sumitomo
Abstract: en4065 SUMITOMO eme 5274A 50C24 hitachi trace code hitachi assembly date code Sumitomo 1000 SN74FB1650 SN74FB1651
Text: TEXAS INSTRUMENTS Final Notification of Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site February 5, 1997 Abstract Texas Instruments Standard Linear and Logic SLL is adding Hiji as a qualified assembly site for
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TMS57002DPHA
Abstract: TMS57002 identification trace code texas 50C40 F312993PAG TMS57002DPH F312185PJM tms57002d hitachi assembly date code F312993
Text: Texas Instruments Incorporated Transfer the Assembly Production for the TMS57002DPHA Device from HIJI to TIPI and the Transfer the Wafer Fab Source from MIHO5 to HFAB SAMPLE REQUEST / FINAL NOTIFICATION LETTER PCN# 20020411001 May 28, 2002 Dear Customer: The following notes apply to this correspondence:
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TMS57002DPHA
TMS57002
identification trace code texas
50C40
F312993PAG
TMS57002DPH
F312185PJM
tms57002d
hitachi assembly date code
F312993
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84-3MV
Abstract: twl3025 PTWL3025BZGM TWL3025BZGM TWL3025BZGMR identification trace code texas A07s texas instruments lot trace code t3025bggm twl3025bzqwr
Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20050304000 New Wafer Fab for IOTA A07s Final Change Notification Dear Customer: This is a final announcement of change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages.
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T3025BGGM
T3025BGQW
84-3MV
twl3025
PTWL3025BZGM
TWL3025BZGM
TWL3025BZGMR
identification trace code texas
A07s
texas instruments lot trace code
t3025bggm
twl3025bzqwr
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hitachi assembly date code
Abstract: Nippon capacitors
Text: HB56SW3272ESNK-6A/7A 256MB Unbuffered EDO DRAM DIMM 32M-word x 72-bit, 4k Refresh, 2 Bank Module 36 pieces of 16M x 4 components HITACHI ADE-203-840 (Z) Preliminary Rev. 0.0 Oct. 29, 1997 Description The HB56SW3272ESNK is a 32M X 72 dynamic RAM module, mounted 36 pieces of 64-Mbit DRAM
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HB56SW3272ESNK-6A/7A
256MB
32M-word
72-bit,
ADE-203-840
HB56SW3272ESNK
64-Mbit
HM5165405)
hitachi assembly date code
Nippon capacitors
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Ablebond 8390
Abstract: ESDA6V2HPRL CLP190ERL LM358DT ESDA6V2HP CLP190 LM324DT M74HC14RM13TR LM2904DT 16 g700
Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN DSG/03/380 DSG-DISCRETES & STANDARD IC s- LEADFREE PLATING FOR SOP, TSSOP, SSOP, QSOP PACKAGES. 2003/11/28 PCN DSG/03/380 Product Family /Commercial Product All products in SOP, TSSOP, SSOP, QSOP PACKAGES. Type Of Change
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DSG/03/380
24-Feb-2004
28-Nov-2003
Ablebond 8390
ESDA6V2HPRL
CLP190ERL
LM358DT
ESDA6V2HP
CLP190
LM324DT
M74HC14RM13TR
LM2904DT
16 g700
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testo rs232 cable
Abstract: hitachi cmon F000000 us7032evb1 0xF000000-F001FFF Hitachi DSA00502
Text: Hitachi Europe Ltd. ISSUE : TUT/005/1.0 TUTORIAL DATE : 15/11/95 SH1 EVALUATION BOARD TUTORIAL ABSTRACT The following tutorial is designed for someone using the gnu software development tools to generate code for the SH1-evaluation board from Hitachi Europe. It contains code examples
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TUT/005/1
testo rs232 cable
hitachi cmon
F000000
us7032evb1
0xF000000-F001FFF
Hitachi DSA00502
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Hitachi DIP Marking Code
Abstract: hitachi PLC cg-40 date CODE hitachi plcc hitachi lot marking hitachi assembly date code Hitachi Date Code
Text: INTRO DUCTIO N OF PACKAGES H itachi microcomputer devices include various types of package which meet a lot o f requirements such as ever smaller, thinner and more versatile electric appliances. When selecting a package suitable for the customers' use. please refer to the
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Untitled
Abstract: No abstract text available
Text: HB56SW3272ESNK-6A/7A 256MB Unbuffered EDO DRAM DIMM 32M-word x 72-bit, 4k Refresh, 2 Bank Module 36 pieces of 16M x 4 components HITACHI ADE-203-840 (Z) Preliminary Rev. 0.0 Oct. 29, 1997 Description The HB56SW3272ESNK is a 32M x 72 dynamic RAM module, mounted 36 pieces of 64-Mbit DRAM
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HB56SW3272ESNK-6A/7A
256MB
32M-word
72-bit,
ADE-203-840
HB56SW3272ESNK
64-Mbit
HM5165405)
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Untitled
Abstract: No abstract text available
Text: Through Hole Lamp Product Data Sheet LTL17KCBH5D-0G1A Spec No.: DS20-2011-0052 Effective Date: 05/22/2012 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
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LTL17KCBH5D-0G1A
DS20-2011-0052
BNS-OD-FC001/A4
EIA-471
BNS-OD-C131/A4
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EN4900GC
Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.
