SNW-EQ-611
Abstract: Statistical statistical process control PROCESS CONTROL EQUIPMENT QUALITY QLY001 quality control assurance and reliability
Text: DISCRETE SEMICONDUCTORS General Section Module Quality Module: QLY001_1 Quality Power Diodes 1998 Dec 07 Philips Semiconductors Power Diodes Quality • In-line Quality Assurance to monitor process reproducibility during manufacture - any corrective action is initiated as necessary. Process steps are under
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QLY001
SNW-EQ-611
Statistical
statistical process control
PROCESS CONTROL EQUIPMENT QUALITY
quality control assurance and reliability
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INCOMING RAW MATERIAL INSPECTION procedure
Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality
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Abstract: No abstract text available
Text: Philips Semiconductors Surface Mounted Semiconductors General QUALITY • In-line quality assurance to m onitor process reproducibility during m anufacture and initiate any necessary corrective action. C ritical process steps are 100% under statistical process control
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MBB439
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Abstract: No abstract text available
Text: Section 4 Quality Control and Reliability 4.1 Hitachi Diode Manufacturing Process and Quality Control Hitachi makes every possible effort to maintain the quality of its diodes from manufacturing to shipment, and pays strict attention to quality control in the production process. Meticulous care over each of the
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1500m/s
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PPAP level submission requirement table
Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
Text: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage
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in-process quality inspections
Abstract: process flow diagram
Text: 9 OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical and visual/mechanical
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foundry INCOMING MATERIAL INSPECTION procedure
Abstract: outgoing raw material inspection procedure INCOMING RAW MATERIAL INSPECTION form receiving inspection procedure
Text: Quality/Reliability Program You are in Databook Vol. 1 • Click for Main Menu Micrel Quality/Reliability Program 3. Our Philosophy Critical process-step monitoring Particulates Product quality and reliability are two of the most critical elements for achieving success in today’s semiconductor
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MIL-STD-883,
foundry INCOMING MATERIAL INSPECTION procedure
outgoing raw material inspection procedure
INCOMING RAW MATERIAL INSPECTION form
receiving inspection procedure
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receiving inspection procedure
Abstract: outgoing raw material inspection procedure INCOMING RAW MATERIAL INSPECTION method INCOMING MATERIAL INSPECTION procedure foundry INCOMING MATERIAL INSPECTION procedure
Text: Quality/Reliability Program You are in Databook Vol. 3 • Click for Main Menu Micrel Quality/Reliability Program 3. Our Philosophy Critical process-step monitoring Particulates Product quality and reliability are two of the most critical elements for achieving success in today’s semiconductor
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MIL-STD-883,
receiving inspection procedure
outgoing raw material inspection procedure
INCOMING RAW MATERIAL INSPECTION method
INCOMING MATERIAL INSPECTION procedure
foundry INCOMING MATERIAL INSPECTION procedure
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5962-8867001LA cypress
Abstract: INCOMING RAW MATERIAL INSPECTION procedure PALC22V10-25PI 5962-8867001LA Mil-Std-883 Wire Bond Pull Method 2011 cypress part marking CY7C122 PALC22V10 visual inspection of raw materials MIL-STD-883 Method 2010
Text: Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality and reliability. If you, the user, are not satisfied with every
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Abstract: No abstract text available
Text: VeriSens vision sensors Image-based quality control − easy and intuitive. Eyeing your quality. 2 Simply focused on the essentials. Baumer is a global leader in sensor solutions for factory and process automation. More than 2,300 employees in 38 subsidiaries in 19 countries are
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Abstract: No abstract text available
Text: Quality Assurance for Photodiodes Quality Assurance System Optoelectronics is a promising field that is seeing increasing devel opment. Hamamatsu opto-semiconductors have been extensively used in a variety of applications running from information process
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KPDC0013EA
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INCOMING MATERIAL INSPECTION procedure
Abstract: INCOMING FILM INSPECTION procedure
Text: Quality Assurance for Photodiodes Quality Assurance System Optoelectronics is a promising field that is seeing increasing devel opment. Hamamatsu opto-semiconductors have been extensively used in a variety of applications running from information process
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JIS-C7021
EIAJ-ED-4701
MIL-STD-750D
INCOMING MATERIAL INSPECTION procedure
INCOMING FILM INSPECTION procedure
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Sample form for INCOMING Inspection of RAW MATERIAL
Abstract: INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method Temic PART DATE CODE INCOMING IC INSPECTION MHS IC INCOMING RAW MATERIAL INSPECTION chart INCOMING IC INSPECTION,
