MCL MAR-6
Abstract: MC12079 54475 sm33000 MAR6 VCO MCl pos cable tv tuner pin SM2175 hobby electronic projects balun diode mixer
Text: Mark S. Henkel, WB9LYH 1196 Tower Road Rudolph, Wisconsin 54475 MICROWAVE SPECTRUM ANALYZER ON A BUDGET A practical approach to microwave signal analysis for the home experimenter est equipment commonly found in the amateur workshop usually isn’t suited for
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MBT250A.
TF200
PS-80
SX-70
TP-65
888-535-PACE
MCL MAR-6
MC12079
54475
sm33000
MAR6
VCO MCl pos
cable tv tuner pin
SM2175
hobby electronic projects
balun diode mixer
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Untitled
Abstract: No abstract text available
Text: Loctite Electronics Henkel-Loctite Corporation 15051 E. Don Julian Rd. Industry, Ca 91746 Phone 626.968.6511 Fax 626.336.0526 Shelf life and Storage of Multicore Brand Cored Solder Wire The Mulicore brand of cored solder wire is very stable. There is not an established shelf
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70-85F
20-30C)
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SAC387
Abstract: SAC387 solder Multicore 96SC SAC-387 QQ-S-571 MSDS J-STD-006 sac387 97SC Loctite 510 henkel solder J-STD-006 SAC305
Text: Technical Data Sheet 96SC and 97SC Alloy February 2005 Lead Free Solder Alloys for Electronics PRODUCT DESCRIPTION MULTICORE 96SC and 97SC alloys are designed to be lead free substitutes for tin/lead alloys in all electronics assembly soldering operations. Some advantages of MULTICORE®
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QQ-S-571,
J-STD-006
SAC387
SAC387 solder
Multicore 96SC
SAC-387
QQ-S-571 MSDS
J-STD-006 sac387
97SC
Loctite 510
henkel solder
J-STD-006 SAC305
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LOCTITE 3621
Abstract: No abstract text available
Text: Technical Data Sheet LOCTITE 3621 January-2014 LOCTITE 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical
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January-2014
M10/PK
LOCTITE 3621
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both
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MP200
December-2011
MP200
200mms-1
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SAC387 solder
Abstract: SAC387
Text: Technical Data Sheet C400 April-2011 PRODUCT DESCRIPTION C400 provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue
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April-2011
IPC/J-STD-004
SAC387 solder
SAC387
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IPC-SF-818
Abstract: SAC387 SAC305 C400TM SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC
Text: Technical Data Sheet C400 October-2009 PRODUCT DESCRIPTION C400™ provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue
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C400TM
October-2009
C400TM
IPC/J-STD-004
IPC-SF-818
SAC387
SAC305
SAC387 solder
J-STD-004 MSDS
EN29454-1
TR-NWT-000078
Multicore SOLDER
Multicore 96SC
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WIPED 52
Abstract: BS5625 Loctite multicore solder wire BYX100 multicore solder wire DTD599A Loctite multicore
Text: Product Data Sheet TTC–LF May 2007 TIP TINNER/CLEANER PRODUCT DESCRIPTION Multicore TTC-LF is a speedy and effective product for cleaning and re-tinning de-wetted soldering irons that cannot be re-tinned by sponges, pads or rosin-cored solder wire. Multicore TTC-LF is a small block of
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IPC-SF-818
Abstract: SAC387 SAC387 solder
Text: Technical Data Sheet C511 October-2009 PRODUCT DESCRIPTION C511™ provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire High • No clean • Clear residue
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October-2009
IPC/J-STD-004
IPC-SF-818
SAC387
SAC387 solder
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loctite 3616
Abstract: No abstract text available
Text: Technical Data Sheet LOCTITE 3616 LOCTITE 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics,
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M10/PK
650LMS
loctite 3616
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GR-78-CORE
Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased
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MP200
ANSI/J-STD-004
GR-78-CORE
J-STD-005
multicore solder paste
GR78-CORE
GR-78-CORE PCB
solder powder
J-STD-004 paste
J-STD-004 MSDS
bellcore GR-78
MCF800
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GR-78-CORE
Abstract: No abstract text available
Text: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and
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WS200â
June-2009
GR-78-CORE
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SAC387
Abstract: BS219 SAC387 solder multicore solder wire Multicore 96SC 97Cu3 LMP62 solder wire HMP Loctite 414 MSDS Multicore savbit
Text: Technical Data Sheet Properties of Alloys of Multicore Solder Wires August 2007 # This data sheet lists the most popular solders supplied as flux-cored wire and can be used in addition to the separate Technical Data Sheets for Multicore cored solder wire fluxes.
