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    Foundry

    Contextual Info: 1 - STANDARD FOUNDRY SERVICE. 1.1. BASIC FOUNDRY SERVICE 1.2. OPTIONAL SERVICES 1.3. SEQUENCE OF EVENTS DURING A FOUNDRY PROJECT ,245 2 - MULTI-PROJECT A PPROACH .


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    mmic p07

    Abstract: hp mmic p07
    Contextual Info: MICROWAVE GaAs STANDARD FOUNDRY SERVICE 1 - STANDARD FOUNDRY SERVICE 1.1. BASIC FOUNDRY SERVICE T he standard approa ch en ables a single cu sto ­ m er to im ple m en t one or several chip designs o r d e s ig n v a r ia tio n s on a s a m e re tic le an d


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    ldss/100 ldss/100 mmic p07 hp mmic p07 PDF

    CMOS

    Contextual Info: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications


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    3335

    Abstract: PIN-Photodiode-Array PHOTODIODE 4 CHANNEL ARRAY photodiode die WAFER Photodiode Array EMCORE photodiode array
    Contextual Info: 1 x 12 GaAs PIN Photodiode Array Product Description EMCORE’s 12 channel Gallium Arsenide GaAs PIN photodiode array is designed for multimode fiber applications. Utilizing EMCORE’s own state-of-the-art MOCVD wafer foundry and device fabrication facility guarantees a reliable high volume fabrication source of package ready die to meet the growing


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    100x150 3335 PIN-Photodiode-Array PHOTODIODE 4 CHANNEL ARRAY photodiode die WAFER Photodiode Array EMCORE photodiode array PDF

    30X30

    Contextual Info: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services Rad-Hard Process 1.2µm Double Poly, Double Metal Standard Features ❖ ❖ ❖ ❖ UTIX Stepper Double poly Double metal 5V max operating voltage


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    250kRad 30X30) 30X30 PDF

    0.7 um CMOS process parameters

    Abstract: 30X30
    Contextual Info: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services 0.6µm CMOS Process Standard Features ❖ ❖ ❖ ❖ Standard Layout Rules and Process Parameters Single or double poly Double metal


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    30X30) 0.7 um CMOS process parameters 30X30 PDF

    30X30

    Abstract: SiCr resistor
    Contextual Info: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services 3.0µm N-Well CMOS Process Standard Features ❖ ❖ ❖ ❖ Standard Layout Rules and Process Parameters UTIX Stepper Single or double poly


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    30X30) 30X30 SiCr resistor PDF

    Contextual Info: MOE D • MOSSTlb 0D137Ö3 3 ■ A M I . . T - M 2 - 8 \ G ould AMI S ilic o n F ou n d ry A pproach Gould AMI is proud of the leadership position it occupies in today’s fast-paced world of process and technology. Our Silicon Foundry services and capabilities are truly world class. We pro­


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    0D137Ã PDF

    TSMC Flash

    Abstract: "ic works" Sakata XC9500
    Contextual Info: 4 Xilinx Enters Into Joint Venture for Foundry Capacity In a joint venture with United Microelectronics Corporation UMC and others, Xilinx has invested a 25% equity stake in a semiconductor manufacturing facility in Hsin Chu City, Taiwan. Xilinx is one of more than 100 semiconductor companies that use independent


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    XC9500 TSMC Flash "ic works" Sakata PDF

    XC2064

    Abstract: XC4028XLA verilog code for fir filter new ieee programs in vhdl and verilog SCR FIR 3 D XC3090 XC4005 XC4005XL XC5210 XC8106
    Contextual Info: CORE Generator System User Guide V1.5.2i XACT, XC2064, XC3090, XC4005, XC5210, XC8106, XC-DS-501, FPGA Architect, FPGA Foundry, LogiCORE, Timing Wizard, and Trace are registered trademarks of Xilinx. All XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC,


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    XC2064, XC3090, XC4005, XC5210, XC8106, XC-DS-501, XC4028EX PG299 XC2064 XC4028XLA verilog code for fir filter new ieee programs in vhdl and verilog SCR FIR 3 D XC3090 XC4005 XC4005XL XC5210 XC8106 PDF