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PCN1-110704
EFM32G890F128
J-STD-020D,
JESD22-A113
JESD22-A104
C/125
JESD22-A103
JESD22-A102
JESD22-A110
EN4900GC
NC7720
CEL9220HF10
EME-G760L
EME-G760
HL832nxa
Yizbond
Hitachi EN4900GC
CEL9220
DS-7409HG
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20LMB
Abstract: No abstract text available
Text: SCD#QM5259 Upscreening/Manufacturing Specification FT7C109-20LMB Title Page . List of Effective Pages . Change List .
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QM5259
FT7C109-20LMB
20LMB
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ISO-780
Abstract: D-4196 hardwood based plywood B-131-F B727 HITACHI EPP foam dc9300 top markings on hitachi XPEDX pre-stretch wrap
Text: Dec 31, 2003 Hitachi GST Packaging Requirements Manual, Document Number: 219261-11 Page 1 of 54 PACKAGING and HANDLING Supplier and Interplant Requirements This booklet is the property of Hitachi GST. Its use is only authorized for responding to a request
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Untitled
Abstract: No abstract text available
Text: Through Hole Lamp Product Data Sheet LTL17KCGP4J-012A Spec No.: DS20-2010-0124 Effective Date: 05/22/2012 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
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LTL17KCGP4J-012A
DS20-2010-0124
BNS-OD-FC001/A4
MIL-STD-750D
MIL-STD-883D
MIL-STD-202F
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Untitled
Abstract: No abstract text available
Text: HB56SW464DBJ Series 4,194,304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-688A Z Rev. 1.0 May. 30, 1997 Description The HB56SW464DBJ is a 4M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17805) sealed in TCP package and 1 piece
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HB56SW464DBJ
304-word
64-bit
ADE-203-688A
16-Mbit
HM51W17805)
24C02)
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LTL-1CHJGTHT
Abstract: H08A H08B circuit diagram for alcohol sensor with 10mm LED 15000 mcd
Text: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * High luminous intensity output. * Low power consumption. * High efficiency. * Versatile mounting on P.C. Board or panel. * I.C. Compatible/low current requirement. * 3.1 mm diameter package.
