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    IC GOLD PLATED SERIES Search Results

    IC GOLD PLATED SERIES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    IC GOLD PLATED SERIES Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: IC-E CONNECTOR SYSTEM .100” 2.54mm SIP Socket (screw machine pin) CONTACT: INNER CLIP-BERYLLIUM COPPER OUTER SLEEVE-BRASS INSULATOR. PBT & 30% G.F. PLATING: OUTER SHIELD : TIN PLATED INNER CONTACT : GOLD OR NI PLATED CURRENT RATING : 1A WITHSTANDING VOLTAGE : 1000VAC(1 MIN)


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    1000VAC PDF

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    Abstract: No abstract text available
    Text: 2011 SERIES □upiin PIN HEADER 2.54mmX2.54mm 0.100"X0.100" M aterial: Housing: 30% Glass filled PBT UL94-V-0. Contacts: Brass Plating: Gold plated: 5 /J,' over 50/T nickel. Tin plated: 150^’ over 7 0 j l nickel. E le c t r ic a l C h a r a c t e r i s t ic s :


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    54mmX2 UL94-V-0. 5000M T0177S7 000000b PDF

    Untitled

    Abstract: No abstract text available
    Text: 2049 SERIES □ m \r\ P.C.B. SOCKET 2.54mm 0.100" M ate ria l: Housing: 30% Glass filled PBT U L94V—0. Contacts: Phosphor Bronze. Plating: Gold plated: 5 / ! ' over 5 0 /x nickel. Tin plated: 150/i' over 70/i' nickel. E le c t r ic a l C h a r a c t e r is t ic s :


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    150/i' 5000M 100mA 54mmX7 T017757 PDF

    trk ps

    Abstract: Board to Board 2row 2.54mm
    Text: P.C. BOARD SOCKET DOUBLE ROW 2.54 * 2.54 nun MATERIAL •Insulator : PBT 01 PPS (UL94V-0) •Contici : Copper Alloy •Contact Plated : G = All Gold Plated T = All Tin Plated S P E C IF IC A T IO N • C u r r e n t R a lr : lA m p LX! •Contact Rcsistancc : 30m £2 Max


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    UL94V-0) II-31 54nun trk ps Board to Board 2row 2.54mm PDF

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    Abstract: No abstract text available
    Text: 2114 SERIES □ur in PIN HEADER 2.0mmX2.0mm 0.079"X0.079" M aterial: Housing: 30% Glass filled PBT U L94V- 0. Contacts: Brass Plating: Gold plated: 5// over 50 // nickel. Tin plated: 150// over 70// nickel. E le c t r i c a l C h a r a c t e r i s t ic s :


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    5000M 100mA B0177S7 PDF

    UL940V-0

    Abstract: UL940V0 z003 USB MINI 5P
    Text: □upun 8969 Series Mini USB B Type 5P SMD F em a le S lim Type M aterial: Housing: 30% Glass filled LCP UL940v-0. Contacts: Phosphor Bronze Shell: Brass, Nickel Plated. Plating: Selective Gold Plated. E le c tr ic a l C h a r a c te r istic s: Current Rating: 1 AMP.


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    UL940v-0. 100Mnmin. 50mQmax. 100mA. 8969-B 30/tf* Z003Reel UL940V-0 UL940V0 z003 USB MINI 5P PDF

    UL940V-0

    Abstract: USB MINI 5P 8969-B
    Text: 8969 Series □upun Mini USB B Type 5P SMD F e m a le S lim Type M aterial: Housing: 30% Glass filled LCP UL940v-0. Contacts: Phosphor Bronze Shell: Brass, Nickel Plated. Plating: Selective Gold Plated. E le c tr ic a l C h a r a c te r istic s: Current Rating: 1 AMP.


