capture and electronic packaging
Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210
Text: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance
|
Original
|
|
PDF
|
BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
|
Original
|
63Sn/37Pb)
BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
|
PDF
|
E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
|
Original
|
DS577G
E700G
|
PDF
|
HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
|
Original
|
|
PDF
|
cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced
|
Original
|
UG012
|
PDF
|
Untitled
Abstract: No abstract text available
Text: R Flip-Chip Packages Flip-Chip Packages As silicon devices become more integrated with smaller feature sizes as well as increased functionality and performance, packaging technology is also evolving to take advantage of these silicon advancements. Flip-chip packaging is the latest packaging option introduced
|
Original
|
UG012
|
PDF
|
LSI Logic
Abstract: Flip Chip Substrate led flip-chip heatsink Signal Path Designer
Text: Flip Chip Ball Grid Array FPBGA Package Family Overview LSI Logic's FPBGA packages offer flip chip die interconnect, and support leadcounts in excess of 1700 to target high performance, high pin count applications. LSI Logic is the first company to qualify a flip chip package using
|
Original
|
B20022
LSI Logic
Flip Chip Substrate
led flip-chip heatsink
Signal Path Designer
|
PDF
|
ULM Photonics
Abstract: VCSEL array ULM Photonics GmbH
Text: Monolithic VCSEL array for highly parallel data transport • Layout for direct flip-chip bonding and substrate removal • Custom-designed array layout • Lowest power consumption • Lowest threshold current Threshold voltage UTH V 1.5 1.8 2.0 ELECTRO-OPTICAL-CHARACTERISTICS, CHIP FLIP-CHIP MOUNTED
|
Original
|
850nm
ULM Photonics
VCSEL array
ULM Photonics GmbH
|
PDF
|
Pb210
Abstract: flip chip substrate tolerance
Text: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump
|
Original
|
AN0039
Pb210
flip chip substrate tolerance
|
PDF
|
VCSEL array, 850nm flip
Abstract: ULM Photonics Monolithic-VCSEL-array VCSEL array, 850nm, flip chip VCSEL array, 850nm vcsel array ULM Photonics GmbH
Text: V3 Monolithic VCSEL array to FLIP CHIP for highly parallel data transport • Layout for direct flip-chip bonding and substrate removal • Custom-designed array layout • Lowest power consumption • Lowest threshold current Threshold voltage UTH V 1.5 1.8
|
Original
|
850nm
VCSEL array, 850nm flip
ULM Photonics
Monolithic-VCSEL-array
VCSEL array, 850nm, flip chip
VCSEL array, 850nm
vcsel array
ULM Photonics GmbH
|
PDF
|
Untitled
Abstract: No abstract text available
Text: LUXEON Flip Chip Chip Scale Package LED Introduction Philips Lumileds LUXEON Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level
|
Original
|
DS116
|
PDF
|
Pb95Sn5
Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377
|
Original
|
DS2411:
DS2415:
DS2417:
DS2432:
DS2433:
DS2502:
DS2760:
DS2761:
DS2762:
DS9503:
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
EIA-746
IPC-6012A
MAXIM Assembly Locations OF CODE
underfill dispense needle
FR4 substrate height and thickness
DS2761X
J-STD-004 sn63pb37
|
PDF
|
1292 BGA
Abstract: amkor flip flip chip bga 0,8 mm FOOTPRINTS USE BY AMKOR Flip Chip Substrate X3941 amkor
Text: LAMINATE data sheet Super FC Features: Super FC® Packages: Amkor’s SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the
|
Original
|
|
PDF
|
|
|
PCN0715
Abstract: ABF-SH9K ABF-GX3 altera date code altera SOP top marking kyocera date code marking ic 2008 EP1S60 ALTERA 484 BGA packages PART MARKING
