E28F008SA
Abstract: EDI7F341MC
Text: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F341MC
1Mx32
EDI7F341MC
EDI7F2341MC
E28F008SA
EDI7F341MC-BNC:
150ns
A0-A19
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1mx8
Abstract: E28F008SA EDI7F341MC
Text: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F341MC
1Mx32
EDI7F341MC
EDI7F2341MC
E28F008SA
EDI7F341MC-BNC:
150ns
A0-A19
1mx8
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1.5528
Abstract: EDI7F33512C AM29F040 2192
Text: EDI7F33512C 512Kx32 Flash DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29F040 - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F33512C
512Kx32
EDI7F33512,
EDI7F233512
EDI7F433512
2x512Kx32
4x512Kx32
AM29F040
512Kx8
1.5528
EDI7F33512C
2192
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AM29LV004T
Abstract: EDI7F33512V
Text: EDI7F33512V 512Kx32 FLASH DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29LV004T - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F33512V
512Kx32
EDI7F33512,
EDI7F233512
EDI7F433512
2x512Kx32
4x512Kx32
AM29LV004T
512Kx8
EDI7F33512V
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MARK J3
Abstract: AM29F016 EDI7F332MC amd AM29F016
Text: EDI7F332MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F332MC
2Mx32
EDI7F332MC
EDI7F2332MC
AM29F016
EDI7F332MC-BNC:
150ns
A0-A20
MARK J3
amd AM29F016
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1mx8
Abstract: AM29LV008T EDI7F2331MV EDI7F331MV
Text: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F331MV
1Mx32
EDI7F331MV
EDI7F2331MV
AM29LV008T
EDI7F331MV-BNC:
150ns
A0-A19
1mx8
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EDI7F342MC
Abstract: E28F016S5
Text: EDI7F342MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 -2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate BLOCK DIAGRAMS
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EDI7F342MC
2Mx32
EDI7F342MC
EDI7F2342MC
E28F016S5
EDI7F342MC-BNC:
A0-A20
150ns
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EDI7F331MV
Abstract: AM29LV008T EDI7F2331MV
Text: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F331MV
1Mx32
EDI7F331MV
EDI7F2331MV
AM29LV008T
EDI7F331MV-BNC:
150ns
A0-A19
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28F016S3
Abstract: EDI7F342MV
Text: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F342MV
2Mx32
EDI7F342MV
7F2342MV
28F016S3-
EDI7F342MV-BNC:
150ns
A0-A20
28F016S3
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1.5528
Abstract: 1mx8 MARK J3 AM29F080 EDI7F331MC
Text: EDI7F331MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MC and EDI7F2331MC are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F331MC
1Mx32
EDI7F331MC
EDI7F2331MC
AM29F080
EDI7F331MC-BNC:
150ns
A0-A19
1.5528
1mx8
MARK J3
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AM29LV017B
Abstract: EDI7F332MV 15607
Text: EDI7F332MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MV and EDI7F2332MV are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS
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EDI7F332MV
2Mx32
EDI7F332MV
EDI7F2332MV
AM29LV017B-
EDI7F332MV-BNC:
120ns
A0-A20
AM29LV017B
15607
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28F016S3
Abstract: EDI7F342MV
Text: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.
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EDI7F342MV
2Mx32
EDI7F342MV
7F2342MV
28F016S3-
EDI7F342MV-BNC:
150ns
A0-A20
28F016S3
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1mx8
Abstract: AM29F080 EDI7F4331MC
Text: EDI7F4331MC 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MC is organized as four banks of 1Mx32. The module is based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MC-BNC:4x1Mx32 80 PIN SIMM
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EDI7F4331MC
4x1Mx32
EDI7F4331MC
1Mx32.
AM29F080
EDI7F4331MC-BNC
150ns
A0-A19
4x1Mx32
1mx8
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3402 transistor
Abstract: EDI7F4342MV
Text: EDI7F4342MV 4x2Mx32 FLASH MODULE FEATURES DESCRIPTION 4x2Mx32 The EDI7F4342MV is organized as four banks of 2Mx32. The module is based on Intel's E28F016S3 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. Based on Intel's E28F016S3 Flash Device
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EDI7F4342MV
4x2Mx32
4x2Mx32
EDI7F4342MV
2Mx32.
E28F016S3
120ns
150ns
12Vpp
3402 transistor
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AM29LV008T
Abstract: EDI7F4331MV
Text: EDI7F4331MV 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MV is organized as four banks of 1Mx32. The module is based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MV-BNC: 4x1Mx32 80 PIN SIMM
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EDI7F4331MV
4x1Mx32
EDI7F4331MV
1Mx32.
AM29LV008T
EDI7F4331MV-BNC:
150ns
A0-A19
4x1Mx32
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Untitled
Abstract: No abstract text available
Text: Pulse v'—' Electronics www.pulseelectronlc3.com CX2109NL RF Transformer 1:1, 4.5 - 3000MHz Impedance = 50 Ohms Surface Mount, FR4 Substrate ELECTRICAL SPECIFICATIONS PARAMETER NOTES: UNLESS OTHERWISE SPECIFIED: FREQUENCY Hz INSERTION LOSS: AT + 2 5 ‘ C
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CX2109NL
3000MHz
5-3000M
2109N
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underfill
Abstract: DS2415X D085-002 FR4 substrate
Text: NOTES: 1. DIMENSIDN5: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
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DS2415X
DS2415X
underfill
D085-002
FR4 substrate
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DS56X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] LASER MARK LANDING PAD NOT DEFINED BY SO LD ER Z. 3. MASK; FOR PAD CONNECTIONS AND COORDINATES. SE E TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
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DS56X
DS56X
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underfill
Abstract: DS2417X FR4 substrate ds2417
Text: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS
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DS2417X
DS2417X
underfill
FR4 substrate
ds2417
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FR4 SUBSTRATE SHEET
Abstract: 0343
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1822X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1822X
DS1822X
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0660H
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD
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175-O
41-A9502-000
IE/06/1999
DS9502X
DS9502X
0660H
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IS242
Abstract: DS2423X
Text: NOTES: 1. DIMENSIDNSi 2. 3. MM CINCHES] LASER MARK LAND PAH NOT DEFINED BY SOLDER MASK; FDR PAD CONNECTIONS, SEE TABLE 1 4. UNDERFILL DR GLEIB TDP REQUIRED FDR FR4 DR EQ U IVA LEN T SUBSTRATE TABLE 1. APPLICATION LAND PAD C0NNECT0N5 AND CENTE R COORDINATES
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DS2423X
IS2423X
IS2423X
IS242
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R04003
Abstract: PB10-2
Text: M/A-COM LSM1VCO Package PIN 1 FUNCTION RF O utput Vcc supply voltage Vtune (tuning voltage) 2 3 4 No connection o r g round Lid = ground Notes: 1. Substrate Material FR4 2. Contact areas plated nickel u n d er gold flash 3. All unspecified tolerances ±0.25
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R04003
PB102,
PB10-2
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