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    H025 Search Results

    H025 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    G862H025T3HR Amphenol Communications Solutions Socket 2.00mm Pitch, CRIPMING TYPE, 1x2PIN, NY66, HF, YELLOW Visit Amphenol Communications Solutions
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    H025 Price and Stock

    Bel Fuse 0679H0250-05

    FUSE BRD MT 250MA 350VAC 72VDC
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    DigiKey 0679H0250-05 Cut Tape 4,062 1
    • 1 $0.39
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    • 100 $0.2308
    • 1000 $0.17747
    • 10000 $0.17747
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    0679H0250-05 Digi-Reel 4,062 1
    • 1 $0.39
    • 10 $0.39
    • 100 $0.2308
    • 1000 $0.17747
    • 10000 $0.17747
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    Avnet Abacus 0679H0250-05 Reel 18 Weeks 5,000
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    Master Electronics 0679H0250-05 5,000
    • 1 -
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    Essentra Components 50M050080H025

    90 SLOTTED CSK SCREW, M5 X .8 TH
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    DigiKey 50M050080H025 Bulk 1,968 1
    • 1 $0.11
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    • 100 $0.0593
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    Essentra Components 50M035060H025

    90 SLOTTED CSK SCREW, M3.5 X .6
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    DigiKey 50M035060H025 Bulk 607 1
    • 1 $0.14
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    • 100 $0.0823
    • 1000 $0.06646
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    Essentra Components 010440H025

    HEX UNSLOTTED BOLT 4-40 THREAD 1
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    DigiKey 010440H025 Bulk 437 1
    • 1 $0.1
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    Kyocera AVX Components GH0258331MA6N

    CAP CER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GH0258331MA6N Tray 400 400
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    H025 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TK11280C

    Abstract: tk11233c H025H TK11220C TK11260c TK11236C TK11245C TK11242C
    Text: TK112xxCM/U アプリケーションマニュアル スイッチ付きLDO GC3-H025H レギュレータICのご紹介 TK112xxCM/U Page 1 TK112xxCM/U 特 長 ・PNP パワートランジスタ使用の為電池使用の場合には入出力電圧差が小さく、電源電圧をぎり


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    TK112xxCM/U GC3-H025H 300mA 480mA OT23L TK112xxC 65APNP 200mA0 TK11280C tk11233c H025H TK11220C TK11260c TK11236C TK11245C TK11242C PDF

    Untitled

    Abstract: No abstract text available
    Text: Issue No. : 12-SWDW-H025 October 30, 2012 Date of Issue : Classification : • New □ Change For General Distribution PRODUCT SPECIFICATION FOR APPROVAL Product Description Customers Part Number Product Part Number Country of Origin


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    12-SWDW-H025 ESE24CSH6 PDF

    h032

    Abstract: No abstract text available
    Text: BetaTHERM Sensors Custom and Standard Industrial Probes Style: H025 National Pipe Thread NPT Probes: Applications: ¥ Dialysis equipment liquid sensor. ¥ Hydraulic oil temperature sensing. ¥ Industrial liquid processing equipment for dairy and food industry.


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    M10x1 h032 PDF

    Hysol EE4198

    Abstract: MIL-C-83513 M83513/5-07 MDM98479-89 MDM98479-86 MDM 9P PCB MIL-C-83513/5 322-9500-000 MDM-PCB MDM-21SBS
    Text: The Micro Line - .050" Contact Spacing The Cannon MICRO Series established the standards for performance and reliability in mircominiature interconnects. Exceptionally versatile, MICRO connectors are available in rectangular, circular, and strip configurations, with 3 amp MICROPIN /


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    PDF

    nec tokin oe 128

    Abstract: MS-17171 MCP51M NEC Tokin od 108 c113 pc 100 3p3 nvidia c51mv PC017 MS17171 Athlon Neo X2 CM1616
    Text: 5 4 3 MS-17171 Ver : 2.0 2 Processor 1 DDR2 Sodimm 0 AMD S1 638 pin uFCPGA 638 socket Battery Charger Page 6 DDR2 400 / 533 / 667 MHz Page 31 DDR2 Sodimm 1 Page 2,3,4,5 Battery select Page 6 Page 32 D D 16 X 16 Bit HyperTransport Link DRAM Power Page 33 North Bridge


