Untitled
Abstract: No abstract text available
Text: Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm x B D b1 SOT560-1 v M C A B w M C ball A1 index area v M C A B w M C b b3 E b2 v M C A B w M C v M C A B w M C detail X x C A e1 B e C y v A e2 E1 e4 1
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HBCC32:
OT560-1
MO-217
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sot560
Abstract: HBCC32 MO217
Text: PDF: 1999 Sep 10 Philips Semiconductors Package outline HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm SOT560-1 x B D pin 1 index area b1 w M w M b b3 E w M b2 w M detail X x C A e1 B e y v A C E1 e4 e2 1 32 A1 X D1 A2 e3
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HBCC32:
OT560-1
MO-217
sot560
HBCC32
MO217
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Untitled
Abstract: No abstract text available
Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC32; SOT560-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 5.40 (2x) 3.05 (2×) 2.55 (2×) 1.275 (2×) solder lands solder resist 0.075 clearance 0.50 (24×) 0.150 solder paste
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HBCC32;
OT560-1
MGX375
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MO-217
Abstract: 132A-1
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm x B D b1 SOT560-1 v M C A B w M C ball A1 index area v M C A B w M C b b3 E v M C A B w M C b2 v M C A B w M C
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HBCC32:
OT560-1
MO-217
MO-217
132A-1
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5.1 B2
Abstract: No abstract text available
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm SOT560-1 x B D b1 w M w M ball A1 index area b b3 E w M b2 w M detail X x C A e1 B e y v A C E1 e4 e2 1 32 A1 X D1 A2
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HBCC32:
OT560-1
MO-217
5.1 B2
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LPC2148 i2c
Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Text: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.
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OT363
SC-88)
LPC2148 i2c
BGB210S
lpc2148 interfacing 2.8" TFT LCD DISPLAY
BGB210
embedded c code to interface lpc2148 with sensor
BGW200
TDA8932T
tda8920bj
NXP PN531
TDA8947J equivalent
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R114426
Abstract: BLM11P300S dipsw_4 232270296001 433003036301 Philips 2322-702-96001 BLM11P300 AN99071 STM16 TP97036
Text: APPLICATION NOTE OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99071 TP97036.2/F5.5 Philips Semiconductors OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99071 Abstract
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OM5808
TZA3014
TZA3019
AN99071
TP97036
OM5808.
R114426
BLM11P300S
dipsw_4
232270296001
433003036301
Philips 2322-702-96001
BLM11P300
AN99071
STM16
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702 TRANSISTOR smd
Abstract: SIEMENS AVR GENERATOR fire alarm abstract using thermistor and op-amp Phycomp 2238 Laser power supply abstract 2238 916 15636 3006p 205 Variable Resistor 2238-787-15636 phycomp 2322-702-60102 capacitor 0402 X7R 100NF 50V 10
Text: APPLICATION NOTE OM5811 minidil demo board for TZA3010/11/47 laser drivers covering 30-3200 Mb/s AN10191-01 TP97036.2/F5.5 Philips Semiconductors OM5811 minidil demo board for TZA3010/11/47 laser drivers covering 30-3200 Mb/s Application Note AN10191-01 Abstract
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OM5811
TZA3010/11/47
AN10191-01
TP97036
TZA3010/11/47
OM5811.
TZA3010,
TZA3011and
702 TRANSISTOR smd
SIEMENS AVR GENERATOR
fire alarm abstract using thermistor and op-amp
Phycomp 2238
Laser power supply abstract
2238 916 15636
3006p 205 Variable Resistor
2238-787-15636
phycomp 2322-702-60102
capacitor 0402 X7R 100NF 50V 10
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R114426
Abstract: BLM11P300S 3006P 201 PHILIPS 433003036301 Philips 2322-702-96001 433003036301 dipsw_4 HLMP6500-011 siemens c45 Stocko R5
Text: APPLICATION NOTE OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN01023 TP97036.2/F5.5 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 Abstract
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OM5809
TZA3014
TZA3019
AN01023
TP97036
OM5809.