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    UL940v-0. 100MQmin. 50mQmax. 100mA. 8969-B Z003ackage UL940V-0 USB MINI 5P PDF

    Untitled

    Abstract: No abstract text available
    Text: 2045 SERIES □upi in P.C.B. SOCKET 2.54mm 0.100" M aterial: Housing: 30% Glass filled PBT UL94V -0. Contocts: Phosphor Bronze. Plating: Gold plated: 5/1' over 50/1' nickel. Tin plated: 150/l! over 70j l ‘ nickel. E le c tr ic a l C h a r a c te r is tic s :


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    UL94V 150/l! 5000M 100mA PDF

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    Abstract: No abstract text available
    Text: 2047 SERIES □upk in ELEVATED P.C.B. SOCKET 2.54mmX2.54mm 0.100>/X0.100" M aterial: Housing: 30% Glass filled PBT U L94V -0. Contacts: Phosphor Bronze. Plating: Gold plated: 5/7 over 50/7 nickel. Tin plated: 150/7 over 70/7 nickel. E le c tr ic a l C h a r a c te r is tic s :


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    54mmX2 5000M 100mA 120pin PDF

    Untitled

    Abstract: No abstract text available
    Text: 2042 SERIES □upnn P.C.B. SOCKET 2.54mmX2.54mm 0.100"X 0.100" M ate ria l: Housing: 30% Glass filled PBT UL94V -0. Contacts: Phosphor Bronze. Plating: Gold plated: 5 / 1' over 50 / 1' nickel. Tin plated: 150 / 1' over 70 / 1' nickel. E le c t r ic a l C h a r a c te r is tic s :


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    54mmX2 UL94V 5000M 100mA PDF

    Untitled

    Abstract: No abstract text available
    Text: 10 TECHNICAL S P E C IF IC A T IO N S ; PART NUMBER TOOLED I- MATERIAL: HOUSING: LCP G.F. UL94V0 COLOR : BLACK TERMINAL : PHOSPHOR BRONZE PLATED WITH BASE FINISH: NICKEL CONTACT SURFACE FINISH: GOLD OR GOLD FLASH OVER PALLADIUM NICKEL EXCEEDS PRODUCT REQUIREMENTS BASED ON PS-85508-001


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    UL94V0 PS-85508-001 SD-85508-501_ PDF

    Untitled

    Abstract: No abstract text available
    Text: 2112 SERIES □upi in PIN HEADER 2.0mmX2.0mm 0.079"X0.079" M aterial: Housing: 30% Glass filled Contacts: Brass Plating: Gold plated: 5 1 50 1 / Tin plated: 1 PBT U L94V—0. ' / ' over 5 0 / ! ' nickel. over 70/T nickel. E le c t r i c a l C h a r a c t e r i s t ic s :


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    5000M 100mA 000004b PDF

    Untitled

    Abstract: No abstract text available
    Text: ECN, ERN NO. DATE P R O P O S AL T H IS M EC H AN IC AL SPEC IFICATIO N S: C ENTRE C ENTRE N IC K E L CONTACT: PLATED C APACITANCE: BRASS DIELECTRIC PH O S P H O R B R O N ZE , 1 0 julN C H E S [ 0 . 2 5 M IC R O N S ] GOLD PLATED BR ASS, TIN 1 0 ,0 0 0 pF


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: 2041 S e r ie s □upiin P.C.B. Socket 2.54m m 0.100” M aterial: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Gold plated over nickel. Tin plated over nickel. E le c tr ic a l C h a r a c te r is tic s: Current Rating: 1 AMP.


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    UL94V-0. 5000M0min. 20mnmax. 100mA. PDF

    Untitled

    Abstract: No abstract text available
    Text: 2 1 1 7 SERIES □umn BOX HEADER 2.0m m X2.0m m 0.079"X0.079" Material: Housing: 30% Glass filled PBT U L 9 4 V - 0 . C o n ta cts: Brass P lating: Gold plated: 5 ¡1' over 5 0 ¡ 1' nickel. Tin plated: 1 5 0 ^ ' over 70 /1' nickel. E le c tr ic a l C h a r a c te r is tic s :


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    UL94V-0. 5000M 100mA PDF

    Untitled

    Abstract: No abstract text available
    Text: REV. ECN NO. DATE A RELEASE Jun 2 4 ,2 0 0 4 B 0 4 *0 6 4 5 Jun 2 5 ,2 0 0 4 MATERIALS 1. HOUSING: H I.-TE M P .P LA S T IC U L 9 4 V -0 ,B L U E . 2. TERMINAL: COPPER A L L O Y .t= 0 .3 0 m m GOLD PLATED ON CONTACT AREA, TIN PLATED ON SOLDER TAIL, UNDER NICKEL PLATED.


