brochure Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 412 925-7272 First Edition April, 1997 Table of Contents Click For INDEX Product Concept . . . . . . . . . . . . . . . . . . .1 Copyright


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    CM75BU-12H CM100BU-12H CM75TU-12H CM100TU-12H CM50TU-24H CM75TU-24H CM100TU-24H CM10MD-12H CM15MD-12H CM20MD-12H IGBT 100V 100A IGBT inverter calculation IGBT inverter calculation FOR A UPS 600v 100a CM10MD1-24H calculation of IGBT snubber cm15md-24h CM25MD1-24H CM600HU-12H IGBT h-series application note PDF

    Untitled

    Abstract: No abstract text available
    Text: SSR3A High Speed 3 Amp Solid-State Relay Key Features • •   6 ns Switching Speed 0 to 5 MHz input frequency 60 ns minimum pulse width Power and signal inputs isolated from sources.  Easy replacement of IGBTs NO Resoldering Necessary! Figure 1 - SSR3A Simplified Circuit Diagram


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    mosfet base induction heat circuit

    Abstract: mitsubishi sic MOSFET power IGBT MOSFET GTO SCR diode skiip 33 ups 063 IGCT mitsubishi igbt induction heating generator Cree SiC MOSFET SiC BJT zvs zcs induction heating igbt Heatsink For stud devices - Semikron
    Text: High Heat Flux Applications in Power Electronics Scott G. Leslie Chief Technologist Powerex Inc Youngwood PA High Heat Flux Applications in Power Electronics 2005 1 Power Switching Capacity VA Power Semiconductor Device Power Switching Capacity & Application Map


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    MG100J2YS40

    Abstract: FAp DARLINGTON TRANSISTOR TOSHIBA IGBT snubber ap 5331 application POWER MOSFET HIG VELOCITY calculation of IGBT snubber P-Channel IGBT TRANSISTOR EN SMD TZ FAp DARLINGTON SMD TRANSISTOR
    Text: TOSHIBA 2. [ 5 ] IGBT Description IGBT Construction 2.1 Chip Construction IGBT Insulated G ate B ipolar T ransistors are devices which combine the high in p u t im pedance and high speed of th e M OSFET w ith the high conductivity characteristics (low sa tu ratio n


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