18052
Abstract: No abstract text available
Text: 5-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP Adapter FEATURES • Allows placing an PLCC package on a board laid out for a shrink DIP. GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides • PADS: HASL • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
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MC68HC11E9-to-56-Pin
C36000,
B16/B16M
B579-73
AMS-QQ-N-290
1109252-P
18052
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SF-QFE64SE-L-01
Abstract: No abstract text available
Text: 16.5mm [0.650"] 16.5mm 0.650" 0.8mm typ.[0.031"] 1.3mm typ. 0.050" 0.5mm dia. typ. 0.018" 2 6.4mm 0.250" 1 0.8mm pitch A 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHS HASL plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"
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FR4/G10
SF-QFE64SE-L-01
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AMS-QQ-N-290
Abstract: No abstract text available
Text: 5-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP Adapter FEATURES • Allows placing an PLCC package on a board laid out for a shrink DIP. GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides • PADS: HASL • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
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MC68HC11E9-to-56-Pin
C36000,
B16/B16M
B579-73
AMS-QQ-N-290
AMS-QQ-N-290
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smd jsp
Abstract: SN100C "IPC-9701" IPC-9701 HASL IPC-A-610C J-STD-002B SN63
Text: Reflow Soldering of SMD Products To Printed Wiring Boards PWBs Using Lead-Free Solder Jon S. Prokop Vice President, Operations (972) 789-3818 jprokop@rfm.com 1 JSP 111604 Assembly of SMD Products To PWBs Using Pb-Free Solder • Considerations – – –
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IPC-A-610C
smd jsp
SN100C
"IPC-9701"
IPC-9701
HASL
IPC-A-610C
J-STD-002B
SN63
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Untitled
Abstract: No abstract text available
Text: VT-RBT SOLDER PASTE INSPECTION SYSTEM Omron’s VT-Rabbit stops defective boards before they multiply Integrate the VT-Rabbit into your PCB production process for an accurate, high-speed solder paste inspection solution. This small 35 inch footprint device operates at production
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advanc64
9/00/10M
50/60Hz,
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Untitled
Abstract: No abstract text available
Text: TURNKEY PRINTED CIRCUIT BOARD AND FLEX ASSEMBLIES C O M P L E T E V E R T I C A L I N T E G R AT I O N — F R O M C O N N E C T O R S T O B O A R D S T O A S S E M B LY DECEMBER 2014 TURNKEY PCB/Flex Circuit Assemblies Full-service—from concept and design through fabrication,
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B-1304
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LP2996
Abstract: AN-1268 EEU-FC0J331S EEU-FC0J680 LP2996LQ LP2996MR HASL 1268 ELECTROLYTIC CAPACITOR 330uF 63V
Text: National Semiconductor Application Note 1268 Chance Dunlap December 2002 The LP2996 evaluation board is designed to provide the design engineer with a fully functional prototype system in which to evaluate the LP2996 in both a static environment and with a complete memory system. There are two versions
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LP2996
LLP-16
AN-1268
AN-1268
EEU-FC0J331S
EEU-FC0J680
LP2996LQ
LP2996MR
HASL
1268
ELECTROLYTIC CAPACITOR 330uF 63V
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ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability
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25x25x1
ceramic rework
CCGA
BGA Solder Ball collapse
90Pb 10Sn solder paste
304-pin ltcc
MPC105
MPC106
MPC107
BGA PROFILING
spray nozzles
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motherboard with multimeter
Abstract: LP2995M AN1241 AN-1241 EEU-FC0J331S EEU-FC0J680 LP2995 LP2995LQ so8 ceramic
Text: National Semiconductor Application Note 1241 Chance Dunlap August 2002 Introduction used. This application note contains information regarding the evaluation board. For more information regarding the LP2995 please refer to the datasheet. The LP2995 evaluation board is designed to provide the
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LP2995
LLP-16
AN-1241
motherboard with multimeter
LP2995M
AN1241
AN-1241
EEU-FC0J331S
EEU-FC0J680
LP2995LQ
so8 ceramic
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AND8464
Abstract: PNC0106A Soldering guidelines pin in paste reflow profile
Text: AND8464/D Board Level Application Note for 0402, 0502 and 0603 DSN2 Packages Prepared by: Denise Thienpont, Steve St. Germain ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Recommendations for each of these items are included in this application note. Figure 2 illustrates the color scheme
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AND8464/D
AND8464
PNC0106A
Soldering guidelines pin in paste
reflow profile
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Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
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conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
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SF-SO28A-J-02F
Abstract: No abstract text available
Text: 19.05mm [0.750"] RoHS COMPLIANT 5.08mm [0.200"] 11.20mm [0.441"] 0.46mm dia. typ. [0.018"] 2 Top View 9.49mm [0.374"] 3 1 5.25mm [0.207"] 9.93mm [0.391"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] Side View Compatible target board land pattern not to scale
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FR4/G10
Sn96Ag4
SF-SO28A-J-02F
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LP2996
Abstract: No abstract text available
Text: User's Guide SNOA429A – May 2004 – Revised May 2013 AN-1268 LP2996 Evaluation Board 1 Introduction The LP2996 evaluation board is designed to provide the design engineer with a fully functional prototype system in which to evaluate the LP2996 in both a static environment and with a complete memory system.
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SNOA429A
AN-1268
LP2996
WQFN-16
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Untitled
Abstract: No abstract text available
Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
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DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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FR4-HTG170
Abstract: No abstract text available
Text: PRINT CIRCUIT BOARD MECHANICALS CHARACTERISTICS Dimension mm : MATERIAL : X 183 100 Surface (dm²) : FR4-HTG170 1,83 BOARD THICKNESS (mm) : MULTILAYERS DOUBLE SIDE ELECTRICAL TEST 1 SIDE 34 CI 1019 A.PDF µVIA : NO DRILLING PROGRAM NAME : 34 CI 1019 A.EXC
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FR4-HTG170
Dec-06
AT91SAM9XE-EK
DP11-02
FR4-HTG170
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sdip-29
Abstract: amp plcc socket dsip
Text: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.
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MC68HC11E9
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
sdip-29
amp plcc socket
dsip
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18043
Abstract: IPC600E
Text: P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder devices directly to topside of
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OT-25,
OT-23A-6
OT-25
IPC-600E,
C36000,
B16/B16M
-610B
1110748-P
18043
IPC600E
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IPC-600E
Abstract: TRANSISTOR SUBSTITUTION
Text: P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder devices directly to topside of
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OT-25,
OT-23A-6
OT-25
IPC-600E,
C36000,
1110748-P
-610B
IPC-600E
TRANSISTOR SUBSTITUTION
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MC68HC11E9
Abstract: No abstract text available
Text: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.
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MC68HC11E9
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
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microgate
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT-23A-6
OT-25
IPC-600E,
microgate
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DP7310J
Abstract: No abstract text available
Text: 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: • Allows placing an SOIC narrow body on a board laid out for an SOWIC (wide body). • Solder masked top side pads allow user to hand solder devices directly to top side of adapter with fewer problems of solder bridging.
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DP7310J
SN74ACT564DWJ
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
DP7310J
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IPC-600E
Abstract: nj TRANSISTOR 610B ASTM-B16-85 TRANSISTOR SUBSTITUTION HASL surface mount to dip adapter
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT-23A-6
OT-25
IPC-600E,
IPC-600E
nj TRANSISTOR
610B
ASTM-B16-85
TRANSISTOR SUBSTITUTION
HASL
surface mount to dip adapter
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Untitled
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT-23A-6
OT-25
IPC-600E,
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Untitled
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT23A-6
OT-25
IPC600E,
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