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    FUSE 0603 MARKING F Search Results

    FUSE 0603 MARKING F Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCKE800NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE812NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, Fixed Over Voltage Clamp, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE812NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, Fixed Over Voltage Clamp, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE712BNL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 13.2 V, 3.65 A, Latch, Adjustable Over Voltage Protection, WSON10 Visit Toshiba Electronic Devices & Storage Corporation

    FUSE 0603 MARKING F Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TF16SN

    Abstract: 47 16S
    Text: CIRCUIT PROTECTORS CIRCUIT PROTECTORS 0603 CURRENT FUSE normal blow TF16SN L c ③ ② ① c STRUCTURE W ④ t ⑤ ⑥ d 1 2 3 4 5 6 Protective coating Fuse element Inner electrode Sn plating Cu/Ni plating Ceramic substrate IDENTIFICATION TF 16S N Black MARKING


    Original     		TF16SN D-25578 TF16SN 47 16S PDF

    Untitled

    Abstract: No abstract text available
    Text: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCFS-XX0S004I 5K/10K) CFS0402 CFS0603 CFS1206 PDF

    smd fuse marking code T

    Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
    Text: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCH-XXOS001A CH06V5TR50 CH06V3T1R50 CH06V3T3R00 CH06V3T4R0 CH12V6TR50 10x-rated smd fuse marking code T smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking PDF

    CF06V2T2R50

    Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
    Text: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCF-06OS030E CF06V CF0603 CF06V2T2R50 CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63 PDF

    E232989

    Abstract: fuse 1812 F0603SB1000V032 4532 fuse "MARKING CODE M" ceramic fuses eia0603 V024 QIQ007 EIA-0603
    Text: Rev. Jun. 09 SolidMatrix 0603 Slow Blow Surface Mount Fuses Features: • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating RoHS compliant materials


    Original     		EIA0603 EIAJ1608 E232989 fuse 1812 F0603SB1000V032 4532 fuse "MARKING CODE M" ceramic fuses V024 QIQ007 EIA-0603 PDF

    F0603hi

    Abstract: 4532 fuse FUSE 1A 0805 MIL-PRF-23419 eia marking code F0603HI1000V032T F0603HI5000V032T F0603HI2000V032T F0603HI1500V032T EIAJ1608
    Text: Rev. Jun. 09 SolidMatrix 0603 High Inrush Current Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating


    Original     		0603/EIAJ1608 F0603hi 4532 fuse FUSE 1A 0805 MIL-PRF-23419 eia marking code F0603HI1000V032T F0603HI5000V032T F0603HI2000V032T F0603HI1500V032T EIAJ1608 PDF

    F0603FA

    Abstract: F0603FA3000V032T F0603FA1500V032T F0603FA1000V032T F0603FA2000V032T F0603FA2500V032T F0603FA0750V032T F0603FA4000V032T F0603FA1000 F0603FA0500V032T
    Text: Rev. Jun. 09 SolidMatrix 0603 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability


    Original     		EIA0603/EIAJ1608 -55oC 125oC F0603FA F0603FA3000V032T F0603FA1500V032T F0603FA1000V032T F0603FA2000V032T F0603FA2500V032T F0603FA0750V032T F0603FA4000V032T F0603FA1000 F0603FA0500V032T PDF

    fuse smd code N

    Abstract: smd fuse marking code M smd fuse marking 20 1 smd fuse marking code n CFS06V5TR50 k smd fuse marking code smd fuse marking code K smd fuse marking code T SMD 1206 fuse fuse smd code P
    Text: Lead Free Thin Film Chip Fuse Document No TCFS-06OS050E Issued date 2007/7/25 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate


    Original     		TCFS-06OS050E CFS06V CFS0603 fuse smd code N smd fuse marking code M smd fuse marking 20 1 smd fuse marking code n CFS06V5TR50 k smd fuse marking code smd fuse marking code K smd fuse marking code T SMD 1206 fuse fuse smd code P PDF

    smd fuse marking code 20

    Abstract: No abstract text available
    Text: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCP-XXOS006H 5K/10K) smd fuse marking code 20 PDF

    smd fuse marking code 20

    Abstract: fuse i2t fuse smd code t
    Text: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2011/03/01 Page 1/18 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCPS-XXOS004F CPS06 CPS12 smd fuse marking code 20 fuse i2t fuse smd code t PDF

    smd fuse marking code J

    Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
    Text: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCFS-XXOS004H 5K/10K) CFS04 CFS06 CFS12 CFS0402 CFS0603 smd fuse marking code J 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20 PDF

    smd fuse marking code 15 0.75A 1206

    Abstract: No abstract text available
    Text: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCF-XXOS032J 5K/10K) CF0402 CF0603 CF1206 smd fuse marking code 15 0.75A 1206 PDF

    smd fuse marking code 15 0.75A 1206

    Abstract: CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code
    Text: Document No TCF-XXOS032J Issued date 2011/05/17 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCF-XXOS032J 5K/10K) CF0402 CF0603 CF1206 smd fuse marking code 15 0.75A 1206 CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code PDF

