s18 p281 c8
Abstract: S10 K35 MB91V460 schematic usb to lan cable adapter LQFP-176P MB2198-10 MB91460 ssram
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71049-1E DSU-FR EMULATOR BGA-660P ADAPTER MB2198-300 OPERATION MANUAL PREFACE • Purpose and intended readership of this manual Thank you for purchasing the BGA-660P adapter for the DSU-FR emulator MB2198-300 *1.
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SS01-71049-1E
BGA-660P
MB2198-300
MB2198-300)
LQFP-176P
MB2198-301)
MB2198-01)
MB219810)
MB91460
s18 p281 c8
S10 K35
MB91V460
schematic usb to lan cable adapter
MB2198-10
ssram
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P262
Abstract: bga P267 LQFP-176P MB91V460 schematic usb to lan cable adapter MB2198-10 MB91460
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71069-1E DSU-FR EMULATOR BGA-660P ADAPTER TYPE2 MB2198-300A OPERATION MANUAL PREFACE • Purpose and intended readership of this manual Thank you for purchasing the BGA-660P adapter type2 for the DSU-FR emulator model number:
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SS01-71069-1E
BGA-660P
MB2198-300A
MB2198-300A)
LQFP-176P
MB2198-301)
MB2198-01)
MB2198-10)
MB91460
P262
bga P267
MB91V460
schematic usb to lan cable adapter
MB2198-10
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY FAILSAFE FUSE RESISTORS CUSTOM DESIGN - 1/8 WATT to 50 WATT RESISTORS wCOILSwDELAY LINES FR SERIES Precision Grade Fuse Resistors! FEATURES RCD’s FR Series was designed to obtain the best from two devices. It combines the performance of a precision grade
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MAR8
Abstract: came dir10 BMP31 japanese TRANSISTOR SUBSTITUTION DATA BOOK MB91401 Philips ID33 A12-212 smi 290 servo bit319 EXD03
Text: FUJITSU SEMICONDUCTOR Prelminary 2004.11.12 CONTROLLER MANUAL FR 32 bit Microcontroller MB91401 Hardware Manual FR 32 bit Microcontroller MB91401 Hardware Manual FUJITSU LIMITED Preface • Purpose and object reader in this book Thank you very much for giving patronage that is more special than the much
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MB91401
dir10
dir10/4
MAR8
came dir10
BMP31
japanese TRANSISTOR SUBSTITUTION DATA BOOK
MB91401
Philips ID33
A12-212
smi 290 servo
bit319
EXD03
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Untitled
Abstract: No abstract text available
Text: CONDENSATEURS CHIPS CERAMIQUE MULTICOUCHES HYPERFREQUENCE MICROWAVE MULTILAYER CERAMIC CHIP CAPACITORS GENERALITES GENERAL INFORMATION A des fréquences inférieures à la fréquence de résonance voir fig. 83 , un condensateur peut être considéré comme une capacité pure Cs en série avec
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F-67441
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marking j9 sot-23
Abstract: No abstract text available
Text: BZX84C Series Zener Voltage Regulators SOT-23 1 1.02 0.89 2.04 1.78 225 mW Rating on FR-4 or FR-5 Board Zener Breakdown Voltage Range 2.4 V to 75 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications
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BZX84C
OT-23
OT-23
BZX84C27
BZX84C30
BZX84C33
BZX84C36
BZX84C39
BZX84C43
BZX84C47
marking j9 sot-23
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FR1206
Abstract: FR1206JR YAGEO RC1206 cd 4611 FR0603 resistor 240 RESISTOR FOOTPRINT 1206 YAGEO CHIP RESISTORS MARKING RC0603 YNSC056 FR4 epoxy dielectric constant 4.2
Text: DATA SHEET FUSIBLE CHIP RESISTORS FR series Pb Free 5% Product specification – Sep 26, 2005 V.0 sizes 0603/1206 2 Product specification Chip Resistor Surface Mount FR SERIES 11 0603/1206 (Pb Free) SCOPE This specification describes FR0603/1206 fusible chip resistors with leadfree terminations made by thick film process.
