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R7F7010094AFP
|
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Renesas Electronics Corporation
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High-end In-vehicle Microcomputers for Body Applications |
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IS0-1009EH-Q
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Renesas Electronics Corporation
|
Radiation Hardened 2.5V Reference |
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|
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R7F7010093AFP
|
|
Renesas Electronics Corporation
|
High-end In-vehicle Microcomputers for Body Applications |
|
|
|
IS0-1009EH/SAMPLE
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|
Renesas Electronics Corporation
|
Radiation Hardened 2.5V Reference |
|
|
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54121-820100900LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch. |
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