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    HEAT SYNC Search Results

    HEAT SYNC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USB2AMBMMC-001 Amphenol Cables on Demand Amphenol CS-USB2AMBMMC-001 Amphenol USB 2.0 High Speed Certified [480 Mbps] USB Type A to Micro B Cable - USB 2.0 Type A Male to Micro B Male [Android Sync + 28 AWG Fast Charge Ready] 1m (3.3') Datasheet
    CS-USB3IN1WHT-000 Amphenol Cables on Demand Amphenol CS-USB3IN1WHT-000 3-in-1 USB 2.0 Universal Apple/Android Charge & Sync Cable Adapter - USB Type A Male In - Apple Lightning (8-Pin) / Apple 30-Pin / USB Micro-B (Android) Male Out - White Datasheet
    CS-USB2AMBMMC-002 Amphenol Cables on Demand Amphenol CS-USB2AMBMMC-002 Amphenol USB 2.0 High Speed Certified [480 Mbps] USB Type A to Micro B Cable - USB 2.0 Type A Male to Micro B Male [Android Sync + 28 AWG Fast Charge Ready] 2m (6.6') Datasheet
    54S163J/B Rochester Electronics LLC 54S163 - Synchronous 4-Bit Counters Visit Rochester Electronics LLC Buy
    74167N-ROCS Rochester Electronics 74167 - Sync Decade Rate Multipliers Visit Rochester Electronics Buy

    HEAT SYNC Datasheets Context Search

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    mosfet transistor 100w amplifier

    Abstract: LTC3813 LTC3814-5 LTC3562 Si7850 24v 12v to 5v 20A regulator 24v 12v 20A regulator B1100 BAS19 LTC38145
    Text: DESIGN FEATURES L Synchronous Boost Converters Provide High Voltage without the Heat by Greg Dittmer Introduction The LTC3813 and LTC3814-5 reduce the size of high voltage, high power boost converters by incorporating heat-saving features that eliminate


    Original     		PDF LTC3813 LTC3814-5 mosfet transistor 100w amplifier LTC3562 Si7850 24v 12v to 5v 20A regulator 24v 12v 20A regulator B1100 BAS19 LTC38145

    pt8a3300

    Abstract: AC220V Timer Switch circuit diagram of 20 watt led driver for 220v ac 110V AC to 5V DC ic PT0284 PT8A3301
    Text: PT8A330xA/B Ceramic Heat Controller | | |


    Original     		PDF PT8A330xA/B 120VAC 240VAC PT8A330X PT0284-1 pt8a3300 AC220V Timer Switch circuit diagram of 20 watt led driver for 220v ac 110V AC to 5V DC ic PT0284 PT8A3301

    Untitled

    Abstract: No abstract text available
    Text: PT8A330xA/B Ceramic Heat Controller | | |


    Original     		PDF PT8A330xA/B PT8A330X PT0284-1

    LTC4440-5

    Abstract: 10V15V DFLS160 equivalent BG1 LED multiphase boost synchronous LT3756 lt3782a BG1 pwm design ideas PD3S160
    Text: DESIGN IDEAS L High Power 2-Phase Synchronous Boost Replaces Hot Diodes with Cool FETs—No Heat Sinks Required by Narayan Raja, Tuan Nguyen and Theo Phillips Introduction For low power designs, non-synchronous boost converters offer a simple solution. However, as power levels increase, the heat dissipated in the boost


    Original     		PDF LT3782A LT3756 LT3782A LTC4440-5 10V15V DFLS160 equivalent BG1 LED multiphase boost synchronous LT3756 BG1 pwm design ideas PD3S160

    PT8A3304

    Abstract: pt8a3300
    Text: Data Sheet PT8A330x Ceramic Heat Controller |


    Original     		PDF PT8A330x 120VAC 240VAC PT0258 PT8A3304 pt8a3300

    circuit diagram of 20 watt led driver for 220v ac

    Abstract: aa vb 399 information of D2 1N4007 1 watt led with heat led driver circuit diagram ptc resistor 45 pt8a3300
    Text: Data Sheet PT8A330xA/B Ceramic Heat Controller |