R114426
BLM11P300S
3006P 201
PHILIPS 433003036301
Philips 2322-702-96001
433003036301
dipsw_4
HLMP6500-011
siemens c45
Stocko R5
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BGE788
Abstract: Datahandbook HBCC32 TRANSIMPEDANCE mmic laser BGR269 BGS67A BGY585A BGY587 BGY587B BGY588N
Text: Semiconductors Product Portfolio RF Access Systems CATV RF Hybrid Amplifiers * Type Number Description Reverse Hybrids BGS67A 65 MHz, 25.5 dB gain Reverse Amplifier, 12 V BGY68 75 MHz, 30 dB gain Reverse Amplifier BGY66B 120 MHz, 25 dB gain Reverse Amplifier
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BGS67A
BGY68
BGY66B
BGY67
BGY67A
BGR269
550MHz
BGY588C
BGY585A
BGY587
BGE788
Datahandbook
HBCC32
TRANSIMPEDANCE mmic laser
BGR269
BGS67A
BGY585A
BGY587
BGY587B
BGY588N
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BF1201A
Abstract: bf1211 dual gate mosfet bfq34 application note SA636 BFG480W BF862 AM LNA BFR10 SA676 Reliability SA612A SA614A
Text: RF Products RF Products 241 RF Access Systems CATV RF Hybrid Amplifiers Type Number Description Frequency Range Gain dB Slope (dB) FL S11/S22 CTB XMOD CSO @Ch @Vo (dBmV) F @fmax Itot (mA) BGS67A 65 MHz, 25.5 dB gain Reverse Amplifier, 12 V 5 - 65 25 - 26
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S11/S22
BGS67A
BGY68
BGY66B
BGY67
13MHz
900MHz
SA8027
TSSOP20)
44MHz
BF1201A
bf1211 dual gate mosfet
bfq34 application note
SA636
BFG480W
BF862 AM LNA
BFR10
SA676
Reliability SA612A
SA614A
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tcxo philips 4322
Abstract: philips tcxo 4322 190 ISO9001-Certified philips bfq32 philips bare die datasheet 2SK170BL ON4749 philips BFG196 S8740230 toshiba fet databook 2sk162 hitachi
Text: RF Manual 5th edition Product and design manual for RF Products October 2004 Semiconductors RF Manual Philips Semiconductors 5th edition Product and design manual for RF Products Koninklijke Philips Electronics N.V. 2004 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
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JESD51-5
Abstract: JESD51-7 TZA3010B TZA3010BVH soft ferrite handbook
Text: INTEGRATED CIRCUITS DATA SHEET TZA3010B 30 Mbits/s up to 3.2 Gbits/s laser driver Preliminary specification File under Integrated Circuits, IC19 2001 Nov 16 Philips Semiconductors Preliminary specification 30 Mbits/s up to 3.2 Gbits/s laser driver TZA3010B
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TZA3010B
TZA3010B
SCA73
403510/01/200/pp20
JESD51-5
JESD51-7
TZA3010BVH
soft ferrite handbook
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HTQFP100
Abstract: LQFP48 HBCC32 DB4042 CGY2110 TZA3001 TZA3013 TZA3023 TZA3031 TZA3033
Text: MSD818 Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part number Datarate Mb/s Package Type Bare Die TRANSIMPEDANCE AMPLIFIERS TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 155 622 1250 2488 3250 10700 39813 SO8 SO8 SO8 HVQFN24
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MSD818
TZA3033
TZA3023
TZA3043
TZA3013
CGY2102
CGY2110
CGY2140
2-12mV
HTQFP100
LQFP48
HBCC32
DB4042
CGY2110
TZA3001
TZA3013
TZA3023
TZA3031
TZA3033
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x band receiver
Abstract: BCC32 SA3601
Text: INTEGRATED CIRCUITS SA3601 Low voltage dual-band RF front-end Preliminary specification Philips Semiconductors 1999 Nov 09 Philips Semiconductors Preliminary specification Low voltage dual-band RF front-end SA3601 DESCRIPTION APPLICATIONS • 800 to 1000 MHz analog and digital receivers
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SA3601
SA3601
x band receiver
BCC32
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2.4 ghz FM TRANSMITTER CIRCUIT DIAGRAM
Abstract: BCC32 SA9502 SA9503 pcs-2
Text: INTEGRATED CIRCUITS SA9503 Dual-band, CDMA/AMPS LNA and downconverter mixers Objective specification Supersedes data of 1999 Jul 06 Philips Semiconductors 1999 Jul 29 Philips Semiconductors Objective specification Dual-band, CDMA/AMPS LNA and downconverter mixers
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SA9503
SA9503
2.4 ghz FM TRANSMITTER CIRCUIT DIAGRAM
BCC32
SA9502
pcs-2
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TZA3011A; TZA3011B 30 Mbits/s up to 3.2 Gbits/s laser drivers Objective specification File under Integrated Circuits, IC19 2001 Jan 29 Philips Semiconductors Objective specification 30 Mbits/s up to 3.2 Gbits/s laser drivers
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TZA3011A;
TZA3011B
TZA3011A:
TZA3011B:
403510/300/01/pp24
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8b 10b m-phy
Abstract: cgy2141 LQFP32 LQFP48 QFP64 TSSOP16 TZA3014 TZA3034 TZA3044 BARE die
Text: Chip sets for optical networking Delivering the broadband revolution Introduction: As a result of the Internet revolution in communications infrastructure the demand for data transmission bandwidth is expanding tenfold each year. Fiber optic transmission is the
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155Mb/s
40Gb/s.
IEEE1149
8b 10b m-phy
cgy2141
LQFP32
LQFP48
QFP64
TSSOP16
TZA3014
TZA3034
TZA3044
BARE die
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HVQFN20
Abstract: BGD502 BGR269 BGS67A BGY585A BGY587 BGY587B BGY588N BGY66B BGY67
Text: Semiconductors Product Portfolio RF Access Systems CATV RF Hybrid Amplifiers * Type Number Reverse Hybrids BGS67A BGY68 BGY66B BGY67 BGY67A BGR269 40 - 550MHz Push-Pulls BGY585A BGY587 BGY587B BGY588N 40 - 550 MHz Power Doubler BGD502 40 - 600MHz Push-Pulls
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BGS67A
BGY68
BGY66B
BGY67
BGY67A
BGR269
550MHz
BGY585A
BGY587
BGY587B
HVQFN20
BGD502
BGR269
BGS67A
BGY585A
BGY587
BGY587B
BGY588N
BGY66B
BGY67
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SA3601
Abstract: SA3601W
Text: INTEGRATED CIRCUITS SA3601 Low voltage dual-band RF front-end Product specification Supersedes data of 1999 Nov 09 Philips Semiconductors 2001 Feb 20 Philips Semiconductors Product specification Low voltage dual-band RF front-end SA3601 DESCRIPTION APPLICATIONS
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SA3601
SA3601
SA3601W
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JESD51-5
Abstract: JESD51-7 TZA3010B TZA3010BVH AVR IC Laser diode temperature
Text: INTEGRATED CIRCUITS DATA SHEET TZA3010B 30 Mbits/s up to 3.2 Gbits/s A-rate laser driver Product specification Supersedes data of 2001 Nov 16 2003 Apr 07 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rate laser driver TZA3010B
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TZA3010B
SCA75
403510/02/pp20
JESD51-5
JESD51-7
TZA3010B
TZA3010BVH
AVR IC
Laser diode temperature
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B45196
Abstract: BLM11P300S dipsw_4 OC48 STM16 TP97036 TZA3014 TZA3019 PHILIPS 433003036301 philips c3
Text: APPLICATION NOTE OM5808 demo board negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN01022 TP97036.2/F5.5 Philips Semiconductors OM5808 demo board negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01022 Abstract
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OM5808
TZA3014
TZA3019
AN01022
TP97036
OM5808.
B45196
BLM11P300S
dipsw_4
OC48
STM16
PHILIPS 433003036301
philips c3
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2222916
Abstract: B45196H1107M9 AN99072 OC48 STM16 TP97036 TZA3014 TZA3019 TZA3019A AN9907
Text: APPLICATION NOTE OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99072 TP97036.2/F5.5 Philips Semiconductors OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99072 Abstract
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OM5809
TZA3014
TZA3019
AN99072
TP97036
OM5809.
2222916
B45196H1107M9
AN99072
OC48
STM16
TZA3019A
AN9907
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MGT028
Abstract: TZA3019 TZA3019AHT TZA3019AVH TZA3019BHT TZA3019BVH TZA3019CHT TZA3019CVH
Text: INTEGRATED CIRCUITS DATA SHEET TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch Product specification Supersedes data of 2000 Apr 10 File under Integrated Circuits, IC19 2001 Jun 25 Philips Semiconductors Product specification
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TZA3019
403510/200/02/pp32
MGT028
TZA3019
TZA3019AHT
TZA3019AVH
TZA3019BHT
TZA3019BVH
TZA3019CHT
TZA3019CVH
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