    XC9572PC44

    Abstract: XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160
    Contextual Info: R Release Document Foundation Series 2.1i Installation Guide and Release Notes July 1999 Read This Before Installation Foundation Series 2.1i Installation Guide and Release Notes R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Timing Wizard, TRACE,


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    XC2064, XC3090, XC4005, XC5210, XC-DS501 95/98/NT, XC4000 XC9572PC44 XC9572-PC44 XCS20XL PQ208 XCS20 PQ208 XC9536-PC44 Xilinx jtag cable Schematic XC95144 PQ100 interfacing cpld xc9572 with keyboard 6552 XC4010XL PQ160 PDF

    Tektronix schematic

    Abstract: schottky transistor spice tektronix custom
    Contextual Info: TEKTRONIX INC/ INTEGRATE» EIE D a m iS M G 0D011E t> CIRCUITS OPERATION v V :£>“ • SPECIFICATIONS '^1 BIPOLAR PRODUCTS AND FOUNDRY S E R V I C E S ^ S ^ ^ v ^ V - ORDERING INFORMATIONj TEK INTEGRATED QUICKCHIP 2K FAMILY OF INTEGRATED CIRCUIT ARRAYS WITH SCHOTTKY


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    0D011E Tektronix schematic schottky transistor spice tektronix custom PDF

    intel 865 MOTHERBOARD pcb CIRCUIT diagram

    Abstract: datasheet str 5707 str 5707 vhdl code for 8-bit parity checker xcs20-tq144 up board exam date sheet 2012 symbol elektronika standard american CD 5888 pin configuration of 7486 IC GENIUS MOUSE CONTROLLER
    Contextual Info: Xilinx PCI Data Book R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Archindry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, XACTstep, XACTstep Advanced, XACTstep Foundry, XACT-Floorplanner, XACTPerformance, XAPP, XAM, X-BLOX, X-BLOX plus, XChecker, XDM, XDS, XEPLD, XPP, XSI, Foundation Series, AllianceCORE, BITA, Configurable Logic Cell, CLC, Dual Block, FastCLK, FastCONNECT, FastFLASH, FastMap, HardWire,


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    XC2064, XC3090, XC4005, XC-DS501, intel 865 MOTHERBOARD pcb CIRCUIT diagram datasheet str 5707 str 5707 vhdl code for 8-bit parity checker xcs20-tq144 up board exam date sheet 2012 symbol elektronika standard american CD 5888 pin configuration of 7486 IC GENIUS MOUSE CONTROLLER PDF

    HBT transistor

    Abstract: TQHBT3 5PAE HBT 01 05G schematic mans gummel
    Contextual Info: Production Process TQHBT3 InGaP HBT Foundry Service Features • • Metal 2 - 4um • Dielectric • • Metal 1 - 2um Metal 1 - 2um Dielectric E B C Emitter MIM NiCr B Base Collector Metal 0 C • • • Sub Collector Isolation Implant Buffer & Substrate


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    Contextual Info: Not Recommended for New Designs This product was manufactured for Maxim by an outside wafer foundry using a process that is no longer available. It is not recommended for new designs. The data sheet remains available for existing users. A Maxim replacement or an industry second-source may be available.


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    REF01A /883B REF01 /883B Mil-Std-1835 REF02J/883B REF02 REF02Z/883B 426MJA/883B PDF

    atmel 042

    Abstract: atmel 550 AT56K 4072A atmel+042
    Contextual Info: SILICON AT56K - 3.3V – 0.35 µm Digital and Mixed-Signal CMOS with High Voltage Capabilities FOUNDRY SOLUTIONS FOR AUTOMOTIVE, INDUSTRIAL AND TELECOMMUNICATION ENVIRONMENTS AT56K Atmel 0.35µm is a digital and mixed-signal CMOS technology with optional functions, including analog