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multicore solder wire
Abstract: henkel solder Loctite multicore multicore solder J-STD-006 Water soluble flux Loctite multicore solder wire
Text: Technical Data Sheet Multicore Hydro-X September 2007 HIGH ACTIVITY WATER SOLUBLE CORED SOLDER WIRE Properties of Multicore Hydro-X solid flux cored solder wires: x Rapid soldering of most difficult to solder parts x Fast wetting x Water washable, no need for added neutralisers
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J-STD-006
multicore solder wire
henkel solder
Loctite multicore
multicore solder
Water soluble flux
Loctite multicore solder wire
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet Product 3888 July 2003 PRODUCT DESCRIPTION LOCTITE 3888 Silver Filled Conductive Adhesive provides the following product characteristics: Technology Epoxy Chemical Type Epoxy Appearance Resin Silver pasteLMS Appearance (Hardener) Clear to amber liquidLMS
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet 3508 October-2009 PRODUCT DESCRIPTION 3508™ provides the following product characteristics: Technology Epoxy Appearance Black Components One component Product Benefits • Reworkable • Pb-free applications • Eliminates post-reflow dispenses
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October-2009
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MFR301 Liquid Flux January-2008 PRODUCT DESCRIPTION MFR301™ Liquid Flux provides the following characteristics: Technology Liquid flux Appearance Pale rosin yellow Odor Alcoholic Solids Content 5.5 - 6.5% Cure Not applicable Application
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MFR301â
January-2008
GR-78-CORE
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet 3536 October-2009 PRODUCT DESCRIPTION 3536™ provides the following product characteristics: Technology Epoxy Appearance Black Components One component Product Benefits • Reworkable • Cures rapidly at low temperatures • Minimizes thermal stress
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October-2009
CP52/20
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QQ-S-571 MSDS
Abstract: No abstract text available
Text: Technical Data Sheet TRA-DUCT 2902 June-2010 PRODUCT DESCRIPTION TRA-DUCT 2902 provides the following product characteristics: Technology Epoxy Appearance Silver Filler Type Silver Cure Room Temperature or Heat Cure Components Two component - requires mixing
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June-2010
QQ-S-571 MSDS
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MIL-P-28809A
Abstract: No abstract text available
Text: Laboratory Data Sheet De-soldering Wick March 2003 No-Clean Desoldering Wick PRODUCT DESCRIPTION LOCTITE Product Multicore De-soldering Wick is designed for static-free desoldering and repair of PC boards without the need for subsequent cleaning. We use a special halide-free vacuumised no-clean, flux-coated
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MIL-P-28809A
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QQ-S-571E
Abstract: flux F-SW32 DTD599A J-STD-006A QQS-571-E MCF800 QQ-S571E QQ-S-571 MSDS SOLDER WIRE F-SW32
Text: Laboratory Data Sheet Product 370 WRAP March 2003 Cored Solder Wire RA Type PRODUCT DESCRIPTION Multicore 370 (formerly WRAP) solid flux for cored solder wire has been specially formulated to conform to the QQ-S571E Type RA specification. Multicore™ 370 solid flux is our
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QQ-S571E
QQ-S-571,
J-STD-006A,
QQ-S-571E
flux F-SW32
DTD599A
J-STD-006A
QQS-571-E
MCF800
QQ-S-571 MSDS
SOLDER WIRE
F-SW32
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Untitled
Abstract: No abstract text available
Text: Engineering Manual HF212 Solder Paste Suitable for use with: Standard SAC Alloys High Reliability 90iSC Alloy Low Ag Alloys Contents 1. Product Description 2. Features & Benefits 3. Print Process Window 4. Print Abandon Time Testing 5. Slump Testing 6. Tack-Life Force
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HF212
90iSC
HF212:
IPC-TM-650
34/EN14582
ANSI/J-STD-004
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SEIWA
Abstract: nihon zeon P3-375 SEIWA E SANYO KOGYO NIPPON CAPACITORS daikin electronic circuit daikin Henkel* p3 cold cleaner 750H
Text: Application Guide Aluminum SMT Capacitors Reflow Soldering Temperature Profile: Peak Temp. see chart 5 seconds maximum Case Code Peak Temp (°C) A, B, C, D E, F, G, H J, K, L, P R, S, U, X 240 230 200 °C 160 °C Maximum Time @ 200 °C (see chart) 120 seconds
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6p3s
Abstract: Loctite 7649 DC42V HR30 HR30-SC-211 HT-102
Text: NEW Miniature Waterproof Plastic Connectors HR30 Series Mated dimensions 32.3 Ø12.6 3 and 6 pos. 42.1 Ø15.5 10 and 12 pos. •Features 1. Miniature and compact design The HR30 allows for a maximum outside diameter of 12.6mm in the 3 and 6 positions, and 15.5mm for the 10
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