HF50E060ACE Search Results

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Text: PD - 94720 HF50E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • Benchmark Efficiency for UPS and Welding Applications • Rugged Transient Performance • Low EMI • Excellent Current Sharing in Parallel Operation