TLP3403SRHA
Toshiba Electronic Devices & Storage Corporation
Photorelay (MOSFET output, 1-form-a), 20 V/1.5 A, 500 Vrms, S-VSON4T
69173-403HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
59202-G34-03-088
Amphenol Communications Solutions
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions.
77313-403-72LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
77315-134-03LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54mm (0.100in) Pitch, Right Angle