Text: Revision: 1.1.1 PROCESS CHANGE NOTIFICATION PCN0715 ALTERNATE KYOCERA SUBSTRATE FOR FLIP-CHIP PACKAGES Change Description This is an update to PCN0715, published Oct 2007. Altera is introducing an alternate Kyocera substrate as an additional source for the Stratix FPGA Flip-Chip packages. This change is being
|
Original
|
PCN0715
PCN0715,
JESD46-C,
PCN0715
ABF-SH9K
ABF-GX3
altera date code
altera SOP top marking
kyocera date code
marking ic 2008
EP1S60
ALTERA 484 BGA packages PART MARKING
|
PDF
|
104 K1C capacitor
Abstract: 200nf capacitor EIA-RS-198 S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T143P3FC4AA LICA3T183M3FC4AA LICA3T204M5FC1AA LICA3T253M1FC4AA
Text: TECHNICAL INFORMATION LICA LOW INDUCTANCE CAPACITOR ARRAY FLIP-CHIP APPLICATION NOTES by Jeff Cantlebary AVX Corporation LICA (LOW INDUCTANCE CAPACITOR ARRAY) FLIP-CHIP APPLICATION NOTES Introduction The rapid changes occurring in the semiconductor industry are requiring new
|
Original
|
H20-080
104 K1C capacitor
200nf capacitor
EIA-RS-198
S55S
LICA3T104P1FC1AA
LICA3T134M1FC1AA
LICA3T143P3FC4AA
LICA3T183M3FC4AA
LICA3T204M5FC1AA
LICA3T253M1FC4AA
|
PDF
|
0402 resistor ipc-7351
Abstract: ch-0505 resistors vishay ch0805 500R CHKIT-0402 CH1206
Text: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound or flip chip)
|
Original
|
2002/95/EC
18-Jul-08
0402 resistor ipc-7351
ch-0505
resistors vishay
ch0805
500R
CHKIT-0402
CH1206
|
PDF
|
6309-1
Abstract: No abstract text available
Text: VFC2512 Vishay Foil Resistors High Precision Flip Chip, Patents Pending Industrialized Countries FEATURES Product may not be to scale VFC2512 is a Precision Surface Mount Flip Chip Resistor that utilizes Ultra Precision Bulk Metal “Z” Foil (BMZF) for
|
Original
|
VFC2512
50ppm/year
750mW
VFC2512
249R00
10K000
14-Nov-03
6309-1
|
PDF
|
IPC-9701
Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Text: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the
|
Original
|
MS-034
15mm-42
IPC-9701
Amkor mold compound
coreless substrate
amkor flip
"IPC-9701"
|
PDF
|
6309-1
Abstract: VFC2512
Text: VFC2512 Vishay Foil Resistors High Precision Flip Chip, Patents Pending Industrialized Countries FEATURES Product may not be to scale VFC2512 is a Precision Surface Mount Flip Chip Resistor that utilizes Ultra Precision Bulk Metal “Z” Foil (BMZF) for
|
Original
|
VFC2512
VFC2512
13-Aug-04
6309-1
|
PDF
|
FC-BGA
Abstract: T0812012 daewon tray
Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
|
Original
|
AN-659-1
FC-BGA
T0812012
daewon tray
|
PDF
|
Die Attach epoxy stamping
Abstract: Ablebond 8380 APN3001
Text: APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in developing a process using epoxy as the attachment material for
|
Original
|
APN3001:
Die Attach epoxy stamping
Ablebond 8380
APN3001
|
PDF
|
Untitled
Abstract: No abstract text available
Text: VFC2512 Vishay Foil Resistors High Precision Flip Chip, Patents Pending Industrialized Countries FEATURES Product may not be to scale VFC2512 is a Precision Surface Mount Flip Chip Resistor that utilizes Ultra Precision Bulk Metal “Z” Foil (BMZF) for
|
Original
|
VFC2512
50ppm/year
750mW
VFC2512
249R00
10K000
21-Jul-03
|
PDF
|
Alternator regulator
Abstract: transistor marking ld3 Alternator Voltage Regulator Darlington motorola darlington power transistor
Text: MOTOROLA MCCF33096 SEMICONDUCTOR TECHNICAL DATA Advance Information Darlington Drive Flip-Chip The MCCF33096 is a Darlington Flip-Chip designed for use with the MCCF33095 Flip-Chip as a lamp driver in automotive charging systems. The MCCF33095 and MCCF33096, when used with an appropriate Motorola Power
|
OCR Scan
|
MCCF33096
MCCF33096
MCCF33095
MCCF33096,
Alternator regulator
transistor marking ld3
Alternator Voltage Regulator Darlington
motorola darlington power transistor
|
PDF
|