    Original     		PDF PT8A330xA/B 120VAC 240VAC PT8A330X PT0284 circuit diagram of 20 watt led driver for 220v ac aa vb 399 information of D2 1N4007 1 watt led with heat led driver circuit diagram ptc resistor 45 pt8a3300

    1N4007 BL

    Abstract: pt8a3353 VT130H VT220H U2231 PTC 2K sensor PT8A3353A 1N4007+BL VT210
    Text: Data Sheet PT8A335xA/B Ceramic Heat Controller LCD |


    Original     		PDF PT8A335xA/B PT0281 1N4007 BL pt8a3353 VT130H VT220H U2231 PTC 2K sensor PT8A3353A 1N4007+BL VT210

    DSP56301

    Abstract: DSP56301PW66
    Text: Design Considerations Heat Dissipation Considerations Power, Ground, and Noise Design Considerations Heat Dissipation Considerations The average chip-junction temperature, TJ, in °C can be obtained from: TJ = TA + PD x ΘJA (1) Where: TA = Ambient Temperature, °C


    Original     		PDF DSP56301 DSP56301 DSP56301PW66 DSP56301PW66

    noise cancelling mic circuit

    Abstract: DSP56156 DSP56156FE40 DSP56156FE60 DSP56156FV40 DSP56156FV60 T101 T103 SPKP
    Text: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + PD x ΘJA (1) Where: TA = ambient temperature, °C ΘJA = package thermal resistance,


    Original     		PDF DSP56156 DSP56156FE40 DSP56156FE60 DSP56156FV40 DSP56156FV60 noise cancelling mic circuit DSP56156FE40 DSP56156FE60 DSP56156FV40 DSP56156FV60 T101 T103 SPKP

    00FF

    Abstract: DSP56005 LS09 MBD301 MC68000
    Text: Design Considerations Heat Dissipation Design Considerations outside ambient ΘCA . These terms are related by the equation: Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + (PD x ΘJA) (1) Where: TA = ambient temperature, °C


    Original     		PDF DSP56005 DSP56005 DSP56005PV50 00FF LS09 MBD301 MC68000

    DSP56002FC40

    Abstract: A0655 00FF DSP56002 LS09 MC68000 DSP56002RC40 01CC00 M52DC BR a94
    Text: Design Considerations Heat Dissipation Design Considerations outside ambient ΘCA . These terms are related by the equation: Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + (PD x ΘJA) (1) Where: TA = ambient temperature, °C


    Original     		PDF DSP56002/L002 DSP56002 DSP56002RC40 DSP56002FC40 DSP56002FC66 DSP56002PV40 DSP56002PV66 DSP56L002FC40 DSP56L002PV40 DSP56L002 DSP56002FC40 A0655 00FF DSP56002 LS09 MC68000 DSP56002RC40 01CC00 M52DC BR a94

    BD5431

    Abstract: No abstract text available
    Text: 1/4 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: PACKAGE: FEATURES: HTSSOP-A44 BD5431EFS 1 2) 3) 4) 5) 6) Differential Analog / PWM inputs High efficiency and low heat generation eliminates external heat-sinks


    Original     		PDF BD5431EFS HTSSOP-A44 R1120A BD5431

    r033f

    Abstract: MBRS0530 TPSE337M006R100 55380 DN135 LR2010-01-R033 UPL1C152MHH LTC1435 LTC1436 MBRD835L
    Text: advertisement Efficient Processor Power System Needs No Heat Sink Design Note 135 John Seago New designs require more functionality in an ever decreasing package size. Compact, efficient high frequency power supplies are required and there is seldom room for a heat


    Original     		PDF LTC1435 LTC1435 DN135 TPSE226M035R300 TPSE337M006R100 MBRS0530 MBRS140T3 CDRH125-10 Si4412DY LR2010-01-R033-F r033f MBRS0530 TPSE337M006R100 55380 LR2010-01-R033 UPL1C152MHH LTC1436 MBRD835L

    Untitled

    Abstract: No abstract text available
    Text: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.


    Original     		PDF E258596 MIL-STD-202,

    Untitled

    Abstract: No abstract text available
    Text: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.