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    AT56K 072A-FOUN-09/04/600 atmel 042 atmel 550 4072A atmel+042 PDF

    analog bipolar DRIVER

    Abstract: BICMOS ATMEL CORPORATION
    Contextual Info: SILICON BiCMOS2: Complex Mixed-signal 1.0 µm BiCMOS Technology FOUNDRY SOLUTIONS FOR TELECOM, RF AUDIO OR VIDEO APPLICATIONS. Atmel BiCMOS2 is a 1.0 µm Bipolar and CMOS merged technology. It is well suited for complex mixed-signal processing, as it offers designers the possibility of using


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    4025B-FOUN-09/04/600 analog bipolar DRIVER BICMOS ATMEL CORPORATION PDF

    MAX907

    Abstract: MAX909 MAX907CPA MAX907CSA MAX907EPA MAX907ESA MAX908
    Contextual Info: Not Recommended for New Designs This product was manufactured for Maxim by an outside wafer foundry using a process that is no longer available. It is not recommended for new designs. The data sheet remains available for existing users. A Maxim replacement or an industry second-source may be available.


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    MAX907/MAX908/MAX909 MAX90 MAX909EPA MAX909ESA MAX909 MAX907 MAX908 MAX909 MAX907CPA MAX907CSA MAX907EPA MAX907ESA PDF

    UPL1C221MRH6

    Abstract: MAX726 CDR125 MAX724 MAX724CCK MAX724ECK MAX726CCK MAX726ECK MBR745 CTX25-5-52
    Contextual Info: Not Recommended for New Designs This product was manufactured for Maxim by an outside wafer foundry using a process that is no longer available. It is not recommended for new designs. The data sheet remains available for existing users. A Maxim replacement or an industry second-source may be available.


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    MAX724/MAX726 MAX724 MAX726 O-220 UPL1C221MRH6 CDR125 MAX724CCK MAX724ECK MAX726CCK MAX726ECK MBR745 CTX25-5-52 PDF

    Contextual Info: TEKTRONI X/ TRI ÖUINT 2SE D fliObSl 00GQ1G3 5 Product Summary_ O m Custom Foundry Products and Services GaAs Process Parameter 1D&1A HA QED QED/A D-Mode D Mode IDSSE -1.5V n/a 150mA n/a -1.6V n/a 160mA n/a D Mode EMode -0.60V 0.15V 60mA 40mA


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    00GQ1G3 150mA 160mA 230mA 15GHz 21GHz 380x380 14-0503-C PDF

    TQTRX

    Abstract: TQ5M31 TQ3M31 79GHz 121GHz mesfet
    Contextual Info: Production Process TQTRx GaAs MESFET Foundry Service Features Metal 2 - 4um Metal 2 • Dielectric Metal 1 • Dielectric Metal 1 - 2um Metal 1 • Dielectric NiCr MIM Metal Metal 0 N+ N+ Isolation Implant N-/P- Channel E,D,G MESFET NiCr Resistor MIM Capacitor


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    NeoCAD

    Abstract: XC3000 XC3000A XC3100 XC3100A XC4000 XACT
    Contextual Info: Upgrading to NeoCAD FPGA Foundry Both the XACT Development Sys- contains both the XACT and FPGA TM tem and NeoCAD’s FPGA FoundryTM are available for implementing designs in the XC3000 and XC4000 FPGA families. Each has its respective strengths; for some


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    XC3000 XC4000 NeoCAD XC3000A XC3100 XC3100A XACT PDF

    AM686

    Abstract: 9698 am686 equivalent LT1016 MAX9686 MAX9686CJA MAX9686CPA MAX9686CSA MAX9686CTV MAX9698
    Contextual Info: Not Recommended for New Designs This product was manufactured for Maxim by an outside wafer foundry using a process that is no longer available. It is not recommended for new designs. The data sheet remains available for existing users. A Maxim replacement or an industry second-source may be available.


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    LT1016, Am686 AM686 9698 am686 equivalent LT1016 MAX9686 MAX9686CJA MAX9686CPA MAX9686CSA MAX9686CTV MAX9698 PDF

    Contextual Info: MMIC Based Components ii % Title Page Microwave Multi-Function Hybrid and MMIC Chip Assembly Capabilities. 1-3 IC Foundry


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