HLG05523 Search Results

sod323 wave soldering

Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820
Text: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed