CDFP4-F20
Abstract: K20.A Package k20a
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP4-F20
245lied.
038mm)
CDFP4-F20
K20.A Package
k20a
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cdfp3-f28
Abstract: dip 28 dimension
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP3-F28
F-11A,
038mm)
cdfp3-f28
dip 28 dimension
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CDFP4-F24
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP4-F24
350ied.
038mm)
CDFP4-F24
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CDFP3-F14
Abstract: K14.A Package
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP3-F14
038mm)
CDFP3-F14
K14.A Package
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cdfp4-f16
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP4-F16
245lied.
038mm)
cdfp4-f16
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.B A e 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.070 0.115 1.78 2.92 - b 0.015
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038mm)
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K18.B A e 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA SYMBOL -A- D -B- S1 b MIN MILLIMETERS MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 - b 0.015
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038mm)
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K8.A A e 8 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA SYMBOL -A- D -B- S1 b MIN MILLIMETERS MAX MIN MAX NOTES A 0.070 0.115 1.18 2.92 - b 0.015
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038mm)
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack E 1 K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE N e INCHES A A D b E1 S1 L C Q A E2 c1 LEAD FINISH BASE METAL (c) SYMBOL MILLIMETERS MIN MAX MIN MAX
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038mm)
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CDFP3-F10
Abstract: k10a
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B) 10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A -A- D -BPIN NO. 1 ID AREA b E1 0.004 M H A-B S Q D S S1
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MIL-STD-1835
CDFP3-F10
038mm)
CDFP3-F10
k10a
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K18C
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Ceramic Lid Flatpack Packages Flatpack K18.C A e 18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE A PIN NO. 1 ID AREA INCHES -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S C
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038mm)
K18C
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack e A K16.D A 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE PIN NO. 1 ID AREA INCHES -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S E -D-H- E2 L E3 SEATING AND
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038mm)
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ordering information
Abstract: No abstract text available
Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack
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24-pin,
MS-027-AC
28-pin,
MS-027-AA
32-pin,
ordering information
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CERAMIC QUAD FLATPACK CQFP 14 pin
Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
Text: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.
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CF160
PQ208
CQ208
PB256
CERAMIC QUAD FLATPACK CQFP 14 pin
CF160
CERAMIC PIN GRID ARRAY CPGA
CERAMIC QUAD FLATPACK CQFP
CQ208
CF100
PF100
PF144
PL84
PQ208
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48 Lead Ceramic Quad Flatpack
Abstract: CERAMIC QUAD FLATPACK CQFP 96 CERAMIC QUAD FLATPACK CQFP
Text: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R48.A D S 48 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S INCHES D S D SYMBOL D1 A PIN NO. 1 L e A A -AE1 E e2 -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS
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CERAMIC QUAD FLATPACK CQFP
Abstract: CERAMIC QUAD FLATPACK CQFP 96
Text: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R68.A D S 68 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S D INCHES D S SYMBOL D1 A PIN NO. 1 L e A A -AE1 e2 E -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS
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27lating
038mm)
CERAMIC QUAD FLATPACK CQFP
CERAMIC QUAD FLATPACK CQFP 96
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HC 4093
Abstract: No abstract text available