Text: Quality Flows Digital IC Products Quality Flows This document presents the flows used in manufacturing and screening of TEMIC Digital IC Processors, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under
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MIL-883
Sample form for INCOMING Inspection of RAW MATERIAL
INCOMING RAW MATERIAL INSPECTION procedure
INCOMING RAW MATERIAL INSPECTION
INCOMING RAW MATERIAL INSPECTION form
INCOMING RAW MATERIAL INSPECTION method
Temic PART DATE CODE
INCOMING IC INSPECTION
MHS IC
INCOMING RAW MATERIAL INSPECTION chart
INCOMING IC INSPECTION,
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INCOMING RAW MATERIAL INSPECTION method
Abstract: Sample form for INCOMING Inspection of RAW MATERIAL INCOMING RAW MATERIAL INSPECTIONs INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION chart SCC20500
Text: Quality Flows Digital IC Products Quality Flows This document presents the flows used in manufacturing and screening of TEMIC Digital IC Processors, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under
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MIL-STD-105D
Abstract: "Hitachi Diode" HITACHI DIODE photolithography
Text: Hitachi Diode Manufacturing Process and Quality Control Hitachi makes every possible effort to maintain the q u a lity o f its d io d e s fro m m a n u fa c tu rin g to sh ip m en t, and pays stric t a tte n tio n to q u a lity control in the production process. M eticulous care
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-105D
MIL-STD-105D
"Hitachi Diode"
HITACHI DIODE
photolithography
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defect ppm sampling
Abstract: marking 209e 209E wafer fab control plan 002 209e metals quality MANUALS
Text: CHAPTER 3 PROCESS CONTROL “Emphasis is on defect prevention so that routine inspection will not be needed to a large extent. The burden of quality proof lies not with inspection but with the makers of the part.” Armand V. Feigenbaum In SGS-THOMSON the term “Process Control”
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Abstract: No abstract text available
Text: B u m jE R PROGRAM GUARANTED CONTINUOUS PROCESS IMPROVEMENT is at the heart of Mini-Circuits Partner Program Your long term business allows us to invest in improved production procedures. As a result, we can continually improve quality, shorten delivery tim es and low er the costs of production.
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Abstract: No abstract text available
Text: •AMI Quality Program AMERICAN MICROSYSTEMS, INC. General Information August 1996 Introduction QA Operations checks all phases of the manufacturing process, including incoming materials, to insure adherence to specifications and procedures through the use of audits, inspections, and other monitoring
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MIL-I38535,
MIL-STD-883,
MIL-Q-9858
MIL-M-38510,
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Abstract: No abstract text available
Text: Quality General Semiconductor’s Quality Assurance and Reliability System Quality Control of Outgoing Products Although the quality and reliability is “built into” the products during products development and production, it is also verified by inspections.
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INCOMING RAW MATERIAL INSPECTION method
Abstract: INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTIONs in-process quality inspections in-coming quality control quality acceptance plan MIL-STD-883 method 2003
Text: QUALITY AND RELIABILITY QUALITY SYSTEM Product quality at Dallas Semiconductor results from a combination of design techniques, vendor controls, manufacturing methods, process monitors, and quality control inspections. SPC monitors placed at strategic points ensure that potential defects are detected
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INCOMING RAW MATERIAL INSPECTIONs
Abstract: INCOMING RAW MATERIAL INSPECTION in-process quality inspections mil-std-883 INCOMING RAW MATERIAL INSPECTION method MIL-STD-883 method 2003 in-coming quality control INCOMING RAW MATERIAL process flow
Text: QUALITY AND RELIABILITY QUALITY SYSTEM Product quality at Dallas Semiconductor results from a combination of design techniques, vendor controls, manufacturing methods, process monitors, and quality control inspections. SPC monitors placed at strategic points ensure that potential defects are detected
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PWR700A
Abstract: PWR700A/H PWR700A/T
Text: QUALITY ASSURANCE & RELIABILITY All Burr-Brown DC/DC converters are manufactured using stringent inprocess controls and quality inspections. Internal Quality Assurance Pro grams use the guidelines set forth in MIL-I-45208A, Inspection System Requirements. Each lot is fully traceable to incoming materials.
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MIL-I-45208A,
PWR700A
MIL-HDBK-217
PWR700A
PWR700A/H
PWR700A/T
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Untitled
Abstract: No abstract text available
Text: Reliability and Quality Assurance 1. Views on Quality and Reliability Hitachi’s basic quality aims are to meet individual user’s purchase purpose and quality required, and to be at a satisfactory quality level considering general marketability. Quality required by users is
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Text: Reliability and Q u ality A ssu ran ce 1. View s on Quality and R eliability Hitachi's basic quality aims are to m eet indi vidual user's purchase purpose and quality required, and to be at a satisfactory quality level considering general marketability.
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