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    MS-17171 C51MV RTL8111B 6855B Sou110 E43-1204002-H29 E2P-7170111-G40 E26-1004050-SA6 E26-1035130-G40 E2P-6322713-G40 nec tokin oe 128 MCP51M NEC Tokin od 108 c113 pc 100 3p3 nvidia c51mv PC017 MS17171 Athlon Neo X2 CM1616 PDF

    ADDS-2191-EZLITE

    Abstract: JTAG ADSP-21XX AD1803 AD1885 ADSP2191 ADSP-2191
    Text: ADSP-2191.qxd 2/25/02 4:51 PM Page 1 EZ-KIT Lite for Analog Devices ADSP-219x DSP Family. Key Featur es Attributes • ADSP-2191 DSP • AD1885 48 kHz AC’97 SoundMax codec • AD1803 low power modem codec • Telephony interface • 4 Mbits of FLASH memory


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    ADSP-2191 ADSP-219x AD1885 AD1803 14-pin ADSP2191 H02558- ADDS-2191-EZLITE JTAG ADSP-21XX PDF

    capacitor Y5S 022

    Abstract: capacitors TPC Thomson csf ceramic capacitor THOMSON ELECTRONIQUES TUBES kyocera 433 k G WA03H-68 HD40-1000 ceramic disc capacitors stacks AVX BAR code ON THE label Thomson csf "high voltage ceramic capacitor"
    Text: A KYOCERA GROUP COMPANY TPC Power Ceramic Capacitors TPC Introduction TPC, a subsidiary of THOMSON CSF, is a worldwide electronic component manufacturer, with over 40 years experience in ceramic capacitors and offers a complete package covering design, manufacture, just-in-time delivery


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    S-PCC10M1198-N capacitor Y5S 022 capacitors TPC Thomson csf ceramic capacitor THOMSON ELECTRONIQUES TUBES kyocera 433 k G WA03H-68 HD40-1000 ceramic disc capacitors stacks AVX BAR code ON THE label Thomson csf "high voltage ceramic capacitor" PDF

    mt 1117

    Abstract: No abstract text available
    Text: Microminiature Strip - .100/.050" Contact Spacing MT Printed Circuit Board and Card Mounting Frame Applications. Contacts on .050 1.27 centers. mounting with high strength epoxy adhesive. In lengths over 2" (50.80) guides, rails or other systems should be used to assure alignment.


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    50-MIL mt 1117 PDF

    320-9505-006

    Abstract: mdm 2000 Hysol HD3561 H023 HD3561 Hysol EE4198 MDM98479-92 951 series circular connector
    Text: The Micro Line - .050" Contact Spacing The Cannon MICRO Series established the standards for performance and reliability in mircominiature interconnects. Exceptionally versatile, MICRO connectors are available in rectangular, circular, and strip configurations, with 3 amp MICROPIN /


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    MDM-97294-717 320-9505-006 mdm 2000 Hysol HD3561 H023 HD3561 Hysol EE4198 MDM98479-92 951 series circular connector PDF

    h028

    Abstract: Filter-TMDM h002 H027 H029 QQ-A-200
    Text: Microminiature Connectors Filter-TMDM With an increasing number of MDM connectors being used in avionics and military equipment and with increasing emphasis being put on EMI, RFI and EMP shielding, Cannon have developed a range of filter connectors to suit


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    MDMT-31S* MDMT-37S* h028 Filter-TMDM h002 H027 H029 QQ-A-200 PDF

    Hysol EE4198

    Abstract: UNC-2B 2-56 STAINLESS STEEL NUT Hysol ee4215 10P10 MDM98479-86 ee4198 HD3561 Hysol HD3561 MDM97294-377 MDM98479-89
    Text: Micro-D Metal Shell - .050" Contact Spacing MDM connectors are used in applications requiring highly reliable, extremely small, lightweight connectors with higher density contact configurations than available in traditional rectangular connectors. They are available in 8


