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    Infineon Technologies AG IGC142T120T6RHX1SA

    Trans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC142T120T6RHX1SA)
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    Avnet Americas IGC142T120T6RHX1SA Waffle Pack 26
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    IGC142T120T6RH Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    IGC142T120T6RH Infineon Technologies IGBT Chips; Package: --; Technology: IGBT 4 High Power; VDS (max): 1,200.0 V; IC (max): 150.0 A; VCE(sat) (max): 2.0 V; VGE(th) (min): 5.0 V; Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: IGC142T120T6RH IGBT4 High Power Chip FEATURES: • 1200V Trench + Field Stop technology • low VCEsat • soft turn off • positive temperature coefficient • easy paralleling Chip Type IGC142T120T6 RH VCE ICn 1200V 150A This chip is used for: • medium / high power modules


    Original     		PDF IGC142T120T6RH IGC142T120T6 L7693A,

    Untitled

    Abstract: No abstract text available
    Text: IGC142T120T6RH IGBT4 High Power Chip FEATURES: • 1200V Trench + Field Stop technology • low VCEsat • soft turn off • positive temperature coefficient • easy paralleling Chip Type VCE ICn IGC142T120T6RH 1200V 150A This chip is used for: • medium / high power modules


    Original     		PDF IGC142T120T6RH IGC142T120T6RH L7693A,

    Untitled

    Abstract: No abstract text available
    Text: IGC142T120T6RH IGBT4 High Power Chip FEATURES: • 1200V Trench + Field Stop technology • low VCEsat • soft turn off • positive temperature coefficient • easy paralleling Chip Type IGC142T120T6 RH VCE ICn 1200V 150A This chip is used for: • medium / high power modules


    Original     		PDF IGC142T120T6RH IGC142T120T6 L7693A,