footprint dip 16
Abstract: footprint plcc 32 40 pin zif connector 40 pin zif socket zif 40 pin socket 14 pin plcc socket IC51-0444-400 PDZ 44 plcc socket 44 PLCC socket Yamaichi
Text: PA44-40-01-PD Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect a PLCC package to a 40 pin DIP footprint. They allow programming of some 44 PLCC devices in their 40 DIP footprint.
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Original
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PA44-40-01-PD
socket/40
Z86C21/
E61dapter
PA44-40-01-PD
PA44-40-01-PDZ
444001PD
footprint dip 16
footprint plcc 32
40 pin zif connector
40 pin zif socket
zif 40 pin socket
14 pin plcc socket
IC51-0444-400
PDZ 44
plcc socket 44 PLCC
socket Yamaichi
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PDF
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footprint dip 16
Abstract: footprint plcc 32 40 pin zif connector PLCC-44 footprint 40 pin zif socket footprint dip PDZ 44 zif 40 pin socket 44 pin plcc socket 4033
Text: PA44-40-33-PD Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect a PLCC package to a 40 pin DIP footprint. They allow programming of some 44 PLCC devices in their 40 DIP footprint.
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Original
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PA44-40-33-PD
socket/40
Z86E30/
PA44-40-33-PD
PA44-40-33-PDZ
444033PD
footprint dip 16
footprint plcc 32
40 pin zif connector
PLCC-44 footprint
40 pin zif socket
footprint dip
PDZ 44
zif 40 pin socket
44 pin plcc socket
4033
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PDF
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Untitled
Abstract: No abstract text available
Text: PA51-QD -03, -14C or -16 Data Sheet 44 pin PQFP or TQFP socket/40 pin DIP 0.6” plug Supported Device/Footprints These adapters allows programming of many QFP devices in their DIP footprint. The following is a partial list. The following devices are supported using the indicated footprint.
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Original
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PA51-QD
socket/40
8751H,
87C51,
87C52,
87C51-FA,
87C51FB,
87C51-FC,
87C528,
87C652,
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PDF
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Untitled
Abstract: No abstract text available
Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PGA207PA
LH0084CD
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
|
PDF
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ASTM 240
Abstract: ASTM-B16-85 LH0084CD PGA207PA NATIONAL SEMI 16 pin dip
Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is black FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PGA207PA
LH0084CD
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N290.
ASTM 240
ASTM-B16-85
NATIONAL SEMI 16 pin dip
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PDF
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Untitled
Abstract: No abstract text available
Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
|
Original
|
PGA207PA
LH0084CD
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is black FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
|
PGA207PA
LH0084CD
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N290.
|
PDF
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TEMAC
Abstract: verilog code for mdio protocol application TEMAC XAPP807 ML403 binary to lcd verilog code virtex-4 fx12 ppc405 ug071 JTGC405TCK
Text: Application Note: Virtex-4 FX Family R XAPP807 v1.3 January 17, 2007 Summary Minimal Footprint Tri-Mode Ethernet MAC Processing Engine Author: Jue Sun, Harn Hua Ng, and Peter Ryser The Tri-Mode Ethernet MAC (TEMAC) UltraController-II module is a minimal footprint,
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Original
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XAPP807
PPC405)
xapp807
XAPP719.
TEMAC
verilog code for mdio protocol
application TEMAC
ML403
binary to lcd verilog code
virtex-4 fx12
ppc405
ug071
JTGC405TCK
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PDF
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CRM1076DJ
Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076
Text: 44-Lead Quad Flat Pack QFP Footprint & Package Change Product Change Notice PCN1102 (v1.0) December 01, 2011 Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.
