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    HD64F3672 Search Results

    HD64F3672 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HD64F3672FYV Renesas Electronics Corporation Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), LQFP, / Visit Renesas Electronics Corporation
    HD64F3672FPV Renesas Electronics Corporation Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), LQFP, / Visit Renesas Electronics Corporation
    HD64F3672FXV Renesas Electronics Corporation Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), LQFP, / Visit Renesas Electronics Corporation
    HD64F3672FXIV Renesas Electronics Corporation Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion) Visit Renesas Electronics Corporation
    HD64F3672FYIV Renesas Electronics Corporation Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), LQFP, / Visit Renesas Electronics Corporation
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    HD64F3672 Price and Stock

    Rochester Electronics LLC HD64F3672FX

    IC MCU 16BIT 16KB FLASH 48LQFP
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    DigiKey HD64F3672FX Tray 1,378 47
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    Renesas Electronics Corporation HD64F3672FXV

    IC MCU 16BIT 16KB FLASH 48LQFP
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    Rochester Electronics HD64F3672FXV 22 1
    • 1 $6.21
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    Avnet Silica HD64F3672FXV 14 Weeks 320
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    New Advantage Corporation HD64F3672FXV 102 1
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    Renesas Electronics Corporation HD64F3672FYV

    IC MCU 16BIT 16KB FLASH 48LQFP
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    Renesas Electronics Corporation HD64F3672FPV

    IC MCU 16BIT 16KB FLASH 64LQFP
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    ComSIT USA HD64F3672FPV 40
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    Avnet Silica HD64F3672FPV 14 Weeks 320
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    New Advantage Corporation HD64F3672FPV 960 1
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    Win Source Electronics HD64F3672FPV 3,019
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    • 100 $10.286
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    Renesas Electronics Corporation HD64F3672FPIV

    IC MCU 16BIT 16KB FLASH 64LQFP
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    Avnet Silica HD64F3672FPIV 14 Weeks 320
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    HD64F3672 Datasheets (14)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HD64F3672 Hitachi Semiconductor ROM: 16kbytes RAM: 2.048 bytes single chip microcomputer. Falsh memory version Original PDF
    HD64F3672FP Renesas Technology 16-Bit Single-Chip Microcomputer Original PDF
    HD64F3672FPIV Renesas Technology Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 16BIT 16KB FLASH 64LQFP Original PDF
    HD64F3672FPIV Renesas Technology H8/Tiny Series, 3672 Group, FP-64E; Vcc= 3.0 to 5.5 volts, Temp= -40 to 85 C; Package: PLQP0064KC-A Original PDF
    HD64F3672FPV Renesas Technology Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 16BIT 16KB FLASH 64LQFP Original PDF
    HD64F3672FPV Renesas Technology H8/Tiny Series, 3672 Group, FP-64E; Vcc= 3.0 to 5.5 volts, Temp= -20 to 75 C; Package: PLQP0064KC-A Original PDF
    HD64F3672FX Renesas Technology 16-Bit Single-Chip Microcomputer Original PDF
    HD64F3672FXV Renesas Technology Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 16BIT 16KB FLASH 48LQFP Original PDF
    HD64F3672FXV Renesas Technology H8/Tiny Series, 3672 Group, FP-48F; Vcc= 3.0 to 5.5 volts, Temp= -20 to 75 C; Package: PLQP0048JA-A Original PDF
    HD64F3672FY Renesas Technology 16-Bit Single-Chip Microcomputer Original PDF
    HD64F3672FYIV Renesas Technology Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 16BIT 16KB FLASH 48LQFP Original PDF
    HD64F3672FYIV Renesas Technology H8/Tiny Series, 3672 Group, FP-48B; Vcc= 3.0 to 5.5 volts, Temp= -40 to 85 C; Package: PLQP0048KC-A Original PDF
    HD64F3672FYV Renesas Technology Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 16BIT 16KB FLASH 48LQFP Original PDF
    HD64F3672FYV Renesas Technology H8/Tiny Series, 3672 Group, FP-48B; Vcc= 3.0 to 5.5 volts, Temp= -20 to 75 C; Package: PLQP0048KC-A Original PDF

    HD64F3672 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CSTCE12M0G52-R0

    Abstract: TC4069UBP
    Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTCE12M0G52-R0 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.


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    PDF CSTCE12M0G52-R0 HD64F3672F 180mm) TCD-01-1741 TC4069UBP CSTCE12M0G52-R0 TC4069UBP

    CSTCR4M00G53

    Abstract: CSTCR4M00G53-R0 TC4069UBP
    Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTCR4M00G53-R0 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.