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    QQ-W-343, Hysol EE4198 UNC-2B 2-56 STAINLESS STEEL NUT Hysol ee4215 10P10 MDM98479-86 ee4198 HD3561 Hysol HD3561 MDM97294-377 MDM98479-89 PDF

    CDR03 receiver

    Abstract: varistor 250v 592 PH 105k 250v ceramic disc Piezoelectric crystal 1mhz ultrasonic FUSE T2A 250v Motorola transistor smd marking codes smps 10w 5V 230 AC to 5V dc smps capacitor type 104z 50v SR 0805 X7R capacitor
    Text: MLC Capacitors Tantalum Capacitors Microwave Capacitors Thin Film Capacitors Glass Capacitors Chip Resistors Networks EMI Filters Bulk Filters Saw Filters Dielectric Filters Resonators Oscillators Thin Film Inductors Thin Film Fuses Voltage Suppressors Acoustical Piezos


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    S-SF30M298-C CDR03 receiver varistor 250v 592 PH 105k 250v ceramic disc Piezoelectric crystal 1mhz ultrasonic FUSE T2A 250v Motorola transistor smd marking codes smps 10w 5V 230 AC to 5V dc smps capacitor type 104z 50v SR 0805 X7R capacitor PDF

    h024

    Abstract: 1/atmel h024
    Text: LEAD FORMING SPECIFICATIONS Unit: mm Available for bulk packaging only DO-41 DO-15 7.6 5.2 2.7 3.6 B 0.8 B 0.8 A A H01 H02 H02-1 H02-2 H02-3 H02-4 H02-5 H03 H03-1 H03-2 A B 12.5 1.0 10.0 0.5 6.4 0.5 10.0 0.5 5.0 0.5 10.0 0.5 4.5 0.5 10.3 0.5 5.0 0.5 10.0 0.5 10.0 0.5


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    DO-41 DO-15 H02-1 H02-2 H02-3 H02-4 H02-5 H03-1 H03-2 H03-3 h024 1/atmel h024 PDF

    PC200

    Abstract: DQ2880
    Text: . Preliminary IBM16M64644HGA IBM16M32644HGA IBM16M64734HGA IBM16M32734HGA 32/64Mx64/72 1 or 2 Bank Registered DDR SDRAM Module Features • 184-Pin Registered 8-Byte Dual In-Line Memory Module • 32M/64Mx72 and x64 Double Data Rate DDR SDRAM DIMM (32M X 8 SDRAMS)


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    IBM16M64644HGA IBM16M32644HGA IBM16M64734HGA IBM16M32734HGA 32/64Mx64/72 184-Pin 32M/64Mx72 PC200 PC266B 100MHz PC200 DQ2880 PDF

    JTAG ADSP-21XX

    Abstract: AD1836 AD1852 ADSP-21161N
    Text: ADSP-21161N.qxd 2/25/02 4:57 PM Page 1 EZ-KIT Lite for Analog Devices ADSP-21161N SHARC DSP. Key Featur es Attributes • ADSP-21161N SHARC DSP • 48 Mbit SDRAM • AD1836 96 kHz audio codec • AD1852 96 kHz auxillary DAC • USB version 1.1 compliant interface


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    ADSP-21161N AD1836 AD1852 14-pin H02557- JTAG ADSP-21XX PDF

    MS-10421

    Abstract: MCP51M CI055 MOSFET B20 p03 RN00 PC017 pc014 MAX8774GTL Athlon Neo X2 U019C
    Text: 5 4 3 MS-10421 Ver : 0.C 2 Processor 1 DDR2 Sodimm 0 AMD S1 638 pin uFCPGA 638 socket Battery Charger Page 6 DDR2 400 / 533 / 667 MHz Page 31 DDR2 Sodimm 1 Page 2,3,4,5 Battery select Page 6 D Page 32 D 16 X 16 Bit HyperTransport Link DRAM Power Page 33 North Bridge


