1109814
Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Text: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
1109814
8 soic pcb footprint
18012
ASTM-B16-85
|
18013
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
|
Original
|
PDF
|
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
18013
|
1109814
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
|
Original
|
PDF
|
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
1109814
|
Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
|
18012
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
18012
|
Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
|
1109814
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
1109814
|
Untitled
Abstract: No abstract text available
Text: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
003roducts
|
8 soic pcb footprint
Abstract: IPC4101A 1109814
Text: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
|
Original
|
PDF
|
FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
MIL-G-45204
SAE-AMS-QQ-N-290.
1109814-RC
18013RC
8 soic pcb footprint
IPC4101A
1109814
|
Untitled
Abstract: No abstract text available
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
|
Original
|
PDF
|
IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
|
IPC 4101A
Abstract: IS410 4101A
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
|
Original
|
PDF
|
IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
IPC 4101A
4101A
|
TG110-RPE5N5
Abstract: No abstract text available
Text: Remote Power - Ultra 10/100BASE-TX SOIC-16 Magnetic Modules Remote Power - Ultra™ 10/100BASE-TX SOIC-16 Magnetic Modules HALO Electronics is pleased to offer the RP-Ultra™, the industry’s first “PoE” version of the small footprint SOIC-16. IEEE802.3af compliant with 350 mA current capability in
|
Original
|
PDF
|
10/100BASE-TX
SOIC-16
10/100BASE-TX
SOIC-16.
IEEE802
500Vrms
1-100MHz)
TG110-RPE5N5
|
AN-100
Abstract: CPC7583 GR-1089-CORE J-STD-020A
Text: CPC7583 Line Card Access Switch Features Description • Small 28-pin SOIC or micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs, and 60% smaller footprint than SOIC version • Monolithic IC reliability
|
Original
|
PDF
|
CPC7583
28-pin
DS-CPC7583-R
AN-100
CPC7583
GR-1089-CORE
J-STD-020A
|
AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Text: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability
|
Original
|
PDF
|
CPC7582
16-pin
DS-CPC7582-R04
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
|
|
|
Untitled
Abstract: No abstract text available
Text: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.
|
Original
|
PDF
|
CPC7582
16-pin
DS-CPC7582-R05
|
Untitled
Abstract: No abstract text available
Text: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.
|
Original
|
PDF
|
IRF7521D1
|
Untitled
Abstract: No abstract text available
Text: PA5114-20SO Data Sheet 20 pin SOIC socket/40 pin DIP plug Supported Device/Footprints Adapter Construction Using these adapters ATMEL AT89C5114 devices in 20 pin SOIC packages can be programmed using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via
|
Original
|
PDF
|
PA5114-20SO
socket/40
AT89C5114
AT89C5114,
AT89C5116
FP-20
20SOIC
40DIP
|
TG110-RP55N5
Abstract: TG110-RPE5N5 footprint soic footprint soic16 tg110rp55n5 10/100 BASE Isolation Modules HALO N5 SOIC-16 HALO TG110-RPE5N5 tg110-rp55n
Text: 10/100BASE-TX MAGNETIC MODULES Remote Power - Ultra 10/100BASE-TX SOIC-16 Magnetic Modules HALO Electronics is pleased to offer the RP-Ultra™, the industry’s first “Remote Power” version of the small footprint SOIC-16. IEEE802.3af compliant with 350 mA current capability in both commercial and industrial temperature ranges. The RP-Ultra™ is ideal for
|
Original
|
PDF
|
10/100BASE-TX
SOIC-16
SOIC-16.
IEEE802
500Vrms
1-100MHz)
-38dB
TG110-RP55N5
TG110-RPE5N5
footprint soic
footprint soic16
tg110rp55n5
10/100 BASE Isolation Modules
HALO N5
HALO TG110-RPE5N5
tg110-rp55n
|
6343 opto
Abstract: SFH6316-HCPL0501 SFH6343-HCPL0453 HCPL0453 HCPL0500 HCPL0501 SFH6315 SFH6316 SFH6343 6316 opto
Text: SFH6315 SFH6316 SFH6343 High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:
|
Original
|
PDF
|
SFH6315
SFH6316
SFH6343
SFH6343)
SFH6315--HCPL0500
SFH6316--HCPL0501
SFH6343--HCPL0453
SFH6315/16/43,
1-888-Infineon
SFH6315/6316/6343
6343 opto
SFH6316-HCPL0501
SFH6343-HCPL0453
HCPL0453
HCPL0500
HCPL0501
SFH6315
SFH6316
SFH6343
6316 opto
|
6343 opto
Abstract: HCPL0453 HCPL0500 HCPL0501 SFH6315T SFH6316T SFH6343 SFH6343T
Text: SFH6315T SFH6316T SFH6343T High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:
|
Original
|
PDF
|
SFH6315T
SFH6316T
SFH6343T
SFH6343)
SFH6315T--HCPL0500
SFH6316T--HCPL0501
SFH6343T--HCPL0453
SFH6315/6
SFH6315T/16T/43T,
1-888-Infineon
6343 opto
HCPL0453
HCPL0500
HCPL0501
SFH6315T
SFH6316T
SFH6343
SFH6343T
|
OZ 9966
Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Text: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,
|
OCR Scan
|
PDF
|
XX-350000-10
00r2S
OZ 9966
ci573
C4493
c5588
JS-05(N)K
16 soic pcb footprint
MIL-T-10727
soic footprint
8 soic pcb footprint
IT43
|
6343 SOIC-8
Abstract: 6316T
Text: SFH6315T SFH6316T SFH6343T *•— Infineon technologies High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS
|
OCR Scan
|
PDF
|
SFH6315T
SFH6316T
SFH6343T
SFH6315/6
SFH6343)
SFH6315T--
HCPL0500
SFH6316T--
HCPL0501
SFH6343T--
6343 SOIC-8
6316T
|
soic8 footprint
Abstract: K0452 6N135 6N136 E55361 HCPL-0452 HCPL-0453 HCPL-0500 HCPL-0501 HCPL-45
Text: Whn\ HEWLETT PACKARD Small Outline High Speed Optocouplers Technical Data Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Very High Common Mode Transient Immunity:
|
OCR Scan
|
PDF
|
HCPL-0500
HCPL-0501
HCPL-0452
HCPL-0453
HCPL-0453)
E55361)
soic8 footprint
K0452
6N135
6N136
E55361
HCPL-45
|
CPL0701
Abstract: AN 951-1
Text: Ihp% HEWLETT mi'fim PACKARD Small Outline Low Input Current, High Gain Optocouplers Technical Data HCPL-0700 HCPL-0701 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible With Infrared Vapor Phase Reflow and Wave Soldering Processes
|
OCR Scan
|
PDF
|
HCPL-0700
HCPL-0701
E55361)
CPL0701
AN 951-1
|
