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    HEAT SLUG Search Results

    HEAT SLUG Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ADR1399KEZ Analog Devices Precision Heated Buried Zener Visit Analog Devices Buy
    ADR1399KHZ Analog Devices Precision Heated Buried Zener Visit Analog Devices Buy
    ADR1001AEZ Analog Devices Heated Buried Zener Prec Volta Visit Analog Devices Buy
    AD9148BBCZ Analog Devices 16 Bit Quad DAC W/O Heat Sprea Visit Analog Devices Buy
    AD9148BBCZRL Analog Devices 16 Bit Quad DAC W/O Heat Sprea Visit Analog Devices Buy

    HEAT SLUG Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TB499

    Abstract: No abstract text available
    Text: Technical Brief 499 PCB Thermal Land Design for Ceramic Packages with Bottom Metal or Heat Sinks Introduction Certain Intersil ceramic packages include bottom metal or bottom heat sinks also called heat slugs . When present, these features will be noted on Intersil’s product datasheet


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    PDF TB499

    Untitled

    Abstract: No abstract text available
    Text: Package Outlines 8-LEAD SMALL OUTLINE PACKAGE WITH HEAT SLUG SG 0.1935 +/- 0.0035 (4.915 +/- 0.085) 0.1 +/- 0.01 (2.54 +/- 0.25) Heat Slug 0.1535 +/- 0.0035 0.236 +/- .008 (3.9) (+/- 0.09) (5.995) (+/- 0.205) 0.0165 +/- 0.0035 (0.42 +/- 0.09) 0.14 +/- 0.01


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    PDF A091004

    mps 442

    Abstract: mps 0737 SOIC20W SOIC-20W MF-PO-D-0004 0040
    Text: PACKAGE OUTLINE DRAWING SOIC20W Wide Body / Heat Slug MF-PO-D-0004 revision 0.1 TM Monolithic Power Systems TM 0.280 (7.11) 0.300 (7.62) 0.010(0.254) x 45o 0.029(0.737) HEAT SLUG EXPOSED AREA GATE PLANE 0.195 0.215 (4.95) (5.46) 0.016 0.050 (0.406) (1.270)


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    PDF SOIC20W MF-PO-D-0004 mps 442 mps 0737 SOIC20W SOIC-20W 0040

    749 013 020

    Abstract: mps 299
    Text: TM Monolithic Power Systems TM PACKAGE OUTLINE DRAWING SOIC24WR Wide Body / Heat Slug / Reverse Lead Bend MF-PO-D-0027 revision 0.0 HEAT SLUG EXPOSED AREA on Top surface of package .614(15.59) .600 (15.24) .490 (12.45) .470 (11.94) .299 (7.59) .295 (7.49)


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    PDF SOIC24WR MF-PO-D-0027 749 013 020 mps 299

    mps 442

    Abstract: mps 643 7595
    Text: TM Monolithic Power Systems TM PACKAGE OUTLINE DRAWING SOIC20WR Wide Body / Heat Slug / Reverse Lead Bend MF-PO-D-0021 revision 0.0 0.280 (7.11) 0.300 (7.62) 0.010(0.254) x 45o 0.029(0.737) HEAT SLUG EXPOSED AREA on Top surface of package GATE PLANE 0.195


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    PDF SOIC20WR MF-PO-D-0021 iD-0021 mps 442 mps 643 7595

    afb0712hhb

    Abstract: AFB0712HHB fan DELTA fan 3P-2510 AMD Processor Power and Thermal amd3000 K8 specific
    Text: AMD AthlonTM 64 K8 Processor Fan Heat Sink ACTIVE HEAT SINK FOR AMD ATHLONTM 64 3000 AND 3200 2.0 GHz PROCESSOR Aavid’s thermal solution for AMD 3000 and 3200 2.0 GHz AthlonTM 64 (K8) processor. The heat sink is designed for engineers seeking a cost effective solution for mainstream


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    heat slug

    Abstract: heat sink
    Text: HEATSINK ISSUES FOR MICROPROCESSOR PRODUCTS WITH INTEGRAL SLUG TECHNICAL NOTE TN-25 Integrated Device Technology, Inc. SUMMARY: Designing in highly integrated, high clock rate microprocessors such as the R4600 requires careful consideration of thermal management. To ease this burden IDT utilizes an integral heat slug technology in its pin grid array packages. This heat slug


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    PDF TN-25 R4600 heat slug heat sink

    JESD51-2

    Abstract: exposed QFP 144 100L JESD51-7 Techpoint
    Text: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad


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    BAI-003

    Abstract: No abstract text available
    Text: RF Coaxial Connectors AI-90, AI-237, AI-773 & BBAI-1212 HEAT SHRINKABLE TUBING Assembly Instructions SMA & MCX Right Angle Connectors, Crimp Type for Braided Cable CRIMP FERRULE CAP BODY ASSEMBLY 1. Slide ferrule and if supplied heat shrinkable tubing on to cable.