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    4-40UNC 15PIN R1760015-064 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMA SERIES 10 & 15 WATTS C o a x ia l M ic r o w a v e 20 IN 0.645 1.25 1.88 1.90 1.97 2.00 MECHANICAL SPECIFICATIONS Nut Contact H ousing Insulator W eight as m CFT-10 SM ELECTRICAL SPECIFICATIONS Stainless Steel. Beryllium, Copper, Gold Plated. Aluminum,


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    CFT-10 CFT-15 PDF

    Untitled

    Abstract: No abstract text available
    Text: 2049 SERIES □ m kn P.C.B. SOCKET 2.5 4 m m 0 .1 0 0 " M aterial: H ousing: 30% Glass filled PBT UL94V— 0. C o n ta cts: P hospho r Bronze. P lating: Gold plated: 5 /I' over 5 0 /x nickel. Tin plated: 15 0 /i' over 70¡i nickel. E le c tric a l C h a r a c t e r is t ic s :


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    54mmX7 UL94V-0. 5000M 100mA PDF

    Untitled

    Abstract: No abstract text available
    Text: I FEATURES I • Specially designed to accept the ELK socket. ■ Standard 0.100" 2.54mm IC pitch, easy to mount in PC board. ■ All plastic are UL 94V-0 grade fire retardant. ■ Gold plated contact to ensure low contact resistance and long operation life.


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    ERC6246* ERC6286* ERC6326* ERC6406* ERC6486* PDF

    BA 5974

    Abstract: lm 14D
    Text: 5974 Series □ u p i in C e n tr o n ic C o n n e c to r S o ld e r Type M aterial: Housing: PET, UL94V-0 Rated. Contacts: Brci99. Plating:Selective gold plated on contact area nickel. Shell: Cold Roller Steel. E lectrica l C h aracteristics: Current Rating:! AMP.


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    UL94V-0 Brci99. 30m0rnax. BA 5974 lm 14D PDF

    AMP PBT connector

    Abstract: CENTRONIC 36 pin
    Text: 5973 Series □upi in C en tron ic C on n ector E ig h t Angle Type M aterial: Housing: PBT, UL94V-0 Rated. C ontacts: Phosphor Bronze. Platin g:Se le ctive gold plated on contact area nickel. Shell: Cold Roller Steel. E le c tric a l C h a ra c te r istic s:


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    UL94V-0 30mQmax. AMP PBT connector CENTRONIC 36 pin PDF

    Untitled

    Abstract: No abstract text available
    Text: 7902 SERIES □upi in SUM D-SUB RIGHT ANGLE TYPE M aterial: Housing: High tem pe ra ture housing U L94V -0 withstands IR and VPR soldering m ethods. Contacts: Phosphor Bronze. Plating: Selective Gold plated. E le c tr ic a l C h a r a c te r is tic s : Current Rating: 1 AMP.


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    5000M 100mA. 000011b PDF

    Untitled

    Abstract: No abstract text available
    Text: n 0.05" 0.05” j Pin Header 2 7mm Dual Row 06 to 100 Contact'' 0.4mm {0JJ157" Square Pori A P P L IC A T IO N AND l<05:>[} Scries FEATURES S P E C IF IC A T IO N S 1. Side stackable (on unbroken edges). 2. Variable pin length, gold or tin plated. 3 . Standoffs facilitate post solder cleaning.


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    0JJ157" 0057D 0055D 0055D PDF

    Untitled

    Abstract: No abstract text available
    Text: 7901 SERIES □upi in D-SUB I.D.C TYPE M aterial: Housing: 30% Gloss filled PBT U L94V -0. C ontacts: Phosphor Bronze. Plating: Gold plated. E le c t r i c a l C h a r a c t e r i s t ic s : Current Rating: 1 AMP. Insulator Resistance: 5000M 0 min. at DC 500V.


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    5000M 100mA. 50177S7 PDF