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Original
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44-Lead
PCN1102
QR-1003
100-Lead
QR-1131
CRM1076DJ
CRM-1076DJ-G
crm1076
SUMITOMO g600f
LQFP-100 footprint
ABLEBONd 84-1
Holt
3717p
100LQFP
CRM*1076
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PDF
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Virtex-4
Abstract: virtex-4 fx12 DS-KIT-FX12MM1 networking SOCKET CONNECTION DIAGRAM xilinx vhdl rs232 code virtex memec lcd module verilog DS-KIT-FX12MM1-BASE LCD module in VHDL xilinx USB cable
Text: Virtex-4 FX12 Mini-Module The Memec Virtex-4 FX12 Mini-Module Development Kit provides a low cost, small footprint, fully integrated “system-on-a-module” ideal for high performance embedded applications. Features Mini-Module Small Footprint 30 mm x 65.5 mm
|
Original
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RS232
ThIT-FX12MM1-EDK
DS-KIT-FX12MM1-EDK-EURO
DS-KIT-FX12MM1-BASE
DS-KIT-FX12MM1-BASE-EURO
DS-KIT-FX12MM1
DS-KIT-FX12MM1-EURO
MG028-05)
Virtex-4
virtex-4 fx12
DS-KIT-FX12MM1
networking SOCKET CONNECTION DIAGRAM
xilinx vhdl rs232 code
virtex memec
lcd module verilog
DS-KIT-FX12MM1-BASE
LCD module in VHDL
xilinx USB cable
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PDF
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Untitled
Abstract: No abstract text available
Text: LUXEON 4014 Compact footprint delivering high-efficacy and just the right amount of light Introduction The LUXEON 4014 low-power package is the first of its kind from Philips Lumileds. Initial offering in 4000K/80 CRI in a compact 4.0x1.4x0.7mm footprint, it delivers quality of light needed
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Original
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4000K/80
DS205
|
PDF
|
resistor metal GLAZE 120 ohm 2 1W IRC
Abstract: IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
Text: HIGH POWER DENSITY METAL GLAZE SURFACE MOUNT POWER RESISTOR ISO-9001 Registered MRC SERIES Metal GlazeTM thick film element fired at 1000°C to solid ceramic substrate 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint)
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Original
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ISO-9001
EIA-481:
resistor metal GLAZE 120 ohm 2 1W IRC
IRC MAR
MRC 058 datasheet
1R00
51R0
R250
EFB810-3/4-3/mrc 736
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PDF
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18013
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
18013
|
PDF
|
1109814
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
|
Original
|
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
1109814
|
PDF
|
|
|
1109814
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
1109814
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
|
PDF
|
18012
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
18012
|
PDF
|
1109814
Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Text: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
|
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
1109814
8 soic pcb footprint
18012
ASTM-B16-85
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
003roducts
|
PDF
|
IPC 4101A
Abstract: IS410 4101A
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
IPC 4101A
4101A
|
PDF
|
Untitled
Abstract: No abstract text available
Text: T ARCONN C O N N E C T O R S Compact High Densi D-Subm iniature .200" Footprint Features ▲ Compact .200" PCB Footprint ▲ Right Angle DIP Solder Terminations A Metal Shells and Boardlocks A Popular Sizes for Computer Applications Specifications M aterials
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OCR Scan
|
DHR-15CS
|
PDF
|
OZ 9966
Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Text: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,
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OCR Scan
|
XX-350000-10
00r2S
OZ 9966
ci573
C4493
c5588
JS-05(N)K
16 soic pcb footprint
MIL-T-10727
soic footprint
8 soic pcb footprint
IT43
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Model 533 Miniature TCXO CTS Reeves FREQUENCY PRODUCTS Features: • • • • Frequency Range 5 to 30 MHz Stabilities as low as ±1.0 ppm Small Footprint - Only 1.02" x .62 Mechanical Frequency Adjust The CTS Reeves Model 533 is a high stability TCXO with a 14 pin DIL compatible footprint.
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Model 533 Miniature TCXO CTS Reeves FREQUENCY PR O D U C TS Features: • • • • Frequency Range 5 to 30 MHz Stabilities as low as ±1.0 ppm Small Footprint - Only 1.02" x .62 Mechanical Frequency Adjust The CTS Reeves Model 533 is a high stability TCXO with a 14 pin DIL compatible footprint.
|
OCR Scan
|
Aging2000
|
PDF
|
