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    Infineon Technologies AG IGC70T120T8RMX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC70T120T8RMX1SA1)
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    Avnet Americas IGC70T120T8RMX1SA1 Waffle Pack 20 Weeks 3,330
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    EBV Elektronik IGC70T120T8RMX1SA1 21 Weeks 1
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    Untitled

    Abstract: No abstract text available
    Text: IGC70T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench + Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications 1 Recommended for:


    Original     		PDF IGC70T120T8RM L7673U, L7673O,

    Untitled

    Abstract: No abstract text available
    Text: IGC70T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench + Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications 1 Recommended for:


    Original     		PDF IGC70T120T8RM L7673U, L7673O,

    IFS75B12N3E4

    Abstract: No abstract text available
    Text: IGC70T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench + Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications 1 Recommended for:


    Original     		PDF IGC70T120T8RM L7673U, L7673O, IFS75B12N3E4