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    HL832 PCB MATERIAL Search Results

    HL832 PCB MATERIAL Result Highlights (4)

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    ZLEDPCB2 Renesas Electronics Corporation LED Test PCBs Visit Renesas Electronics Corporation
    ZLEDPCB10 Renesas Electronics Corporation LED Test PCB - 12x 0.5W Visit Renesas Electronics Corporation
    ZLEDPCB1B Renesas Electronics Corporation LED Test PCB - 3W Visit Renesas Electronics Corporation
    ZLEDPCB8 Renesas Electronics Corporation LED Test PCB - 5W Visit Renesas Electronics Corporation

    HL832 PCB MATERIAL Datasheets Context Search

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    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original
    HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG PDF

    AU-85B

    Abstract: Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor
    Text: Specification for Approval Samsung Electro-Mechanics Co.,LTD PDF created with pdfFactory Pro trial version www.pdffactory.com Specification for Approval Revision History Rev. Date Description of Change Rev. Page 1 2005.07.30 The Primary Specification 1.0 Rev.


    Original
    AU-85B MOMBD420G1A AU-85B Taiyo AUS-308 bi8921t prepreg GHPL-830 Bi8921 GHPL-830 GHPL MOMBD420G1A GHPL prepreg Samsung CMOS Image sensor PDF