equivalent 2sk2837 mosfet
Abstract: No abstract text available
Text: Power MOSFET Heat Sink Design Power MOSFET in Detail 6. Heat Sink Design 6.1 Maximum Allowable Power Dissipation and Radiation Equivalent Circuits When the circuit has been designed for fully adequate thermal stability, the maximum allowable power dissipation PDmax for power MOSFETs can be determined based on the power MOSFET’s
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J137
Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for
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G3PA-260B-VD,
G3PA-450B-VD-2.
G3PA-210B-VD
G3PA-220B-VD
K094-E1-04
J137
nissei capacitor
nissei capacitors
capacitor list nissei datasheet
G32A-A20-VD
G32A-A430
capacitor list nissei
G3PA-220B-VD
i2t graph
phototriac
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
Text: Solid State Relays G3PA Refer to Warranty and Application Considerations page 1 , Safety Precautions (page 4), and Technical and Safety Information (page 6). Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink.
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G3PA-260B-VD
G3PA-450B-VD-2.
K094-E1-06
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260BL-VD
G3PA-450B-VD-2
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
K094-E1-06
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260B-VD
G3PA-450B-VD-2
J-21
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260B-VD
G3PA-450B-VD-2
J-21
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-430B-VD-2 G3PA-450B-VD-2
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.
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G3PA-260B-VD
G3PA-450B-VD-2.
G3PA-430B-VD-2
DC12-24)
omron247
NL-2132
J26I-E-01
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-450B-VD-2
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Untitled
Abstract: No abstract text available
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.
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G3PA-260B-VD
G3PA-450B-VD-2.
G3PA-430B-VD-2
DC12-24)
J01C-E-01a
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Untitled
Abstract: No abstract text available
Text: Solid State Relays G3PA CSM_G3PA_DS_E_3_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
Text: Solid State Relays G3PA CSM_G3PA_DS_E_2_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260BL-VD
G3PA-260B-VD
G3PA-450B-VD-2
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Untitled
Abstract: No abstract text available
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.
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G3PA-260B-VD
G3PA-450B-VD-2.
G3PA-430B-VD-2
DC12-24)
X301-E-1b
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EN60947
Abstract: EN6094 G32A-A10-VD G3PA-210B-VD DC5-24 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G32A-A430 G3PA-240B-VD
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.
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G3PA-260B-VD
G3PA-450B-VD-2.
G3PA-430B-VD-2
DC12-24)
X301-E-1
EN60947
EN6094
G32A-A10-VD
G3PA-210B-VD DC5-24
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G32A-A430
G3PA-240B-VD
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G3PA
Abstract: TOSHIBA DIODE CATALOG Wiring Duct G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD
Text: Solid State Relays G3PA CSM_G3PA_DS_E_2_2 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
G3PA
TOSHIBA DIODE CATALOG
Wiring Duct
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260BL-VD
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TL12
Abstract: TL12W01-D TL12W02-D TL12W02-L
Text: Application note for Power LED 1 Application note for Power LED (1) <Thermal design for TL12series> 1. Introduction Applications for LED lamps are increasing in many fields, such as cellular phones, automotive interiors/exteriors, amusement equipment, signs/displays and consumer electronic devices. Toshiba provides various
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TL12series>
100mA;
TL12
TL12W01-D
TL12W02-D
TL12W02-L
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TD62064AFG
Abstract: TD62064 TD62064APG TD62074AFG TD62074APG DARLINGTON SINK DRIVER TD62074
Text: TD62064,074APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064APG,TD62064AFG,TD62074APG,TD62074AFG 4ch High-Current Darlington Sink Driver The TD62064APG/AFG and TD62074APG/AFG are high-voltage, high-current darlington drivers comprised of four
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TD62064
074APG/AFG
TD62064APG
TD62064AFG
TD62074APG
TD62074AFG
TD62064APG/AFG
TD62074APG/AFG
TD62064APG
TD62074AFG
DARLINGTON SINK DRIVER
TD62074
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TA7267BP
Abstract: YG6260 working of fused tube light using diodes TOSHIBA DIODE GLASS MOLD
