marking LLA
Abstract: No abstract text available
Text: 1 Filters For Mobile Com m unication ICR CERAMIC CHIP DUPLEXERS For cordless phone HHM series HHM0140 TYPE FEATURES • HHM series are the m u ltila ye r sub stra te type chip du plexers • Due to EMI shield effects of th is low im pedance G ND layer, it
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HHM0140
AVE-002
marking LLA
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tdk ceramic filters 10.7
Abstract: CST063 NLU160805 MLR1 tdk Isolators INVERTER TRANSFORMERS MHD1010DDC MCZ2525 NTCCM1608 SMPT0706
Text: Packaging Styles And Quantities Product Multilayer Ceramic Chip Capacitors Product’s Type or Series thickness Part No. (mm) Quantities (pieces) Reel dimensions (mm) Taping (/reel) _ |k HUIK $A (j>B <t>C W C1005 10000, 50000 — 178±2 60±2 13±0.5 382 max.
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C1005
C1608
C2012
C3216
C3225
tdk ceramic filters 10.7
CST063
NLU160805
MLR1
tdk Isolators
INVERTER TRANSFORMERS
MHD1010DDC
MCZ2525
NTCCM1608
SMPT0706
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Untitled
Abstract: No abstract text available
Text: Duplexers For Cordless Telephone HHM Series These are duplexers for cordless telephones manufactured by mounting an excellent highfrequency characteristics ferrite core on a ceramic board provided with multiple capacitors. The use of a filter design and an automatic trimming technologies requires neither externally-installed parts
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100mg
HHM0130
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MEA8020
Abstract: ACB1608 EPC17 BOBBIN ZCYS51R5-M3PA TCXO 9.9 MHZ CST063 QVC10 NLU160805 tdk Isolators ACL2520
Text: SM Components at a Glance Product name Type or Series Part No. Multilayer Ceramic Chip Capacitors C1005 [EIA CC0402] W T 1 0.5 0.55 max. Class I 0.5 to 330pF Class II 220 to 100000pF 1.6 0.8 0.9 max. Class I 0.5 to 1000pF Class II 220pF to 1jiF 2 1.25 1.45 max.
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C1005
CC0402]
C1608
CC0603]
C2012
CC0805]
C3216
CC1206]
C3225
CC1210]
MEA8020
ACB1608
EPC17 BOBBIN
ZCYS51R5-M3PA
TCXO 9.9 MHZ
CST063
QVC10
NLU160805
tdk Isolators
ACL2520
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Untitled
Abstract: No abstract text available
Text: Duplexers For Cordless Phone HHM Series FEATURES APPLICATIONS • Surface mountable type duplexers has LCs on multilayer substrate. • A GND electrode layer is incorporated on the mounting surface side. Accordingly, combination with the GND pattern of the mother board provides a high attenuation
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HHM0120
HHM0140
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Untitled
Abstract: No abstract text available
Text: Microwave Devices DUPLEXERS FOR CORDLESS PHONE, HHM SERIES FEATURES RATINGS • The SMD-type duplexer has built-in LC on multilayer substrate. • Since the GND electrode of HHM series duplexer is on the mounting side, the device is not affected by PCB pattern.
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HHM0120
HHM0120
HHM0140
HHM0140
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