18013
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
18013
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PDF
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1109814
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
1109814
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
|
PDF
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Untitled
Abstract: No abstract text available
Text: TaNFilm Flat Precision TaNFilm Flat Precision Resistor® Array Resistor Array SON Series Welwyn Components • Compatible with standard SOIC footprint 210 Series · temperature performance Tested for Applications •· Compatible withCOTS standard SOIC footprint (210 Series)
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Original
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MIL-PRF-83401
10kFB
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PDF
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18012
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
18012
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
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PDF
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1109814
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
1109814
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PDF
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1109814
Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Text: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
1109814
8 soic pcb footprint
18012
ASTM-B16-85
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PDF
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Untitled
Abstract: No abstract text available
Text: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
003roducts
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PDF
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8 soic pcb footprint
Abstract: IPC4101A 1109814
Text: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
MIL-G-45204
SAE-AMS-QQ-N-290.
1109814-RC
18013RC
8 soic pcb footprint
IPC4101A
1109814
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PDF
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OZ 9966
Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Text: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,
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OCR Scan
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XX-350000-10
00r2S
OZ 9966
ci573
C4493
c5588
JS-05(N)K
16 soic pcb footprint
MIL-T-10727
soic footprint
8 soic pcb footprint
IT43
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PDF
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TG110-RPE5N5
Abstract: No abstract text available
Text: Remote Power - Ultra 10/100BASE-TX SOIC-16 Magnetic Modules Remote Power - Ultra™ 10/100BASE-TX SOIC-16 Magnetic Modules HALO Electronics is pleased to offer the RP-Ultra™, the industry’s first “PoE” version of the small footprint SOIC-16. IEEE802.3af compliant with 350 mA current capability in
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Original
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10/100BASE-TX
SOIC-16
10/100BASE-TX
SOIC-16.
IEEE802
500Vrms
1-100MHz)
TG110-RPE5N5
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PDF
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AN-100
Abstract: CPC7582BC EIA-481-2 J-STD-020A 5510P
Text: CPC7584 Line Card Access Switch Description • Small 16-pin SOIC or micro-leadframe package • Micro-leadframe package MLP printed circuit board footprint is 70% smaller than 4TH generation EMRs and 60% smaller than SOIC version • Monolithic IC reliability
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Original
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CPC7584
16-pin
CPC7584
DS-CPC7584
AN-100
CPC7582BC
EIA-481-2
J-STD-020A
5510P
|
PDF
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AN-100
Abstract: CPC7583 GR-1089-CORE J-STD-020A
Text: CPC7583 Line Card Access Switch Features Description • Small 28-pin SOIC or micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs, and 60% smaller footprint than SOIC version • Monolithic IC reliability
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Original
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CPC7583
28-pin
DS-CPC7583-R
AN-100
CPC7583
GR-1089-CORE
J-STD-020A
|
PDF
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|
|
k1b0
Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
Text: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability
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Original
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CPC7581
16-pin
DS-CPC7581-R3
k1b0
AN-100
CPC7581
EIA-481-2
J-STD-020A
IPC-9502
|
PDF
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AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
Text: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability
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Original
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CPC7582
16-pin
DS-CPC7582-R3
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
J-STD-020A
|
PDF
|
5 pin relay NO NC
Abstract: AN-100 CPC7581 EIA-481-2 GR-1089-CORE J-STD-033 pin plating microinch
Text: Not for New Designs CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or DFN package • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions.
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Original
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CPC7581
16-pin
DS-CPC7581-R05
5 pin relay NO NC
AN-100
CPC7581
EIA-481-2
GR-1089-CORE
J-STD-033
pin plating microinch
|
PDF
|
AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Text: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability
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Original
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CPC7582
16-pin
DS-CPC7582-R04
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
|
PDF
|
AN-100
Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Text: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.
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Original
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CPC7582
16-pin
DS-CPC7582-R05
AN-100
CPC7582
CPC7582BC
EIA-481-2
GR-1089-CORE
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.
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Original
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CPC7582
16-pin
DS-CPC7582-R05
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PDF
|
Untitled
Abstract: No abstract text available
Text: PA5114-20SO Data Sheet 20 pin SOIC socket/40 pin DIP plug Supported Device/Footprints Adapter Construction Using these adapters ATMEL AT89C5114 devices in 20 pin SOIC packages can be programmed using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via
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Original
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PA5114-20SO
socket/40
AT89C5114
AT89C5114,
AT89C5116
FP-20
20SOIC
40DIP
|
PDF
|
Untitled
Abstract: No abstract text available
Text: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.
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Original
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IRF7521D1
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PDF
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Untitled
Abstract: No abstract text available
Text: TANSILâ 0.050'' LEAD PITCH SURFACE MOUNT RESISTOR NETWORK ISO-9001 Registered SOIC SERIES • Ultra-Stable TaNSilâ resistors on silicon IRC's TaNSilâ SOIC resistor networks are ideally suited for high volume applications that demand a small printed wiring board footprint. The .05 inch lead spacing provides higher lead density, increased component count,
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Original
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ISO-9001
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PDF
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AMERICAN MICROSYSTEMS
Abstract: No abstract text available
Text: FS6286 Dual PLL Clock Generator IC AMERICAN MICROSYSTEMS, INC. December 2000 1.0 Features 2.0 Description • Dual phase-locked loop PLL device with three output clock frequencies • 3.3V supply voltage • Small circuit board footprint (8-pin 0.150″ SOIC)
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Original
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FS6286
FS6286
ISO9001
AMERICAN MICROSYSTEMS
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PDF
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