Text: [ 2 ] Handling Precautions [ 2 ] Handling Precautions 1. Using Toshiba Semiconductors Safely TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity
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20-pin
TA7267BP
YG6260
working of fused tube light using diodes
TOSHIBA DIODE GLASS MOLD
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ignition coil npn power darlington
Abstract: HSOP16 TD62064 TD62064BFG TD62064BP1G
Text: TD62064BP1G/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064BP1G,TD62064BFG 4ch High-Current Darlington Sink Driver The TD62064BP1G and TD62064BFG are high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for
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TD62064BP1G/BFG
TD62064BP1G
TD62064BFG
TD62064BFG
TD62064BP1G
ignition coil npn power darlington
HSOP16
TD62064
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TD62064AP
Abstract: td62064af equivalent ic ignition coil npn power darlington TD62064AF TD62064AP DIP-16
Text: TD62064AP/AF TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064AP, TD62064AF 4ch High-Current Darlington Sink Driver The TD62064AP/AF is high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for switching inductive
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TD62064AP/AF
TD62064AP,
TD62064AF
TD62064AP/AF
TD62064AP
DIP-16
HSOP-16
TD6206
TD62064AP
td62064af equivalent ic
ignition coil npn power darlington
TD62064AF
TD62064AP DIP-16
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Untitled
Abstract: No abstract text available
Text: TD62318BPG/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318BPG,TD62318BFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318BPG and TD62318BFG are non-inverting transistor array which are comprised of four NPN darlington output stages
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TD62318BPG/BFG
TD62318BPG
TD62318BFG
TD62318BFG
TD62318BP1G
DIP-16
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Untitled
Abstract: No abstract text available
Text: TD62308AP/AF TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308AP,TD62308AF 4ch Low Input Active High-Current Darlington Sink Driver The TD62308AP/AF is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP
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TD62308AP/AF
TD62308AP
TD62308AF
TD62308AP/AF
TD62308AP
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Untitled
Abstract: No abstract text available
Text: TD62318APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318APG,TD62318AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318APG and TD62318AFG are non-inverting transistor arrays which are comprised of four NPN darlington output stages
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TD62318APG/AFG
TD62318APG
TD62318AFG
TD62318AFG
TD62318APG
TD62318AFGe
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TD62308APG
Abstract: ignition coil npn power darlington TD62308AFG
Text: TD62308APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308APG,TD62308AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62308APG/AFG is a non−inverting transistor array which is comprised of four NPN darlington output stages and
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TD62308APG/AFG
TD62308APG
TD62308AFG
TD62308APG/AFG
TD62308APG
ignition coil npn power darlington
TD62308AFG
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HSOP16-P-300-1
Abstract: No abstract text available
Text: TD62318BPG/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318BPG,TD62318BFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318BPG and TD62318BFG are non-inverting transistor array which are comprised of four NPN darlington output stages
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TD62318BPG/BFG
TD62318BPG
TD62318BFG
TD62318BFG
TD62318BP1G
DIP-16
HSOP16-P-300-1
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TD62318AFG
Abstract: TD62318APG
Text: TD62318APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318APG,TD62318AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318APG and TD62318AFG are non-inverting transistor arrays which are comprised of four NPN darlington output stages
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TD62318APG/AFG
TD62318APG
TD62318AFG
TD62318AFG
TD62318APG
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2SB553
Abstract: No abstract text available
Text: TO SH IBA 2SB553 TOSHIBA TRANSISTOR SILICON PNP TRIPLE DIFFUSED TYPE PCT PROCESS 2SB553 INDUSTRIAL APPLICATIONS Unit in mm HIGH CURRENT SWITCHING APPLICATIONS. POWER AMPLIFIER APPLICATIONS. 10.3MAX, Low Collector Saturation Voltage : v CE(sat)= —0.4V (Max.) at 1C= -4 A
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2SB553
2SD553.
2SB553
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