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BNS-OD-C13
10mins
MIL-STD-202F
MIL-STD-750D
MIL-STD-883D
1000HRS
-24HRS,
72HRS)
LTL-1CHJGTHT
H08A
H08B
circuit diagram for alcohol sensor with
10mm LED 15000 mcd
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6AL7
Abstract: Nippon capacitors
Text: HB56HW465DB Series 4196304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-666A Z Rev. 1.0 May. 20, 1997 Description The HB56HW465DB Series is a 4 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 4 pieces of 64-Mbit DRAM (HM5165165ATT/ALTT) sealed in TSOP package and 1
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HB56HW465DB
4196304-word
64-bit
ADE-203-666A
64-Mbit
HM5165165ATT/ALTT)
24C02)
6AL7
Nippon capacitors
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Untitled
Abstract: No abstract text available
Text: HB56UW865DB-A Series 8388608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-828A Z Rev. 1.0 Sep. 17, 1997 Description The HB56UW865DB-A Series is a 8 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. 0 . DIMM), mounted 8 pieces of 64-Mbit DRAM (HM5165805A/AL) sealed in TSOP package and 1
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HB56UW865DB-A
8388608-word
64-bit
ADE-203-828A
64-Mbit
HM5165805A/AL)
24C02)
HB56UW865DB-A
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do 24C02
Abstract: Nippon capacitors
Text: HB56SW464DBJ Series 4,194,304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-688A Z Rev. 1.0 May. 30, 1997 Description The HB56SW464DBJ is a 4M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17805) sealed in TCP package and 1 piece
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HB56SW464DBJ
304-word
64-bit
ADE-203-688A
16-Mbit
HM51W17805)
24C02)
do 24C02
Nippon capacitors
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Untitled
Abstract: No abstract text available
Text: HB56SW864DBK Series 8,338,608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-777A Z Rev. 1.0 Jun. 18, 1997 Description The HB56SW864DBK is a 8M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.0 .DIMM), mounted 32 pieces of 16-Mbit DRAM (HM51W16405) sealed in TCP package and 1 piece
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HB56SW864DBK
608-word
64-bit
ADE-203-777A
16-Mbit
HM51W16405)
24C02)
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6AU7
Abstract: hitachi assembly date code Nippon capacitors
Text: HB56HW465DB Series * 4196304-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-666A Z Rev. 1.0 May. 20, 1997 Description The HB56HW465DB Series is a 4 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 4 pieces of 64-Mbit DRAM (HM5165165ATT/ALTT) sealed in TSOP package and 1
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HB56HW465DB
4196304-word
64-bit
ADE-203-666A
64-Mbit
HM5165165ATT/ALTT)
24C02)
6AU7
hitachi assembly date code
Nippon capacitors
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Untitled
Abstract: No abstract text available
Text: HB56UW1672EJN-5/6 128MB Unbuffered EDO DRAM DIMM 16-Mword X 72-bit, 8k Refresh, 1 Bank Module 18 pcs of 16M X 4 components HITACHI ADE-203-902A (Z) Rev. 1.0 Mar. 25, 1998 Description The HB56UW1672EJN belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been
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HB56UW1672EJN-5/6
128MB
16-Mword
72-bit,
ADE-203-902A
HB56UW1672EJN
64-Mbit
HM5164405)
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Untitled
Abstract: No abstract text available
Text: HB56UW264DB Series 2,097,152-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-735B Z Rev.2.0 Jun. 12, 1997 Description The HB56UW264DB is a 2M x 64 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 8 pieces of 16-Mbit DRAM (HM51W17805) sealed in TSOP package and 1 pieces
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HB56UW264DB
152-word
64-bit
ADE-203-735B
16-Mbit
HM51W17805)
24C02)
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6AL7
Abstract: Nippon capacitors
Text: HB56UW865DB-A Series 8388608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-828A Z Rev. 1.0 Sep. 17, 1997 Description The HB56UW865DB-A Series is a 8 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 8 pieces of 64-Mbit DRAM (HM5165805A/AL) sealed in TSOP package and 1
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HB56UW865DB-A
8388608-word
64-bit
ADE-203-828A
64-Mbit
HM5165805A/AL)
24C02)
6AL7
Nippon capacitors
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c0-toc
Abstract: ADE-203-665A Nippon capacitors
Text: HB56UW865DB Series 8388608-word x 64-bit High Density Dynamic RAM Module HITACHI ADE-203-665A Z Rev. 1.0 May. 20,1997 Description The HB56UW865DB Series is a 8 M x 64 Dynamic RAM Small Outline Dual In-line Memory Module (S. O. DIMM), mounted 8 pieces of 64-Mbit DRAM
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HB56UW865DB
8388608-word
64-bit
ADE-203-665A
64-Mbit
HM5165805ATT/ALTT)
24C02)
c0-toc
ADE-203-665A
Nippon capacitors
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