GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS840NBT36PT

Abstract: R33V TI r33v
Contextual Info: Preliminary - April 1998 ¡tl TUUNOIOCV 2.5V or 3.3V I/O 143/133/117/100 GS840NBT36PT F eatures 3.3V +\Q%/-5% Core power supply, 2.5V or 3.3V I/O supply Output registers are provided and are controlled by FT mode pin. With FT mode pin, output registers can be programmed in either

junction temperature v850

Contextual Info: Preliminary - April 1998 ¡il T t d l N O L O C V 2.5V or 3.3V I/O 117/100/90/50 GS840NBT18FT F eatures Output registers are provided and are controlled by FT mode pin. With FT mode pin, output registers can be programmed in either pipeline mode for very high frequency operation (117MHz or

GS840NBT18PT

Contextual Info: Preliminary - April 1998 ¡(I U d l N O l O U 2.5V or 3.3V I/O 143/133/117/100 GS840NBT18PT NO BUS TURNAROUND _ PIPELINE 256Kx 18 NBT Features Output registers are provided and are controlled by FT m ode pin. With FT mode pin, output registers can be programmed in either

TS 100-12

Abstract: GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180
Contextual Info: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

GS840NBT32

Contextual Info: Preliminary - A pril 1998 u m o io c v < t\\ 2.5V or 3.3V I/O 143/133/117/100 GS840NBT32PT NO BUS TURNAROUND _ PIPELINE 128Kx32 NBT F eatures Output registers are provided and are controlled by FT m ode pin. With FT mode pin, output registers can be programmed in either

Contextual Info: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

Contextual Info: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation

Contextual Info: Preliminary GS840FH18/32/36AT-7.5/8/8.5/10/12 ns–12 ns 256K x 18, 128K x 32, 128K x 36 7.5 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O TQFP Commercial Temp Industrial Temp Features Designing For Compatibility • Flow Through mode operation • 3.3 V +10%/–5% core power supply

B180

Abstract: V/GS840E18A
Contextual Info: GS840E18/32/36AGT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

GS840F18A

Abstract: GS840F18AT-10 GS840F18AT-8 GS840F32A GS840F36A ld 33v
Contextual Info: GS840F18/32/36AT-7.5/8/8.5/10/12 TQFP Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode

Contextual Info: GS840F18/32/36AT-8/8.5/10/12 TQFP Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode

B180

Contextual Info: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

B180

Contextual Info: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

B180

Abstract: GS84018
Contextual Info: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply

GS840E18A

Abstract: GS840E32A GS840E36A B180
Contextual Info: Preliminary GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GSB1122

Abstract: gsc840
Contextual Info: Connector for Multiple or Overall Shielded Cables Grounded With One Compression Inner Collector Ring Connectors for Shielded Cable Installing Die Cat. No. ColorCode .500 .620 .750 .880 1.000 1.120 1.192 1.294 1.423 1.545 GS590 GS710 GS840 GS1010 GS1130 GS1250

180i

Abstract: GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180
Contextual Info: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

B180

Contextual Info: GS840H18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • High Output Drive current.

GS840FH18A

Abstract: GS840FH32A GS840FH36A
Contextual Info: Preliminary GS840FH18/32/36AT-7.5/8/8.5/10/12 ns–12 ns 256K x 18, 128K x 32, 128K x 36 7.5 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O TQFP Commercial Temp Industrial Temp Features Designing For Compatibility • Flow Through mode operation • 3.3 V +10%/–5% core power supply

Contextual Info: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features • FT pin for user-configurable flow through or pipelined

nk2001

Contextual Info: GS840Z18/36AT-180/166/150/100 4Mb Pipelined and Flow Through Synchronous NBT SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features 180 MHz–100 MHz 3.3 V VDD 2.5 V and 3.3 V VDDQ Because it is a synchronous device, address, data inputs, and read/ write control inputs are captured on the rising edge of the

Contextual Info: GS840F18/32/36AT-7.5/8/8.5/10/12 TQFP Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode