Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN56
OT684-1
OT684-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1
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HVQFN56:
OT684-5
MO-220
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PDF
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MO-220
Abstract: sot684 HVQFN56
Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 28 L y y1 C v M C A B w M C
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HVQFN56:
OT684-3
MO-220
MO-220
sot684
HVQFN56
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PDF
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PVQN0056KA-A
Abstract: HDD42 P-HVQFN56-8x8-0
Text: JEITA Package Code P-HVQFN56-8x8-0.50 RENESAS Code PVQN0056KA-A Previous Code ⎯ MASS[Typ.] 0.2g NOTE b1,c1: DIMENSION BEFORE PLATING HD D 42 29 29 28 28 43 3.0 HE E e 43 42 0.0 0.3 1.0 Lp Reference Symbol 14 56 14 A1 A C1 C y S 3.0 1.0 3.0 Index mark S
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P-HVQFN56-8x8-0
PVQN0056KA-A
PVQN0056KA-A
HDD42
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PDF
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MO-220
Abstract: jedec package MO-220 SOT684-1 HVQFN-56 HVQFN56
Text: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN56: plastic, heatsink very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A A4 E detail X C e1 1/2 e e 15 y y1 C ∅v M C A B b ∅w M C
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HVQFN56:
OT684-1
MO-220
MO-220
jedec package MO-220
SOT684-1
HVQFN-56
HVQFN56
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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Original
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HVQFN56
OT684-2
OT684-2
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e Eh1 Eh e2 1/2 e
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Original
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HVQFN56:
OT684-4
MO-220
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1 42 terminal 1
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HVQFN56:
OT684-2
met75
MO-220
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PDF
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MO-220
Abstract: sot684 HVQFN56
Text: Package outline Philips Semiconductors HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b
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Original
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HVQFN56:
OT684-4
MO-220
MO-220
sot684
HVQFN56
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e b 15 L y y1 C v M C A B w M C 28 29 14 e e2 Eh 1/2 e 1 42 terminal 1
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HVQFN56:
OT684-1
pro75
MO-220
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PDF
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MO-220
Abstract: sot684
Text: PDF: 2003 Nov 24 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C
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HVQFN56:
OT684-5
MO-220
MO-220
sot684
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PDF
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Untitled
Abstract: No abstract text available
Text: SOT684-1 HVQFN56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 18 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal
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OT684-1
HVQFN56;
001aak603
OT684-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm D B SOT949-2 A A1 A A3 terminal 1 index area E detail X e1 C v w b L 15 28 C A B A y y1 C 29 14 e e2 Eh 1/2 e 1 terminal 1 index area
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HVQFN56:
OT949-2
MO-220
sot949-2
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PDF
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sot684
Abstract: sot684-10
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-10 B D D1 A terminal 1 index area E1 E A4 A c A1 detail X e1 e 1/2 e L 15 28 14 C C A B C v w b y y1 C 29 e e2 Eh 1/2 e 1 42
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HVQFN56:
OT684-10
OT684-10
sot684-10
sot684
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PDF
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|
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MO-220
Abstract: sot684
Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B
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HVQFN56:
OT684-2
MO-220
MO-220
sot684
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm B D SOT949-1 A terminal 1 index area E A A1 c detail X e1 1/2 e e 15 L ∅v ∅w b 28 14 M M C C A B C y1 C y 29 e e2 Eh 1/2 e 1 terminal 1
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Original
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HVQFN56:
OT949-1
metal75
MO-220
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PDF
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HVQFN56
Abstract: No abstract text available
Text: +9 4 1 SOT949-2 HVQFN56; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 November 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW
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OT949-2
HVQFN56;
OT949-2
HVQFN56
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A E A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e eg Eg 1 42
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HVQFN56:
OT684-3
MO-220
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm B D SOT684-6 A terminal 1 index area E A A1 c detail X C e1 e 1/2 e ∅v ∅w b 15 28 L M M C A B C y y1 C 29 14 e Eh Ek e2 1/2 e Ej
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HVQFN56:
OT684-6
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-11 terminal A1 index area E A A1 c detail X e1 e L 1/2 e 15 28 14 C C A B C v w b y1 C y 29 e e2 Eh 1/2 e 1 42 56 terminal A1
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HVQFN56:
OT684-11
MO-220
sot684-11
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PDF
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JESD204A
Abstract: WIDEBAND ULTRASOUND CMLAN
Text: NXP dual 12/14-bit ADC with serial interface ADC1x13 Dual-channel ADCs with JESD204A-compliant outputs for wireless and industrial Equipped with 3.125-Gbps serial output interfaces that comply with JEDEC JESD204A, these dual-channel ADCs support sample rates up to 125 MSPS, integrate a programmable gain buffer,
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12/14-bit
ADC1x13
JESD204A-compliant
125-Gbps
JESD204A,
14-bit
ADC1413Dxxx)
12-bit
ADC1213Dxxx)
JESD204A
WIDEBAND ULTRASOUND
CMLAN
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PDF
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ISP1582BSUM
Abstract: ISP1582BS-UM ISP1582BS ISP1582BSGA ISP1582 AN1004 st-ericsson AN10071
Text: ISP1582 Hi-Speed USB peripheral controller Rev. 09 — 29 September 2009 Product data sheet 1. General description The ISP1582 is a cost-optimized and feature-optimized Hi-Speed Universal Serial Bus USB peripheral controller. It fully complies with Ref. 1 “Universal Serial Bus Specification
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ISP1582
ISP1582
ISP1582BSUM
ISP1582BS-UM
ISP1582BS
ISP1582BSGA
AN1004
st-ericsson
AN10071
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PDF
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LPC2148 i2c
Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Text: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.
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OT363
SC-88)
LPC2148 i2c
BGB210S
lpc2148 interfacing 2.8" TFT LCD DISPLAY
BGB210
embedded c code to interface lpc2148 with sensor
BGW200
TDA8932T
tda8920bj
NXP PN531
TDA8947J equivalent
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PDF
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photo interrupter module
Abstract: wiring circuit stepper motor "Photo Interrupter" Application Note mosfet discrete totem pole CIRCUIT PCA9539 principle stepper motor unipolar stepper motor programming in c 7.5 stepper motor PCA9538 optical interrupter darlington
Text: AN10814 Driving stepper motors using NXP I2C-bus GPIO expanders Rev. 01 — 11 September 2009 Application note Document information Info Content Keywords stepper, stepper motor, GPIO, push-pull, quasi-bidirectional, MOSFET, optical interrupter, Fast-mode Plus, Fm+, I2C-bus
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AN10814
20090information
AN10814
photo interrupter module
wiring circuit stepper motor
"Photo Interrupter" Application Note
mosfet discrete totem pole CIRCUIT
PCA9539
principle stepper motor
unipolar stepper motor programming in c
7.5 stepper motor
PCA9538
optical interrupter darlington
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PDF
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