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    IC PITCH 0.3 LAND PATTERN Search Results

    IC PITCH 0.3 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MHM411-21 Murata Manufacturing Co Ltd Ionizer Module, 100-120VAC-input, Negative Ion Visit Murata Manufacturing Co Ltd
    SCL3400-D01-1 Murata Manufacturing Co Ltd 2-axis (XY) digital inclinometer Visit Murata Manufacturing Co Ltd
    D1U74T-W-1600-12-HB4AC Murata Manufacturing Co Ltd AC/DC 1600W, Titanium Efficiency, 74 MM , 12V, 12VSB, Inlet C20, Airflow Back to Front, RoHs Visit Murata Manufacturing Co Ltd
    SCC433T-K03-004 Murata Manufacturing Co Ltd 2-Axis Gyro, 3-axis Accelerometer combination sensor Visit Murata Manufacturing Co Ltd
    MRMS591P Murata Manufacturing Co Ltd Magnetic Sensor Visit Murata Manufacturing Co Ltd

    IC PITCH 0.3 LAND PATTERN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    00bc0w

    Abstract: BA50BC0FP ba50bc0 BA33BC0FP 18bc0w 50bc0w BA33BC0 33bc0w BA30BC0 ba60bc0
    Text: BA BC0 series Regulator ICs 1A Low-Dropout Voltage Regulator with Low Saturation BA BC0 series BA BC0 series offers a line of low saturation type regulators that can supply as low output current as 1A. The output voltage precision appears ±2%. By the lineup of output voltage, the package lineup of surface mounted TO252 and


    Original     		O220FP) 00bc0w BA50BC0FP ba50bc0 BA33BC0FP 18bc0w 50bc0w BA33BC0 33bc0w BA30BC0 ba60bc0 PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 • Features ● High density placing for digital signal circuits • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ҂ 1.6 mm ҂ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P PDF

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross PDF

    LA7687

    Abstract: SMD Transistor W01 Ceramic Resonator 7.99 LA7687 a 100S 16M0 MC68HC908JB8 TMP87C846N TMP87CM40AN CSAC MURATA
    Text: P16E12.pdf 01.5.29 This is the PDF file of catalog No.P16E-12 Ceramic Resonators CERALOCKr CERAMIC RESONATORS (CERALOCKr) Murata Manufacturing Co., Ltd. Cat.No.P16E-12 P16E12.pdf 01.5.29 This is the PDF file of catalog No.P16E-12 CONTENTS 1 CERALOCKr and "CERALOCK" in this catalog are


    Original     		P16E12 P16E-12 LA7687 SMD Transistor W01 Ceramic Resonator 7.99 LA7687 a 100S 16M0 MC68HC908JB8 TMP87C846N TMP87CM40AN CSAC MURATA PDF

    EXBA10E

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P EXBA10E PDF

    resistor exbd

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 • Features ● High density placing for digital signal circuits • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ҂ 1.6 mm ҂ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P resistor exbd PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 n Features l High density placing for digital signal circuits á Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch


    Original     		EXBE10C EXBA10P PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN PDF

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern PDF

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 PDF

    SMD Transistor W03

    Abstract: LA7687 CSTLA-T SMD Transistor W01 13001 TRANSISTOR JAPAN CXD3068Q CXD3068 CSTLS murata LA7687 a fb smd
    Text: Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested to approve our product specification or to transact the approval sheet for product specification, before your ordering. P16E13.pdf 02.3.7


    Original     		P16E13 P16E-13 SMD Transistor W03 LA7687 CSTLA-T SMD Transistor W01 13001 TRANSISTOR JAPAN CXD3068Q CXD3068 CSTLS murata LA7687 a fb smd PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    MARKING T6C

    Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
    Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change


    Original     		PX10051EJ35V0TN G0706 MARKING T6C lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 • Features ● High density placing for digital signal circuits • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm x 1.6 mm × 0.55 mm, 0.635 mm pitch


    Original     		RC-2130 PDF

    RESISTOR 0201 land

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 • Features ● High density placing for digital signal circuits • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm x 1.6 mm × 0.55 mm, 0.635 mm pitch


    Original     		RC-2130 EXBE10C EXBA10E EXBA10P RESISTOR 0201 land PDF

    Resistor dimensions 1206 to mm

    Abstract: RC-2130
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 • Features ● High density placing for digital signal circuits • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm ҂ 1.6 mm ҂ 0.55 mm, 0.635 mm pitch


    Original     		RC-2130 Resistor dimensions 1206 to mm RC-2130 PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 • Features ● High density placing for digital signal circuits • Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm x 1.6 mm × 0.55 mm, 0.635 mm pitch


    Original     		RC-2130 PDF