Text: SENSITRON SEMICONDUCTOR SMC6G30-60 SMC6G30-60-1 TECHNICAL DATA DATASHEET 4093, REV. - Brushless DC Motor Driver Module in a Power Flatpack 600V, 30 Amp DESCRIPTION: The SMC6G30-60 is an, integrated three-phase brushless DC motor controller/driver subsystem housed in a 43 pin power flatpack. The SMC6G30-60 is best used as a twoquadrant speed controller for controlling/driving fans, pumps, and motors in applications
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SMC6G30-60
SMC6G30-60-1
HC 4093
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pin diagram ic 4093
Abstract: DIODE ZENER ea1 4093 pwm IC 4093 pin block diagram HC 4093 4093 oscillator speed control of motor Motor Driver Circuit schematic 10 ampere
Text: SENSITRON SEMICONDUCTOR SMC6G30-60 SMC6G30-60-1 TECHNICAL DATA DATASHEET 4093, REV. - Brushless DC Motor Driver Module in a Power Flatpack 600V, 30 Amp DESCRIPTION: The SMC6G30-60 is an, integrated three-phase brushless DC motor controller/driver subsystem housed in a 43 pin power flatpack. The SMC6G30-60 is best used as a twoquadrant speed controller for controlling/driving fans, pumps, and motors in applications
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SMC6G30-60
SMC6G30-60-1
pin diagram ic 4093
DIODE ZENER ea1
4093 pwm
IC 4093 pin block diagram
HC 4093
4093 oscillator
speed control of motor
Motor Driver Circuit schematic 10 ampere
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Lorch
Abstract: vernitron 33710 FC-200RF FC-200LF FC-200ZF FC-201LF FC-201RF FC-201ZF 201rf
Text: VERNITRON/ LORCH ELEK 33E D • iLORc SMSflbb3 ODDOMÖ1 3 T-nV-ùl-ôi MINIATURE DOUBLE BALANCED MIXERS FLATPACK AND CONNECTOR VERSIONS 10 KHz to 1000 MHz LO POWER +7dBm FLATPACK VERSION FC-2Ö0LF FC-200RF FC-200ZF CONNECTOR VERSION FULL FREQUENCY RANGE MHz
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OCR Scan
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FC-200RF
FC-200ZF
FC-201LF
FC-201RF
FC-201ZF
FC-200LF,
FC-200ZF
Lorch
vernitron
33710
FC-200LF
FC-201ZF
201rf
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244u
Abstract: 244-Z
Text: VERNITRON/ LORCH ELEK 33E D • IMSflbfeB OOOOMfl^ Ö * L O R C ULTRA LOW DISTORTION DOUBLE BALANCED MIXERS PC, FLATPACK AND CONNECTOR VERSIONS 1.0 MHz to 700 MHz FC-244Y FC-244YF LO POWER +27dBm FC-244R FC-244RF PC VERSION FC-244Z FC-244U FLATPACK VERSION
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OCR Scan
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FC-244Y
FC-244YF
27dBm
FC-244R
FC-244RF
FC-244Z
FC-244U
FC-244ZF
FC-244UF
FC-245Y
244u
244-Z
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Untitled
Abstract: No abstract text available
Text: PRECISION BULK " ' ' METAL — — — - FOIL — TECHNOLOGY • — — “ a c o m p a n y of V I S H A Y VISHAY VISHAY MODEL 1490 RESISTORS 14 Pin Flatpack Hermetic Resistor Network The 14 pi n 0.420 square flatpack is a compact metal package providing excellent heat transfer for power dissipation require
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OCR Scan
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70-AAAArOs
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Lorch
Abstract: vernitron N2801 FC-201YL FC-200 FC-200YL FC-200Y lorch fc 201 r lorch fc 201 rf
Text: VERNITRON/ LORCH ELEK 33E » • TMSflbbB 0000476 3 ■ L O R C GENERAL PURPOSE DOUBLE BALANCED MIXERS PC, FLATPACK AND CONNECTOR VERSIONS 10 KHz to 225 MHz FC-200YL FC-200Y FC-200YF LO POWER +7dBm FC-200 FC-200F PC VERSION MODEL FLATPACK VERSION FIG. NOTE
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FC-200YL
FC-200Y
FC-200YF
FC-200
FC-200F
FC-201YL
FC-201Y
FC-201
FC-200YL,
FC-201
Lorch
vernitron
N2801
lorch fc 201 r
lorch fc 201 rf
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Vernitron
Abstract: Lorch FC-201YL atos FC-200Y FC-200 FC-201 lorch fc 201 r lorch fc 201 rf
Text: VERNITRON/ LORCH E L E K 33E » • TMSÔbbB D000M7Û 3 «LORC GENERAL PURPOSE DOUBLE BALANCED MIXERS PC, FLATPACK AND CONNECTOR VERSIONS 10 KHz to 225 MHz FC-200YL FC-200Y FC-200YF LO POWER +7dBm FC-200 FC-200F PC VERSION MODEL FLATPACK VERSION FIG. NOTE
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OCR Scan
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D000M7Ã
FC-200YL
FC-200Y
FC-200
FC-200YF
FC-200F
FC-201YL
FC-201Y
FC-201
FC-200YL,
Vernitron
Lorch
atos
lorch fc 201 r
lorch fc 201 rf
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vernitron
Abstract: FC-194Y
Text: VERNITRON/ LORCH ELEK 33E T> WÈ TMSflbb3 Q000M7b T « L O R C LOW LEVEL DOUBLE BALANCED MIXERS PC, TO-5, TO-8, FLATPACK AND CONNECTOR VERSIONS 50 KHz to 1000 MHz LO POWER OdBm PC VERSION FC-193Y FC-193R FC-193Z FLATPACK VERSION MODEL FIG. NOTE MODEL 1 FIG.
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Q000M7b
FC-193Y
FC-193R
FC-193Z
FC-193YF
FC-193RF
FC-193ZF
FC-194Y
FC-194R
FC-194Z
vernitron
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