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    MS-10421 C51MV RTL8111B 6855B 2-H29 E43-1204002-H29 E26-1036180-G40 E21-1035080-Y28 307-0000003-Y28 E2P-7170111-G40 MCP51M CI055 MOSFET B20 p03 RN00 PC017 pc014 MAX8774GTL Athlon Neo X2 U019C PDF

    ssd0323

    Abstract: opto 817 pin connections G1A00 Q65110A1670 jungle ic block diagram 96x64 OLED 817 OPTO OLED 96X64 1.2 L1322 OPTO 817 C
    Text: Product Specification 80 Version Date/ Datum Initiated by/ Veranlasser Reason of modification / Grund der Änderung item, section / Position, Absatz 01 2006-10-13 Ghani Wee, Fakhariah (OPD - Oled FE Prod. Dev.) New Specification The document No. Die Unterlage mit der Nr.:


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    A63857-HX2XX-D001- 2000v 2000v 96X64, SSD0323, OS096064PK12MXXXXX ssd0323 opto 817 pin connections G1A00 Q65110A1670 jungle ic block diagram 96x64 OLED 817 OPTO OLED 96X64 1.2 L1322 OPTO 817 C PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REVISED: 1 2 /1 4 /0 9 CATALOG NUMBER H025— D32— 01 MATERIAL AND FINISH SNAP MOUNT AND PLUG HOUSING: CENTER CONTACT AND REAR HOUSING: DIELECTRICS: SPRING: RETAINING RING: CRES 3 0 3 ; PASSIVATED BeCu; GOLD PLATE 7 5 MICROINCHES TYPICAL OVER NICKEL PLATE 100 MICROINCHES TYPICAL


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    H025-- PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REVISED: 9 /1 0 / 7 CATALOG NUMBER H025— D 11-01 MATERIAL AND FINISH FLANGE: CENTER CONTACT AND HOUSING: SNAP RING: DIELECTRICS: CRES 3 0 3 ; PASSIVATED BeCu; GOLD PLATE 5 0 - 1 0 0 MICROINCHES OVER NICKEL PLATE 5 0 MICROINCHES MIN. BeCu; NICKEL PLATE


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    H025-- PDF

    MOM-15P

    Abstract: 2s227 unc-28 H027
    Text: Micro-D Metal Shell - .050" C o n tact Spacing MDM MDM connectors are used in applications requiring highly reliable, extremely small, lightweight connec­ tors with higher density contact configurations than available in traditional rectangular connectors. They


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    MDM15S

    Abstract: asd 2627 MDM 100 pin
    Text: The heart of the Cannon MICROPIN/MICROSOCK­ ET contact system is a multi-element Twist Pin Contact recessed within an insulating housing. The rugged, cylindrical sockets are mounted in the exposed half of the connector. When connector halves are mated, the chamfered sockets are first


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    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI LSIs M5M4V4169TP-15,-20 4M 256K-WORD BY 16-BIT CACHED DRAM WITH 16K(1024-WORD BY 16-BIT)SRAM DESCRIPTION The M5M4V4169TP is a 4 M - b it Cached DRAW which integrates input registers, a 262, 1 4 4 - word by 1 6 - bit dynamic memory array and a 1024-w o rd by 1 6 - bit static


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    M5M4V4169TP-15 256K-WORD 16-BIT 1024-WORD M5M4V4169TP 1024-w 4V4169TP-15 4V4169TP-20 D054772 PDF

    D SUB connector ITT Cannon

    Abstract: MDM-15P Hysol HD3561 WC28 MDM-25P 2-56UNC-2B A141 A172 MIL-C-83513 MDM-100P
    Text: MDM Micro-D M etal Shell - .050" C en ter Spacing P IN /M IC R O SO C K E T™ contacts on .0 50 1.27 centers in a contact density identical to the stan­ dard M ICRO-D connector series, but with these additional features: MDM connectors are used in applications requiring


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    Hysol C9-4215

    Abstract: No abstract text available
    Text: Microminiature Connectors - The Micro Line MDM connectors are used in applications requiring These connectors are designed to meet the rapidly highly reliable, extrem ely sm all, lightweight connec­ increasing demands for an environm ental, high per­ tors with higher density contact configurations than


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