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    FR4 SUBSTRATE WITH 0.762MM THICKNESS Search Results

    FR4 SUBSTRATE WITH 0.762MM THICKNESS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4KMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4MMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4NQF10FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation

    FR4 SUBSTRATE WITH 0.762MM THICKNESS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SF-BGA316B-B-11

    Abstract: BGA316 FR4 substrate with 0.762mm thickness
    Text: D Package Code: BGA316B C 0.635mm See BGA pattern code to the right for actual pattern layout Y .0225" dia. tooling holes X2 non plated (optional) 0.762mm 0.025" dia. pad X Top View (reference only) 24.13mm 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA316B 635mm 762mm FR4/G10 SF-BGA316B-B-11 BGA316 FR4 substrate with 0.762mm thickness PDF

    FR4 substrate with 0.762mm thickness

    Abstract: BGA400F SF-BGA400F-B-11
    Text: D Package Code: BGA400F C 0.635mm See BGA pattern code to the right for actual pattern layout Y 0.762mm 0.025" dia. pad X 24.13mm Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)


    Original     		BGA400F 635mm 762mm FR4/G10 SF-BGA400F-B-11 FR4 substrate with 0.762mm thickness BGA400F PDF

    SF-BGA300A-B-11

    Abstract: land pattern BGA 0,50
    Text: D Package Code: BGA300A C .0225" dia. tooling holes X2 non plated (optional) See BGA pattern code to the right for actual pattern layout Y 0.025" dia. pad X 24.13mm Top View (reference only) 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"]


    Original     		BGA300A 635mm 762mm FR4/G10 20X20 SF-BGA300A-B-11 land pattern BGA 0,50 PDF

    bga244

    Abstract: 19X19 SF-BGA244A-B-11
    Text: D Package Code: BGA244A .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm 0.025" dia. pad Top View (reference only) 2 0.36mm [0.014"] dia. 0.762mm 5.33mm 3.74mm [0.147"]


    Original     		BGA244A 914mm 533mm 762mm 508mm FR4/G10 SF-BGA244A-B-11 bga244 19X19 PDF

    19X19

    Abstract: SF-BGA240E-B-11 land pattern BGA 0,50
    Text: D Package Code: BGA240E .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm Top View (reference only) 0.025" dia. pad 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA240E 914mm 533mm 762mm 508mm FR4/G10 SF-BGA240E-B-11 19X19 land pattern BGA 0,50 PDF