    F1206hi

    Abstract: F1206HI4500V032T F1206HI2500V032T fuse 1812 0805 fuse marking code m
    Text: Rev. Jun. 09 SolidMatrix 1206 High Inrush Current Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating


    Original     		1206/EIAJ3216 F1206hi F1206HI4500V032T F1206HI2500V032T fuse 1812 0805 fuse marking code m PDF

    Untitled

    Abstract: No abstract text available
    Text: Document No TCPS-XXOS006A Lead Free Thin Film Chip Fuse Issued date 2009/9/2 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCPS-XXOS006A CPS04V CPS06V CPS12V PDF

    fuse resistor

    Abstract: No abstract text available
    Text: Document No TCPS-XXOS001A Lead Free Thin Film Chip Fuse Issued date 2008/12/12 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate


    Original     		TCPS-XXOS001A CPS04V CPS06V CPS12omer fuse resistor PDF

    R50 marking

    Abstract: No abstract text available
    Text: Document No TCH-XXOS001A Issued date 2009/04/26 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCH-XXOS001A CH06V CH12V R50 marking PDF

    F1206FA

    Abstract: F1206FA2000V063T F1206FA3000V032T F1206FA4000V032T F1206FA0500V063T F1206FA5000V032T F1206FA1000V063T multimeter F1206FA1750V063T fuse 1812
    Text: Rev. Jun. 09 SolidMatrix 1206 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability


    Original     		1206/EIAJ3216 -55oC 125oC F1206FA F1206FA2000V063T F1206FA3000V032T F1206FA4000V032T F1206FA0500V063T F1206FA5000V032T F1206FA1000V063T multimeter F1206FA1750V063T fuse 1812 PDF

    smd marking code mfu

    Abstract: smd fuse marking code K m86m smd fuse marking code m smd fuse marking H IR511 SMD code mfu IEC 60127-1
    Text: MFU 0805, MFU 0603 Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering


    Original     		18-digit 05-Oct-04 smd marking code mfu smd fuse marking code K m86m smd fuse marking code m smd fuse marking H IR511 SMD code mfu IEC 60127-1 PDF

    F1206SB2000V063

    Abstract: marking code p 05 fuse F1206SB5000V032T fuse 1812 F1206SB1000V063 F1206SB5500V024T marking p-8a V024 4532 fuse
    Text: Rev. Jun. 09 SolidMatrix 1206 Slow Blow Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing


    Original     		EIA1206/EIAJ3216 F1206SB2000V063 marking code p 05 fuse F1206SB5000V032T fuse 1812 F1206SB1000V063 F1206SB5500V024T marking p-8a V024 4532 fuse PDF

    TL 434

    Abstract: Littelfuse 0603 TP 0720 125OC LR29862
    Text: Surface Mount Fuses Thin Film > 0603 Size > Very Fast Acting > 434 Series 434 Series Fuse ® Description The 434 series fast-acting surface mount fuse series is an ultra small 0603 size thin-film device designed for secondary protection of circuits used in space constrained


    Original     		E10480 250mA LR29862 200OC 260OC, RS-481-2 TL 434 Littelfuse 0603 TP 0720 125OC LR29862 PDF

    Untitled

    Abstract: No abstract text available
    Text: Document No TCP-XXOS001A Issued date 2008/12/12 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCP-XXOS001A CP04V CP06V CP12V 120omer PDF

    Untitled

    Abstract: No abstract text available
    Text: THIN FILM CHIP FUSE HOW TO ORDER TCF Q 05 -V2- 1R0 M Packaging M = tape/reel FEATURES Thin Film Chip Fuse Rated Current R50 = 0.5A 1R0 = 1A Small and lightweight design Rated Voltage VA = 125V V6 = 63V V5 = 50V V3 = 32V V2 = 24V Suitable for over current protection


    Original     		UL248-14, E241710 TCF18 TCFQ18 TCF16 TCFQ16 TCF05 TCFQ05 PDF

    CP06V

    Abstract: No abstract text available
    Text: Document No TCP-XXOS001C Issued date 2010/05/12 Page 1/9 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCP-XXOS001C CP04V CP06V CP12V CP04V DC24V DC32V CP06V PDF