    Original     		PDF E258596 MIL-STD-202, GBPC35005W GBPC35005

    Untitled

    Abstract: No abstract text available
    Text: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.


    Original     		PDF E258596 MIL-STD-202, GBPC35005W GBPC35005

    Untitled

    Abstract: No abstract text available
    Text: FEATURES Š High efficiency: 92.0% @3.3V/30A Š Size: 58.4mm x 22.8mm x9.5mm 2.30”x0.90”x0.37” (W/O heat-spreader) 58.4mm x 22.8mm x12.7mm (2.30”x0.90”x0.50”)(With heat-spreader) Š Industry standard pin out Š Fixed frequency operation Š SMD and through-hole versions


    Original     		PDF V/30A E48SH, V/30A E48SH3R330

    Untitled

    Abstract: No abstract text available
    Text: 1/9 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: BD5427MUV PACKAGE: FEATURES: VQFN048V7070 1 2) High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply is


    Original     		PDF BD5427MUV VQFN048V7070

    LTC3026

    Abstract: design ideas linear voltage regulators 3 to 4 amp 2A 12v Low Dropout Regulator
    Text: DESIGN IDEAS LDO Linear Regulators Rival Switchers for Efficiency Introduction Thermal Limitations While efficiency is always quoted as a benchmark for switching regulators, power loss is often more important. Power loss sets the size of the heat sink, and the size of the heat sink is—more


    Original     		PDF 500mA LTC3026 design ideas linear voltage regulators 3 to 4 amp 2A 12v Low Dropout Regulator

    Untitled

    Abstract: No abstract text available
    Text: 1/7 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: BD5427EFS PACKAGE: FEATURES: HTSSOP-A44 1 2) High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply is


    Original     		PDF BD5427EFS HTSSOPA44

    Untitled

    Abstract: No abstract text available
    Text: 1/4 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: PACKAGE: FEATURES: HTSSOP-A44 BD5424EFS 1 2) 3) 4) 5) 6) 7) High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply


    Original     		PDF BD5424EFS HTSSOPA44

    AN-7524

    Abstract: two switch forward converter
    Text: How to Determine Thermal Resistance for a Power Semiconductor Heat Sink in an SMPS Application Note Title N98 bt ow terne erl sisce a wer minctor at k in MPS utho eyrds ter- August 2000 A practical method for determining the thermal resistance of a heat sink in a power supply is provided. The basic


    Original     		PDF AN-7524 AN-7524 two switch forward converter

    hdsc-14

    Abstract: HSR103 DRC-10500 API-30602 DRC-10520 SIM-36010 hdsc14
    Text: DIGITAL-TO-SYNCHRO/RESOLVER D/S, D/R CONVERTERS RESOLUTION ACCURACY OUTPUT DRIVE DRC-10520 16 Bit t o ± 1’ 2 VA DRC-11522 16 Bit ± r 2mA-rms DSC-544 14 Bit ±4‘ 4.5 VA 2.6 x 3.1 x 0.8" Module Powered from reference. Has built-in metal heat sink for greater heat


    OCR Scan     		PDF DRC-10520 DRC-10500. IEEE-488 API-36005 SIM-36010 API-36005 HSR-103/203 IAC-37001 hdsc-14 HSR103 DRC-10500 API-30602 hdsc14

    BD5421EFS

    Abstract: HTSSOP-A44 BD5421EFS-1 BD5421EFS-1-2 TSZ22111-04 TSZ22111-05
    Text: TYPE PRODUCTS PAGE BD5421EFS SEMICONDUCTOR IC STRUCTURE: Silicon monolithic integrated circuits P R O D U C T: Stereo C lass-D Power Amplifier For Speaker T YPE : BD5421EFS PACKAGE: H T S S O P -A 4 4 1 /4 FEATURES: 1 High efficiency and low heat generation eliminates external heat-sinks


    OCR Scan     		PDF BD5421EFS HTSSOP-A44 Pin19) Pin18, TSZ02201-BD5421EFS-1-2 TSZ22111-04 BD5421EFS HTSSOP-A44 BD5421EFS-1 BD5421EFS-1-2 TSZ22111-05