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FR0603/1206
FR1206
FR1206JR
YAGEO RC1206
cd 4611
FR0603
resistor 240
RESISTOR FOOTPRINT 1206
YAGEO CHIP RESISTORS MARKING RC0603
YNSC056
FR4 epoxy dielectric constant 4.2
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YAGEO RC0603
Abstract: FR4 epoxy dielectric constant 4.2 marking code fu RESISTOR FOOTPRINT 1206 232275062001 FRC01 marking code mp MIL-R-55342D MP 1008 es tu marking
Text: DATA SHEET FUSIBLE CHIP RESISTORS FR series Pb Free 5% Product specification – Sep 26, 2005 V.0 sizes 0603/1206 Product specification Chip Resistor Surface Mount FR SERIES SCOPE 2 11 0603/1206 (Pb Free) APPLICATIONS Power supply in small equipment This specification describes FR0603/1206 fusible chip resistors with leadfree terminations made by thick film process.
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FR0603/1206
YAGEO RC0603
FR4 epoxy dielectric constant 4.2
marking code fu
RESISTOR FOOTPRINT 1206
232275062001
FRC01
marking code mp
MIL-R-55342D
MP 1008 es
tu marking
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3M DP100
Abstract: Oakite E61941
Text: 3 Scotch-Weld TM Epoxy Adhesive DP100 FR Technical Data July, 2011 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP100 FR is a two-part flame retardant self-extinguishing version of Scotch-Weld DP100. It meets the UL94 V-O Burn Test requirements and has a work life of 4-8 minutes after mixing. It is ideal for
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DP100
DP100.
E61941)
225-3S-06
3M DP100
Oakite
E61941
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DP100
Abstract: 1876-61T Oakite 3M DP100 oils bulk modulus DP100FR ASTM D 2240 800-362
Text: 3 Scotch-Weld TM Epoxy Adhesive DP100 FR Technical Data July, 2011 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP100 FR is a two-part flame retardant self-extinguishing version of Scotch-Weld DP100. It meets the UL94 V-O Burn Test requirements and has a work life of 4-8 minutes after mixing. It is ideal for
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DP100
DP100.
E61941)
225-3S-06
517-DP100FR
DP100FR
1876-61T
Oakite
3M DP100
oils bulk modulus
DP100FR
ASTM D 2240
800-362
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headlight sensor
Abstract: No abstract text available
Text: THICK FILM 72 | www.acptechnologies.com | THICK FILM Thick-film applications or printed circuit resistors are applications of resistive, dielectric and/or conductive pastes on a wide range of substrates FR, CEM, alumina, plastic, polyester , according to a
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000cycles
headlight sensor
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number CD2010 Series Product Line Diode Products Compliance Date 11 Nov 2006 RoHS Compliant No. Construction Element subpart Yes MSL Homogeneous Material 1 FR-5 Substrate 2 Wafer Die 1 Material weight [g] 0.012000 0.000479
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CD2010
18-march
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ON 4998
Abstract: 25085
Text: MATERIAL DECLARATION SHEET Material Number CD2320 Series Product Line Diode Products Compliance Date 1 Jan 2006 RoHS Compliant Yes No. 1 Construction Element subpart FR-5 MSL Homogeneous Material Substrate Material weight [g] 0.0392 2 GPRC Chip Die 0.0056
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CD2320
Bisphen01
ON 4998
25085
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chip die
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number CD1206 Series Product Line Diode Products Compliance Date 1 Jan 2005 RoHS Compliant Yes No. 1 Construction Element subpart FR-5 MSL Homogeneous Material Substrate Material weight [g] 0.003742 2 Wafer Chip Die 0.0056
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CD1206
Bisphen01
chip die
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LW 6052
Abstract: No abstract text available
Text: FAILSAFE FUSE RESISTORS CUSTOM DESIGN - 1/8W to 50 WATT FR SERIES FEATURES Precision Grade Fuse Resistors! • ■ RCD’s FR series was designed to obtain the best from two devices. It combines the perform ance of a precision grade resistor with precisely controlled fusing characteristics.
