"power scheduling"
Abstract: HSDPA TM500 logger l1 l2 HSDPA packet scheduling 1/BMC 2709
Text: TM500 Test Mobile 3GPP Release 6 HSUPA Option The Layer 1 / Layer 2 and Higher Layer options extend the capabilities of the TM500 test mobile to support the latest 3GPP Release 6 High Speed Uplink Packet Access HSUPA technology • Full Layer 1 / Layer 2 implementation of
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TM500
76Mbps
"power scheduling"
HSDPA
logger l1 l2
HSDPA packet scheduling
1/BMC 2709
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RTR6275
Abstract: Qualcomm RTR6275 qxdm MSM7200 Qualcomm chipset MSM7200 RFR6500 RFR6525 TM7200 qdsp5000 Power Management IC pm6650-2
Text: Q U A L C O M M Q C Te s t TM7200 Test Phone WCDMA UMTS Data applications, diagnostics and 2 Mbps High-Speed Uplink Packet Access (HSUPA), category 5, with 7.2 Mbps High-Speed Downlink Packet Access (HSDPA), category 8, simultaneously supported through
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3g hsdpa usb modem 7.2
Abstract: datacard GTM501 gsm Simultaneous voice and data module hsdpa receiver in1800 HSPA Module gsm sim 900 3G HSDPA circuits UMTS gsm
Text: GTM501 World’s Smallest HSPA module • Easy to integrate WAN module • 25 mm High speed: up to 7.2 Mbps downlink and 5.76 Mbps uplink • 2.5 mm Most Advanced Receiver Technologies: Equalization and Rx Diversity • TOP VIEW Multimode HSUPA, HSDPA, UMTS, EDGE, GPRS and GSM
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GTM501
GTM501
3g hsdpa usb modem 7.2
datacard
gsm Simultaneous voice and data module
hsdpa receiver
in1800
HSPA Module
gsm sim 900
3G HSDPA circuits
UMTS gsm
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BCM2155
Abstract: BCM4750 GPS chip BCM4750 usb 3g modem circuit BCM59055 Broadcom bcm4750 BCM21551 3g hsdpa signal antenna Diagram Broadcom BCM21331 BCM4325
Text: BCM21551 Brief Single-Chip 65-nm HSUPA + RF + BT + FM + Multimedia SoC SUMMARY OF BENEFITS FEATURES • • • • General Characteristics • Single-chip, single-die, HSPA System On a Chip SoC with integrated RF, Bluetooth®, FM, multimedia acceleration, high-speed USB, full
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BCM21551
65-nm
621-pin
21551-PB02-R
BCM2155
BCM4750
GPS chip BCM4750
usb 3g modem circuit
BCM59055
Broadcom bcm4750
BCM21551
3g hsdpa signal antenna Diagram
Broadcom BCM21331
BCM4325
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BCM2155
Abstract: usb 3g modem circuit 3g hsdpa signal antenna Diagram BCM59055 BCM4750 BCM21551 3g modem circuit mipi csi receiver h.264 encode mipi Transceiver Broadcom 3G RF
Text: BCM21551 Brief Single-Chip 65-nm HSUPA + RF + BT + FM + Multimedia SoC SUMMARY OF BENEFITS FEATURES • • • • General Characteristics • Single-chip, single-die, HSPA System On a Chip SoC with integrated RF, Bluetooth®, FM, multimedia acceleration, high-speed USB, full
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BCM21551
65-nm
468-MHz
ARM11TM
21551-PB03-R
BCM2155
usb 3g modem circuit
3g hsdpa signal antenna Diagram
BCM59055
BCM4750
BCM21551
3g modem circuit
mipi csi receiver
h.264 encode mipi
Transceiver Broadcom 3G RF
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3g call flow with message
Abstract: 3g call flow EN61010-1 EN61326-1 3g data call flow
Text: Protocol Test WCDMA ACE 3G Protocol Analysis Test System • Powerful network emulator for integration, regression and pre-conformance testing of WCDMA terminals • Full protocol decode and debugging tools • 3GPP Release 99, Rel-5 HSDPA and Rel-6 HSUPA capable
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PXA1801
Abstract: No abstract text available
Text: Marvell PXA1801 LTE World Modem for Global Cellular Designs PRODUCT OVERVIEW The Marvell PXA1801 LTE world modem combines Marvell’s leading communications and silicon expertise to enable global smartphone and tablet design. The Marvell PXA1801 enables high-performance, low-power smartphones
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PXA1801
PXA1801
PXA1801-001
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Untitled
Abstract: No abstract text available
Text: Protocol Test WCDMA ACE 3G Protocol Analysis Test System • Powerful network emulator for integration, regression and pre-conformance testing of WCDMA terminals • Full protocol decode and debugging tools • 3GPP Release 99, Rel-5 HSDPA and Rel-6 HSUPA capable
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test441
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TM500
Abstract: 3G HSDPA HSDPA 3G HSDPA circuits
Text: For more information, contact: Debra Seifert Debra Seifert Communications LLC 503 626-7539 debra@debraseifert.com James E. De Broeck Aeroflex Incorporated (316) 522-4981 jim.debroeck@aeroflex.com FOR PRINT AND ONLINE RELEASE: July 29, 2010 Aeroflex Launches 3GPP WCDMA Release 9, 84 Mbps Support for the
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TM500
2010--Aeroflex
TM500
3G HSDPA
HSDPA
3G HSDPA circuits
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3g router
Abstract: GCF-CC 3G HSDPA circuits CONNECTOR SMa barrel GSM router GSM 3G HSDPA NAPRD03 RS232 GPRS GSM Module protocol conversion module Wireless Router
Text: Digi Connect WAN Family Cellular Gateways/Routers/VPN Devices Small, cost-optimized cellular routers utilize global cellular networks for secure connectivity to remote sites and devices. Overview Digi Connect WAN cellular routers provide secure highspeed wireless connectivity to remote sites and devices. These
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D3/1209
3g router
GCF-CC
3G HSDPA circuits
CONNECTOR SMa barrel
GSM router
GSM 3G HSDPA
NAPRD03
RS232 GPRS GSM Module
protocol conversion module Wireless Router
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3g call flow
Abstract: 3g data call flow 3G HSDPA cell capacity planning EN61010-1 EN61326-1 3g call flow with message
Text: Protocol Test WCDMA ACE 3G Protocol Analysis Test System • Powerful network emulator for integration, regression and pre-conformance testing of WCDMA terminals • Full protocol decode and debugging tools • 3GPP Release 99, Rel-5 HSDPA and Rel-6 HSUPA capable
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PC8229-333
Abstract: mindspeed femtocell ARM11 datasheet mindspeed arm PC302
Text: PC333 Features Description • The Mindspeed PC333 is a single chip 3GPP Local Area Basestation Femtocell baseband and host processor SoC solution. It is part of Mindspeed’s complete baseband platform family of chips that drives femtocell cost models from residential through to
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PC333
21Mbps
PC333-BRF-0012-A
PC8229-333
mindspeed femtocell
ARM11 datasheet
mindspeed arm
PC302
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mindspeed femtocell
Abstract: ARM1176EJ pc3x PICOCHIP PC5300 ARM11 datasheet
Text: PC323 Features Description • The Mindspeed PC323 is a single chip 3GPP Enterprise Femtocell baseband and host processor SoC solution. It is part of Picochip’s complete baseband platform family of chips that drives femtocell cost models from residential through to enterprise, metro and picocells.
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PC323
ARM11
PC323-BRF-0012-A
mindspeed femtocell
ARM1176EJ
pc3x
PICOCHIP
PC5300
ARM11 datasheet
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PICOCHIP
Abstract: Rake search accelerator IEEE1588 phy DesignWare SPI PC312
Text: PC312 Features • Description Implements a complete 3GPP Release 6 WCDMA Femto Access Point FAP SoC supporting 8 user - 8 users - Up to 14Mbps HSDPA - Up to 5.7Mbps HSUPA Programmable architecture allows reconfiguration to network monitoring
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PC312
14Mbps
ARM11
ARM1176JZ-S
400MHz
PC312-BRF-0012-A
PICOCHIP
Rake search accelerator
IEEE1588 phy
DesignWare SPI
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Untitled
Abstract: No abstract text available
Text: Marvell PXA1801U WCDMA/EGPRS Cellular Modem PRODUCT OVERVIEW The Marvell PXA1801U cellular modem combines Marvell’s leading communications and silicon expertise to enable the design of global cellular devices. The Marvell PXA1801U enables high-performance, low-power cellular devices that can be used and
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PXA1801
PXA1801L
PXA1801U-01
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MC8790
Abstract: MC8795V mC5728V applications of Mobile Train Radio Communication MC8700 MC8790V C5728 Mobile Train Radio Communication audio echo ic dtmf wireless
Text: Sierra Wireless AirPrime Intelligent Embedded Modules MC Series Air Interface Innovation Sierra Wireless AirPrime™ MC Series embedded modules deliver reliable, high-quality mobile broadband connectivity with a variety of advanced air interfaces. The AirPrime MC Series can turn any mobile computing or mobile
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MC5728V
MC5728V
MC8790
MC8795V
applications of Mobile Train Radio Communication
MC8700
MC8790V
C5728
Mobile Train Radio Communication
audio echo ic
dtmf wireless
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Untitled
Abstract: No abstract text available
Text: Agilent N8993A GS-8800 Series 8960 Wireless Communication Design Verification (DV) Bench-top System Data Sheet N8993A A platform for • GSM, GPRS, and EGPRS (Bands GSM 850, GSM 900, DCS 1800, and PCS 1900) • 3GPP TS51.010-01. Sections 12, 13, 14, 21, and 22
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N8993A
GS-8800
N8993A
cdma2000Â
S0011
S0033
5990-5806EN
cdma2000
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MC8790
Abstract: MC8795V mC5728V mc8705 MC8700 MC8704 applications of Mobile Train Radio Communication MC8801 Gpsone Mobile Train Radio Communication
Text: Sierra Wireless AirPrime Intelligent Embedded Modules MC Series Air Interface Innovation Sierra Wireless AirPrime™ MC Series embedded modules deliver reliable, high-quality mobile broadband connectivity with a variety of advanced air interfaces. The AirPrime MC Series can turn any mobile computing or mobile
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MC5728V
MC5728V
mc8704)
MC8790
MC8795V
mc8705
MC8700
MC8704
applications of Mobile Train Radio Communication
MC8801
Gpsone
Mobile Train Radio Communication
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RTR6285A
Abstract: Qualcomm MSM7200
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM7200 TM Chipset Solution M U LT I M E D I A VA L U E Wireless now has the speed and power to converge seamlessly with other consumer and business electronics The QUALCOMM Convergence Platform makes it possible to incorporate the fastest, most in-demand consumer-electronic
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Qualcomm chipset MSM7200
Abstract: MSM7200 RTR6285 Qualcomm MSM7200 RTR6275 RTR6285TM MSM7200 Chipset Solution RFR6525 QDSP5000 qualcomm msm72
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM7200 TM Chipset Solution M U LT I M E D I A VA L U E Wireless now has the speed and power to converge seamlessly with other consumer and business electronics The QUALCOMM Convergence Platform makes it possible to incorporate the fastest, most in-demand consumer-electronic
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PM7540
Abstract: Qualcomm PM7540 Power Management IC qualcomm pm7540 qualcomm PM*7540 PM7540 Power Management IC qualcomm chipsets pm7540 Qualcomm MSM7200A Qualcomm RTR6285 PM7540TM RTR6285
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM7200A TM Chipset Solution M U LT I M E D I A VA L U E Wireless now has the speed and power to converge seamlessly with other consumer and business electronics The QUALCOMM Convergence Platform makes it possible to incorporate the fastest, most in-demand consumer-electronic
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Qualcomm qsc6055
Abstract: QSC6055 Q26 extreme QSC6055 chipset Q2687 Q2686 XM0110 Q2686 COMMANDS qualcomm gpsOne qualcomm aT commands
Text: Sierra Wireless AirPrime Wireless Embedded Modules Q Series A Single Form Factor for Multiple Technologies Conceived for rapid mounting in electronic machine-to-machine equipment, the Sierra Wireless AirPrime Q Series of intelligent embedded modules allows
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msm7600
Abstract: qualcomm msm7600 qdsp5000 RFR6525 RTR6275 Qualcomm RTR6275 RFR6500 gsm based digital notice board with lcd display MSM7600TM ISDB-t modulator
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM7600 Chipset Solution M U LT I M E D I A VA L U E Wireless now has the speed and power to converge seamlessly with other consumer and business electronics The QUALCOMM Convergence Platform makes it possible to incorporate the fastest, most in-demand consumerelectronic features into new wireless devices. With dual processors on a single chipset, the Convergence Platform is a
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Untitled
Abstract: No abstract text available
Text: QUALCOMM CHIPSET SOLUTIONS CONVERGENCE E N H A N C E D M U LT I M E D I A MSM7200 TM Chipset Solution M U LT I M E D I A VA L U E Wireless now has the speed and power to converge seamlessly with other consumer and business electronics The QUALCOMM Convergence Platform makes it possible to incorporate the fastest, most in-demand consumer-electronic
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