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    PDF CSTCR4M00G53-R0 HD64F3672F 180mm) TCD-01-1735 TC4069UBP CSTCR4M00G53 CSTCR4M00G53-R0 TC4069UBP

    ADE-702-247

    Abstract: ADE-702-282 ADE-502-055 E10T HD64F3670 HD64F3672 ADE-702-201
    Text: Hitachi Single-Chip Microcomputer H8/3672 Series H8/3672 HD64F3672 H8/3670 HD64F3670 Hardware Manual ADE-602-239A Rev. 2.0 03/20/02 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in


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    PDF H8/3672 H8/3672 HD64F3672 H8/3670 HD64F3670 ADE-602-239A ADE-702-247 ADE-702-282 ADE-502-055 E10T HD64F3670 HD64F3672 ADE-702-201

    HD64F3672FP

    Abstract: No abstract text available
    Text: Vdd HD64F3672FP OSC1 11 1 OSC2 10 FCR4.0MC5 V1H/V1L 3 V2H/V2L CL1 CL2 2 *BUILT-IN LOADING CAPACITOR CL1/CL2=30/30pF +/-20% Oscillating circuit for evaluation


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    PDF HD64F3672FP 30/30pF HD64F3672FP

    CSTCC2M00G56-R0

    Abstract: TC74HCU04
    Text: Technical Data of Ceramic Resonator * New Part No. Previous Part No. : CSTCC2M00G56-R0 : CSTCC2.00MG0H6 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)


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    PDF CSTCC2M00G56-R0 00MG0H6 HD64F3672F 180mm) TCD-01-1733 TC74HCU04 CSTCC2M00G56-R0 TC74HCU04

    99565

    Abstract: TC4069UBP
    Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTCE10M0G52-R0 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.


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    PDF CSTCE10M0G52-R0 HD64F3672F 180mm) TCD-01-1739 TC4069UBP 99565 TC4069UBP

    CSTLS4M00G53-B0

    Abstract: CSTS0400MG03 TC4069UBP
    Text: Technical Data of Ceramic Resonator * New Part No. Previous Part No. : CSTLS4M00G53-B0 : CSTS0400MG03 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)


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    PDF CSTLS4M00G53-B0 CSTS0400MG03 HD64F3672F 180mm) TCD-01-1736 TC4069UBP CSTLS4M00G53-B0 CSTS0400MG03 TC4069UBP

    CSTCE8M00G52-R0

    Abstract: TC4069UBP
    Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTCE8M00G52-R0 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.


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    PDF CSTCE8M00G52-R0 HD64F3672F 180mm) TCD-01-1737 TC4069UBP CSTCE8M00G52-R0 TC4069UBP

    HD64F3672FP

    Abstract: HD64F3672
    Text: Vdd HD64F3672FP OSC1 11 1 OSC2 10 FCR8.0MC5 V1H/V1L 3 V2H/V2L CL1 CL2 2 *BUILT-IN LOADING CAPACITOR CL1/CL2=20/20pF +/-20% Oscillating circuit for evaluation


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    PDF HD64F3672FP 20/20pF HD64F3672FP HD64F3672

    HD64F3672FP

    Abstract: No abstract text available
    Text: REPORT NO. Q2002Y-210 Renesas Technology Corp. OPERATION TEST REPORT ON TDK CERAMIC RESONATOR FCR4.0MC5 SINGLECHIP MICROCOMPUTER HD64F3672FP (RENESAS) JULY,5,2002 Sensors & Actuators Division, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation


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    PDF Q2002Y-210 HD64F3672FP 30/30pF HD64F3672FP

    CSTLS10M0G53-B0

    Abstract: CSTS1000MG03 TC4069UBP
    Text: Technical Data of Ceramic Resonator * New Part No. Previous Part No. : CSTLS10M0G53-B0 : CSTS1000MG03 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)


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    PDF CSTLS10M0G53-B0 CSTS1000MG03 HD64F3672F 180mm) TCD-01-1740 TC4069UBP CSTLS10M0G53-B0 CSTS1000MG03 TC4069UBP

    HD64F3672

    Abstract: FCR16 HD64F3672FP OSC1
    Text: Vdd HD64F3672FP OSC1 11 OSC2 10 FCR16.0M2G 1 2 V1H/V1L V2H/V2L CL1 CL2 5pF 5pF Oscillating circuit for evaluation


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    PDF HD64F3672FP FCR16 HD64F3672 HD64F3672FP OSC1

    "Ceramic Resonator"

    Abstract: HD64F3672FP
    Text: REPORT NO. Q2002Y-211 Renesas Technology Corp. OPERATION TEST REPORT ON TDK CERAMIC RESONATOR FCR8.0MC5 SINGLECHIP MICROCOMPUTER HD64F3672FP (RENESAS) JULY,5,2002 Sensors & Actuators Division, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation


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    PDF Q2002Y-211 HD64F3672FP 20/20pF "Ceramic Resonator" HD64F3672FP

    HD64F3672FP

    Abstract: "Ceramic Resonator" FCR16
    Text: REPORT NO. Q2002Y-212 Renesas Technology Corp. OPERATION TEST REPORT ON TDK CERAMIC RESONATOR FCR16.0M2G SINGLECHIP MICROCOMPUTER HD64F3672FP (RENESAS) JULY,5,2002 Sensors & Actuators Division, TDK CORPORATION 1.Contents (1) Oscillating circuit for evaluation


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    PDF Q2002Y-212 FCR16 HD64F3672FP HD64F3672FP "Ceramic Resonator"

    CSTLS8M00G53-B0

    Abstract: TC4069UBP
    Text: Technical Data of Ceramic Resonator * New Part No. Previous Part No. : CSTLS8M00G53-B0 : CSTS0800MG03 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)


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    PDF CSTLS8M00G53-B0 CSTS0800MG03 HD64F3672F 180mm) TCD-01-1738 TC4069UBP CSTLS8M00G53-B0 TC4069UBP

    CSTLS16M0X51-B0

    Abstract: TC74HCU04
    Text: Technical Data of Ceramic Resonator MURATA Part No.: CSTLS16M0X51-B0 Applied to HD64F3672F Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package Ho=18mm -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm) -B0 : Bulk TOYAMA MURATA MANUFACTURING CO., LTD.


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    PDF CSTLS16M0X51-B0 HD64F3672F 180mm) TCD-01-1745 Frequ6030 TC74HCU04 CSTLS16M0X51-B0 TC74HCU04

    micome

    Abstract: ADE-702-246 HD64F3670 HD64F3672 ABS08 Hitachi DSA00495
    Text: Hitachi Single-Chip Microcomputer H8/3672 Series H8/3672F-ZTATTM HD64F3672 H8/3670F-ZTATTM HD64F3670 Hardware Manual ADE-602-239 Rev. 1.0 03/20/01 Hitachi, Ltd. Rev. 2.0, 03/01, page ii of xxiv Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s


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    PDF H8/3672 H8/3672F-ZTATTM HD64F3672 H8/3670F-ZTATTM HD64F3670 ADE-602-239 micome ADE-702-246 HD64F3670 HD64F3672 ABS08 Hitachi DSA00495

    E10T

    Abstract: HD64F3670 HD64F3672 ADE-702-247 ADE-702-282
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF H8/3672 E10T HD64F3670 HD64F3672 ADE-702-247 ADE-702-282

    HD64F2166VTE33V

    Abstract: HD64F2368VTE34V HD64F2318VTE25V HD64F2638F20V HD64F2168VTE33V HD64F2398F20V HD64F2676VFC33V HD6412352F20V HD64F2238BFA13V HD64F2238RTE13V
    Text: H8 Family of Microcontrollers Renesas Technology America H8® Family of Microcontrollers RENESAS IS #1 WORLDWIDE IN MCU SHIPMENTS 2006 Catalog In 2005, Renesas earned a 23% share of the global MCU market — more than any other supplier — and an 11% market share in


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    PDF 0806/10K/VIP/PF/SP REU01B0011-0101 HD64F2166VTE33V HD64F2368VTE34V HD64F2318VTE25V HD64F2638F20V HD64F2168VTE33V HD64F2398F20V HD64F2676VFC33V HD6412352F20V HD64F2238BFA13V HD64F2238RTE13V

    schematic diagram atx Power supply 500w

    Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455


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    PDF P462-ND P463-ND LNG295LFCP2U LNG395MFTP5U US2011) schematic diagram atx Power supply 500w pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS

    R5F72543

    Abstract: r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835
    Text: Renesas MPU & MCU General Catalog 2009.10 2009.10 Renesas MPU & MCU General Catalog Renesas MPU & MCU General Catalog RJJ01B0001-1200 2009. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 11.1 Renesas Technology www.renesas.com


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    PDF RJJ01B0001-1200 REJ01B0008-1200 R5F72543 r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835

    FCR16

    Abstract: HD64F3672FP
    Text: IC dependence of osci Mating characteristies HD64F3672FP FCRI6.0M2G - S Room Temp. Udd CU] 5 item a~e CLI/CL2 CpF] 5 / 5 HD64F3672FP - 10 FCR16.0M2G Udd= 5 EU] (Fig.a~d) Ta= 20 Edeg] o a. U1H/U1L 7 5 3 U1H B- — U1L 1 i i i i 1 1 - 1— 1


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    PDF HD64F3672FP FCR16

    HD64F3672FP

    Abstract: 2a92
    Text: IC dependence of osci Mating characteristies HD64F3672FP FCR8.0MC5 - S Room Temp. Udd CU] 5 item a~e H D 6 4 F 3 6 7 2 F P - 10 FCR 8 . 0 M C 5 Udd= 5 EU] o 0 Tupical EU]_ _ a. U 1 H / U 1 L UIH 4a8 4a9 4a9 I I I


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    PDF HD64F3672FP 2a92

    HD64F3672FP

    Abstract: No abstract text available
    Text: IC dependence of osci Mating characteristies HD64F3672FP FCR4.0MC5 - S Room Temp. Udd CU] 5 item a~e HD64F3672FP - 10 FCR4.0MC5 Ta= 25 Edeg] a. U1H/U1L EU] U1H -.3 -.5 400 Udd EU] [U] U2H B- U2L ^ d. Tr ise 0 Typical » Worst_ b- b. U2H/U2L c. Fosc o *-—


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    PDF HD64F3672FP