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LW - 6052
Abstract: LW 6052
Text: FAILSAFE FUSE RESISTORS CUSTOM DESIGN - 1/8W to 50 WATT FR SERIES FEATURES Precision Grade Fuse Resistors! • ■ RCD's FR series was designed to obtain the best from two devices. It combines the perform ance of a precision grade resistor with precisely controlled fusing characteristics.
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TT 6053
Abstract: tic 253
Text: FAILSAFE FUSE RESISTORS CUSTOM DESIGN - 1/8W to 50 WATT FR SERIES FEATURES Precision Grade Fuse Resistors! • ■ R CD’s FR series was designed to obtain the best from two devices. It com bines the perform ance of a precision grade resistor with precisely controlled fusing characteristics.
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Untitled
Abstract: No abstract text available
Text: h a fr fr is CD74FCT273T, CD74FCT2273T S E M I C O N D U C T O R Fast CMOS Octal D Flip-Flop with Master Reset December 1996 Features Description • Advanced 0.8 micron CMOS Technology The CD74FCT273T and CD74FCT2273T are 8-bit wide octal designed with eight edge-triggered D-type flip-flops
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CD74FCT273T,
CD74FCT2273T
CD74FCT273T
CD74FCT2273T
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151-ETQP2H
Abstract: 1R2B
Text: ft fr Date of Issue : 2002^4^240 April 24,2002_ * fr K # C lassificatio n : ff« « _ LJ Change New D igj-kev A À tt I t PRODUCT SPECIFICATION FOR INFORMATION m ¿s * » Product Description : P O W E R C H O K E C O IL SI o°« n°n # Product Part Number
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TlPC-02026
151-ETQP2H
1R2B
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Untitled
Abstract: No abstract text available
Text: IDT 7MB4009 2 16K x 16 CMOS STATIC RAM FR-4 DIP MODULE FEATURES: DESCRIPTION: • H ig h D en sity 512K 2(16K x 16) S ta tic RAM M odule • C ost effective surface m o un t c o m p o n e n ts m o un ted o n an e po xy lam in ate (FR-4) substrate T h e ID T7M B 4009 Is a 512K 2(16K x 16) h ig h -sp ee d static RAM
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7MB4009
IDT7198
S13-97
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Untitled
Abstract: No abstract text available
Text: Integrated Device Technology, Inc. IDT7MP4060 IDT7MP4095 128K x 32 CMOS STATIC RAM MODULES FEATURES: DESCRIPTION: • High density 4 megabit static RAM modules The IDT7M P4095/7M P4060 are 128K x 32 static RAM modules constructed on an epoxy laminate FR-4 substrate
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IDT7MP4060
IDT7MP4095
64-pin
64-lead,
72-lead
7MP4095
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8192k
Abstract: fr 4 substrate
Text: ^EDI EDI8F16512C ELECTRONIC OESIGNS INC. « Commercial Eight Megabit SRAM Module 512Kx16 Static RAM CMOS, Module Features The EDI8F16512C is a 8192K bit CMOS Static RAM based on eight 128Kx8 Static RAMs mounted on a multi layered epoxy laminate FR-4 substrate.
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EDI8F16512C
512Kx16
EDI8F16512C
8192K
128Kx8
EDI8F16512LP)
100ns
fr 4 substrate
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4045S
Abstract: No abstract text available
Text: 256K x 32 BiCMOS/CMOS STATIC RAM MODULE IDT7MP4045 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 8 megabit static RAM module The IDT7MP4045 is a 256K x 32 static RAM module constructed on an epoxy laminate FR-4 substrate using 8
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IDT7MP4045
IDT7MP4045
4045S
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Untitled
Abstract: No abstract text available
Text: 128K x 32 CMOS STATIC RAM MODULE IDT7MP4095 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 4 megabit static RAM module The IDT7MP4095 is a 128K x 32 static RAM module constructed on an epoxy laminate FR-4 substrate using four
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IDT7MP4095
64-pin
IDT7MP4095
7MP4095
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