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    PDF AI-90, AI-237, AI-773 BBAI-1212 AI-90 AI-237 M17/29-RG59/U BAI-003

    Untitled

    Abstract: No abstract text available
    Text: Technical Note AN-00-017 Heat Sinking High-Power Surface Mount Components Heat Sinking of Surface Mount Components or High-Power Operation in Case Style AH1647 Purpose: Method for Heat Sinking: The purpose of this application note is to describe a


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    PDF AN-00-017 AH1647Â M150261Â AN00017

    luxeon 1w RED

    Abstract: Luxeon luxeon 1w Luxeon 2002 IEC825 IEC825-Class ROYAL high voltage resistor
    Text: Electrical Drive Information Luxeon Emitter, Star, Star/C & Star/O TM Driving a single Luxeon TM Fig.1 Luxeon Star light source LEDs should be driven at a constant current. The power dissipation causes the LED to heat up. Excessive heat destroys the LED. Please


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    PDF 120oC. luxeon 1w RED Luxeon luxeon 1w Luxeon 2002 IEC825 IEC825-Class ROYAL high voltage resistor

    honeywell pcm45

    Abstract: CEK 550 PCM45F G751 thermal test vehicle -intel
    Text: Heat Sink for Intel Xeon Potomac MP and Nocona DP Processors in 4U Servers PASSIVE HEAT SINK FOR INTEL® XEON™ POTOMAC MP AND NOCONA DP PROCESSORS Aavid’s solution for Xeon™ Potomac MP and Nocona DP processors is designed specifically for thermal engineers


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    PA78DK

    Abstract: AN-23
    Text: AN23 APEX – AN23 Heat Sinking Options and Techniques for Thermally Enhanced SMT Packages Summary With the migration of certain Cirrus Logic power amplifier and PWM amplifier products from the EU and CX pinthrough-hole packages to the surface mount DK package, customers may find the heat sinking requirements to


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    PDF PA78DK AN23U AN-23

    S70GB7C

    Abstract: ae1004
    Text: HEAT SLUG Part No. S70GB7C Features Highest Flux BLUE High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps Superior ESD protection Typical Applications Decorative


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    PDF S70GB7C S70GB7C ae1004

    2502 marking

    Abstract: AR2500 AR2510
    Text: AR2500 THRU AR2510 AUTOMOTIVE RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 25.0 Amperes Features Low cost Low leakage Low forward voltage drop High current capability Mechanical Data DIM ENSIONS Copper heat sink Tin-plated slug easy for soldering


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    PDF AR2500 AR2510 UL94V-0 MIL-STD-750D 2502 marking AR2510

    S70NW6C

    Abstract: No abstract text available
    Text: HEAT SLUG Part No. S70NW6C Features Highest Flux White High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications


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    PDF S70NW6C S70NW6C

    led flashlight

    Abstract: S30NW6C
    Text: HEAT SLUG Part No. S30NW6C Features Highest Flux White High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications


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    PDF S30NW6C led flashlight S30NW6C

    led flashlight

    Abstract: S70GR2C
    Text: HEAT SLUG Part No. S70GR2C Features Highest Flux RED High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications


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    PDF S70GR2C led flashlight S70GR2C

    S30EB7C

    Abstract: No abstract text available
    Text: HEAT SLUG Part No. S30EB7C Features Highest Flux Blue High reliability and Very long operating life up to 100K hours Low voltage DC operated More Energy Efficient than Incandescent and most Halogen lamps NO UV Superior ESD protection Typical Applications


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    PDF S30EB7C S30EB7C

    RA351

    Abstract: RA352 RA353 RA354 RA355 RA356 RA357
    Text: RA351 THRU RA357 AUTOMOTIVE RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 35.0 Amperes Features Low cost Low leakage Low forward voltage drop High current capability Mechanical Data DIM ENSIONS Copper heat sink Tin-plated slug easy for soldering


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    PDF RA351 RA357 UL94V-0 MIL-STD-750D RA352 RA353 RA354 RA355 RA356 RA357

    RUJ 17 33

    Abstract: 3145
    Text: AMI A M I S E M IC O N D U C T O R %s PQ2 Packaging Capabilities . . Description Surface Mount The Power Quad II is a molded plastic quad flatpack with improved thermal performance. The Power Quad II isconstruced using a copper lead frame which is directly attached to a copper heat slug. The heat slup increases the thermal


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    AMI 602

    Abstract: amis 339 IC 406 1AMI
    Text: % s AMI AMI WE M l C O N D U C T O R Packaging Capabilities PS0P2 . . Description Surface Mount The PowerSOP 2 package has an exposed, copper heat slug which significantly increases the thermal efficiency of power-constrained SOICs. The PSOP2 improves the Theta JA greater than 50% over a standard SOIC. The increased ability to dissipate heat is via a large integrated


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    Untitled

    Abstract: No abstract text available
    Text: CRECTROM SEMICONDUCTOR TECHNICAL SPECIFICATION AUTOMOTIVE RECTIFIER VOLTAGE RANGE-50 to 1000 Volts CURRENT-25 Amperes FEATURES * Low cost * Low leakage * Low forward voltage drop * High current capability MECHANICAL DATA * Copper heat sink * Tin-plated slug easy for soldering


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    PDF RANGE-50 CURRENT-25 L94V-0 RA251 RA252 RA2510 RA2505 RA2510)

    Untitled

    Abstract: No abstract text available
    Text: C RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION AUTOMOTIVE RECTIFIER VOLTAGE RANGE-50 to 1000 Volts CURRENT-25 Amperes FEATURES * Low cost * Low leakage * Low forw ard voltage drop * High current capability RA MECHANICAL DATA * Copper heat sink * Tin-plated slug easy for soldering


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    PDF RANGE-50 CURRENT-25 RA2505 RA251 RA2505 RA2510) 7bl0240